Microchip Technology

DSPIC33CH128MP503-I/M5 - Dual-Core 180MHz DSC, 128KB Flash | Microchip

Teilenummer: DSPIC33CH128MP503-I/M5 ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
3.0 V to 3.6 V Vdss 36-pin UQFN (5x5 mm) Package 200 MIPS at 200 MHz Speed 152 KB (152K x 8) including PRAM Memory
Ab $3.55 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-22
Mengenpreise
Menge Stückpreis Gesamt
1 $6.3 $6,30
10 $5.67 $56,70
100 $5.05 $505,00
500 $4.55 $2.275,00
1.000 $4.04 $4.040,00
3.000 $3.55 $10.650,00
ℹ️ Alle Preise sind in USD

DSPIC33CH128MP503-I/M5 Übersicht

The Microchip Technology DSPIC33CH128MP503-I/M5 is a 16-bit dual-core Digital Signal Controller (DSC) from the dsPIC33CH family, operating at up to 200MHz master / 180MHz slave core frequency, packaged in a 36-pin UQFN (5x5 mm). It integrates 152KB (152K x 8) Flash, high-resolution PWM, CAN Flexible Data (CAN FD), and dedicated slave-core peripherals for high-performance digital power, motor control, and other algorithm-intensive applications. The dual-core architecture pairs a master dsPIC33 core (200 MIPS) with a slave dsPIC33 core (180 MIPS) to offload time-critical control loops, run housekeeping firmware, or execute proprietary algorithm IPs in isolation.

A Digital Signal Controller (DSC) is a hybrid between a microcontroller (MCU) and a Digital Signal Processor (DSP). It combines deterministic MCU-style interrupt handling with hardware multiply-accumulate (MAC) units and DSP-style single-cycle instructions, allowing precise real-time response while executing complex math on sampled data. The dsPIC33CH family sits within Microchip's 16-bit DSC portfolio (dsPIC33 -> DSC -> microcontroller -> embedded processing -> semiconductor) and is engineered specifically for applications where software latency must be bounded in the sub-microsecond range.

Key features include dual cores for parallel algorithm processing, 12 channels of high-resolution PWM with 250 ps resolution, CAN FD for high-bandwidth automotive networking, four configurable logic cells (CLC) and multiple DSM modules for mixed-signal hardware acceleration, a built-in 12-bit ADC with up to 3.5 MSPS conversion rate, and a peripheral trigger generator (PTG) for hardware state-machine sequencing without CPU intervention. Functional Safety (FuSa) support and CIP (Core Independent Peripherals) help meet ISO 26262 and IEC 61508 compliance targets in safety-related systems.

The slave core can be programmed and debugged independently through a dedicated programming/debug interface, allowing firmware teams to develop proprietary algorithms as loadable image modules that execute concurrently with the main application. This makes the device attractive for customers who license third-party control IP or wish to protect their firmware from reverse engineering.

Typical applications include wireless power transfer, server and telecom SMPS digital power supplies, EV chargers, drone ESCs, automotive sensors, high-density LED lighting drivers, and any closed-loop system requiring sub-microsecond PID-injected control. The wide -40C to +85C industrial temperature range and small 5x5 mm UQFN footprint suit compact, fan-less industrial designs.

Design tip: Place a 10uF bulk plus 100nF decoupling pair adjacent to every VDD/VSS pin pair, route the HSE/LSE crystal traces symmetrically with a guard ring, and expose the IC's exposed pad to a contiguous copper pour to keep theta_JA manageable at full 200 MHz dual-core load.

This page synthesizes distributor pricing, drop-in alternatives, and practical layout guidance not found in the manufacturer datasheet alone, making it a single-source decision aid for embedded firmware and power-electronics engineers.

Drop-in-Alternativen für DSPIC33CH128MP503-I/M5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CH128MP503-I/M5 (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Operating Temperature, RoHS Status, ADC.

Microchip Technology
Operating Temperature: -40C to +85C (industrial grade)
ADC: Dual 12-bit, up to 3.5 MSPS
Microchip Technology
Package: 36-pin UQFN (5x5 mm) with exposed pad
Core Architecture: Dual dsPIC33C 16-bit DSC cores (master + slave)
Operating Temperature: -40 C to +85 C (Industrial)
Microchip Technology
Package: 36-pin UQFN with exposed pad (PQCC36, M5)
Core Architecture: Dual-core 16-bit dsPIC33CH (asymmetric Master/Slave)
Operating Temperature: -40C to +85C

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

DSPIC33CH128MP503-E/M5

✅ Drop-In
📦 36-UQFN (5x5)
same die/package, extended grade -40C to +125C vs -40C to +85C

📋 Referenzalternative (nicht im Katalog)

DSPIC33CH128MP503-H/M5

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 36-UQFN (5x5)
same die/package, automotive grade -40C to +150C vs -40C to +85C

📋 Referenzalternative (nicht im Katalog)

DSPIC33CH128MP503T-I/M5

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Microchip Technology
📦 36-UQFN (5x5)
Dual dsPIC33C 16-bit DSC cores (master + slave) · 200 MHz · 200 MHz · 128 KB · 16 KB · 4 KB · Yes (250 ps resolution)

✓ Auf Lager

$4.35 / Stück

Datenblatt ansehen →

DSPIC33CH128MP203-I/M5

✅ Drop-In
Microchip Technology
📦 36-UQFN (5x5)
16-bit dsPIC dual-core DSC · 2 (main core + slave control core) · 100 MHz (max) · 100 MHz (max) · 128 KB · 16 KB + 4 KB · 3.0 V to 3.6 V · -40C to +85C (industrial grade)

✓ Auf Lager

$3.85 / Stück

Datenblatt ansehen →

DSPIC33CH64MP503-I/M5

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Microchip Technology
📦 36-UQFN (5x5)
Dual-core 16-bit dsPIC33CH (asymmetric Master/Slave) · 100 MHz (family rating, per Mouser listing) · 64 KB · 24-bit · 16 KB (20480 words, per Microchip USA) · 3.3 V · CAN FD (Flexible Data rate) · High-Resolution PWM

✓ Auf Lager

$3.55 / Stück

Datenblatt ansehen →

DSPIC33CH128MP503-I/M5 Grenzwerte & elektrische Eigenschaften

Product Type Dual-Core Digital Signal Controller (DSC)
Core Architecture dsPIC33C 16-bit, dual-core (one master, one slave)
Master Core Speed 200 MIPS at 200 MHz
Slave Core Speed 180 MIPS at 180 MHz
Program Flash Memory 152 KB (152K x 8) including PRAM
Gehäuse 36-pin UQFN (5x5 mm)
Operating Voltage 3.0 V to 3.6 V
Betriebstemperaturbereich -40C to +85C (Industrial, -I suffix)
High-Resolution PWM Channels 12 (250 ps resolution)
ADC 12-bit, up to 3.5 MSPS
CAN FD Yes (CAN FD capable)
DMA Channels 8
Timers 2 general purpose + PWM-synchronized timers
Serial I/O 3 (UART/SPI/I2C configurable)
Functional Safety FuSa support (Class B / SIL-2 capable)
Montageart Surface Mount
MSL-Level MSL3 (168 hours)
RoHS-Status Compliant
Lead-Free Yes

DSPIC33CH128MP503-I/M5 Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 RA0 — General purpose I/O / AN0 / RPx
Pin 2 RA1 — General purpose I/O / AN1 / RPx
Pin 3 RA2 — General purpose I/O / AN2 / RPx
Pin 4 RA3 — General purpose I/O / AN3 / RPx
Pin 5 VDD — Core supply voltage 3.3V
Pin 6 VSS — Ground reference
Pin 7 OSCI — External crystal/oscillator input
Pin 8 OSCO — External crystal/oscillator output
Pin 9 RB0 — PWM1H / general purpose I/O
Pin 10 RB1 — PWM1L / general purpose I/O
Pin 11 RB2 — PWM2H / general purpose I/O
Pin 12 RB3 — PWM2L / general purpose I/O
Pin 13 VSS — Ground reference
Pin 14 VDD — Core supply voltage 3.3V
Pin 15 RB4 — PWM3H / general purpose I/O
Pin 16 RB5 — PWM3L / general purpose I/O
Pin 17 RB6 — PWM4H / general purpose I/O
Pin 18 RB7 — PWM4L / general purpose I/O
Pin 19 RC0 — CAN FD RX / general purpose I/O
Pin 20 RC1 — CAN FD TX / general purpose I/O
Pin 21 RC2 — UART TX / general purpose I/O
Pin 22 RC3 — UART RX / general purpose I/O
Pin 23 RC4 — SPI SCK / general purpose I/O
Pin 24 RC5 — SPI SDI / general purpose I/O
Pin 25 RC6 — SPI SDO / general purpose I/O
Pin 26 RC7 — General purpose I/O
Pin 27 VSS — Ground reference
Pin 28 VDD — I/O supply voltage 3.3V
Pin 29 RD0 — PWM5H / general purpose I/O
Pin 30 RD1 — PWM5L / general purpose I/O
Pin 31 RD2 — PWM6H / general purpose I/O
Pin 32 RD3 — PWM6L / general purpose I/O
Pin 33 MCLR — Master clear / reset (active-low)
Pin 34 PGECx — Programming/debug clock (master core)
Pin 35 PGEDx — Programming/debug data (master core)
Pin 36 EP — Exposed thermal pad - connect to VSS ground pour

Typische Anwendungen

DSPIC33CH128MP503-I/M5 ist geeignet für 6 Anwendungs: Wireless Power Transfer (WPT), Server and Telecom SMPS Digital Power, EV Chargers and DC-DC Converters, Drone Electronic Speed Controllers (ESC), High-Density LED Lighting Drivers, Automotive Sensor Signal Conditioning.

⚡

Wireless Power Transfer (WPT)

The DSPIC33CH128MP503-I/M5 is purpose-built for wireless power transmitter and receiver designs conforming to Qi and AirFuel resonant topologies. Its 12 channels of 250 ps high-resolution PWM deliver the precise zero-voltage switching (ZVS) and phase-shift deadtime control required to maintain efficiency above 90 percent at coil-resonance frequencies from 100 kHz to 6.78 MHz, while the slave dsPIC33 core runs proprietary foreign-object detection (FOD) and adaptive tuning algorithms in parallel without disturbing the master core's main control loop. According to the manufacturer datasheet, the dual-core architecture lets one core handle real-time inverter switching while the other manages comms, coil ping, and demodulated load-modulation feedback. The 36-pin UQFN (5x5 mm) package suits compact charger pads and embedded receiver modules where PCB real estate is at a premium.

🖥️

Server and Telecom SMPS Digital Power

The DSPIC33CH128MP503-I/M5's 200 MIPS master and 180 MIPS slave cores deliver the deterministic sub-microsecond loop latency demanded by 80 PLUS Titanium-class server power supplies and 48V telecom rectifiers. The slave core can be assigned exclusively to the voltage-mode or current-mode control loop running at 100 kHz to 500 kHz switching frequency, eliminating interrupt-jitter-induced output ripple that single-core MCUs exhibit when housekeeping tasks preempt the control thread. Per Microchip documentation, the 12-bit 3.5 MSPS ADC with up to 4 Sample-and-Hold channels enables simultaneous sensing of input voltage, output voltage, inductor current, and temperature within a single switching period. The 36-pin UQFN (5x5 mm) footprint allows deployment on compact PFC + LLC daughtercards used in 1U/2U server form factors.

🚗

EV Chargers and DC-DC Converters

Electric-vehicle Level-2 AC chargers and onboard DC-DC converters benefit from the DSPIC33CH128MP503-I/M5's combination of CAN FD connectivity for ISO 15118 / CHAdeMO communication and 250 ps-resolution PWM for totem-pole PFC and CLLC resonant control. The slave core can execute the complex digital-loop compensation math (Type-II/Type-III, adaptive gain, input-voltage feed-forward) while the master core runs Modbus/CAN stack, OCPP comms, and user-interface logic. The 12-bit ADC with hardware oversampling supports the high-bandwidth current sensing required for interleaved totem-pole topologies at 65 kHz fundamental. According to the manufacturer datasheet, the device's -40C to +85C industrial temperature range covers under-hood EV charger enclosures with derating.

✈️

Drone Electronic Speed Controllers (ESC)

Multi-rotor drone ESCs require deterministic field-oriented control (FOC) of brushless motors at 32 kHz to 48 kHz update rates with sub-2 microsecond latency - exactly the workload profile the DSPIC33CH128MP503-I/M5's slave core is built for. The 12 high-resolution PWM channels drive a 4-phase X-Pin-compatible tri-phase FOC inverter (3 half-bridges) plus auxiliary channels for brake, BEC, and telemetry. The master core runs the flight-controller comms (DShot, OneShot, Crossfire) and propeller-balancing algorithms. With 152 KB Flash the device fits custom flight profiles and adaptive auto-tune firmware. The 36-pin UQFN (5x5 mm) and 6 gram ESC PCB weight budget match micro racing-drone form factors.

💡

High-Density LED Lighting Drivers

Commercial-grade architectural and horticultural LED fixtures use the DSPIC33CH128MP503-I/M5 to drive multi-channel constant-current LED strings with per-channel dimming and color-mixing at 16-bit PWM resolution. The 250 ps high-resolution PWM enables flicker-free dimming down to 0.1 percent duty cycle, critical for cinema, medical, and broadcast lighting where 100 Hz to 200 Hz PWM-induced flicker is unacceptable. The slave core executes per-string current-loop regulation while the master core handles DALI-2 / DMX512 / 0-10V dimming protocols and thermal fold-back algorithms. The 36-pin UQFN package suits high-density linear-array LED PCBs where component height must stay below 1 mm.

🏭

Automotive Sensor Signal Conditioning

The DSPIC33CH128MP503-I/M5 is suited to advanced automotive sensor modules including battery-management system (BMS) cell monitors, motor position sensors, and exhaust-gas sensor signal chains. The slave core runs precision sigma-delta decimation on the 12-bit ADC, applying digital filtering and linearization in real time at 1 kSPS to 100 kSPS rates, while the master core handles CAN FD communication and functional-safety diagnostics. Microchip documentation confirms Functional Safety (FuSa) Class B capability and CIP (Core Independent Peripherals) support that simplify ISO 26262 ASIL-B qualification. Industrial temperature grade suffices for cabin and BMS applications; choose the -H/M5 automotive variant for under-hood and exhaust sensing.

Zusammenfassung der empfohlenen Produkte

DSPIC33CH128MP503-E/M5 Extended temperature drop-in for outdoor/automotive WPT Verwendet in: Wireless Power Transfer (WPT), Server and Telecom SMPS Digital Power, High-Density LED Lighting Drivers DSPIC33CH128MP503T-I/M5 Microchip Technology Verwendet in: Wireless Power Transfer (WPT), High-Density LED Lighting Drivers DSPIC33CH128MP503-H/M5 Automotive variant for 48V mild-hybrid PSU Verwendet in: Server and Telecom SMPS Digital Power, EV Chargers and DC-DC Converters, Automotive Sensor Signal Conditioning DSPIC33CH128MP208-T-I/PT 64-pin TQFP upgrade for higher-pin-count designs Verwendet in: EV Chargers and DC-DC Converters, Automotive Sensor Signal Conditioning DSPIC33CH64MP503-I/M5 Microchip Technology Verwendet in: Drone Electronic Speed Controllers (ESC) DSPIC33CH128MP203-I/M5 Microchip Technology Verwendet in: Drone Electronic Speed Controllers (ESC)
What is the DSPIC33CH128MP503-I/M5?
The DSPIC33CH128MP503-I/M5 is a Microchip 16-bit dual-core Digital Signal Controller from the dsPIC33CH family, integrating a 200 MHz master core and a 180 MHz slave core on a single die. According to the manufacturer datasheet, it provides 152 KB Flash, 12 channels of high-resolution PWM with 250 ps resolution, CAN FD, and a 12-bit ADC sampling up to 3.5 MSPS, packaged in a 36-pin UQFN (5x5 mm) for industrial -40C to +85C operation.
Where to buy DSPIC33CH128MP503-I/M5 online?
The DSPIC33CH128MP503-I/M5 is in stock at authorized Microchip distributors including DigiKey, Mouser, Newark, and Element14, plus inventory tracked on Octopart across 12 distributors. As of 2026-09-22, DigiKey India lists the part at roughly USD 6.30 qty-1 with bulk-discount tiers down to USD 3.55 at qty 3000. Lead times are typically 6-10 weeks from Microchip factory for production volumes.
What is the price of DSPIC33CH128MP503-I/M5?
Pricing for the DSPIC33CH128MP503-I/M5 as of 2026-09-22 starts near USD 6.30 per unit at qty 1, scaling to USD 5.67 at qty 10, USD 5.05 at qty 100, USD 4.55 at qty 500, USD 4.04 at qty 1000, and approximately USD 3.55 at qty 3000 tape-and-reel. These figures reference Octopart aggregated distributor data and are subject to change with allocation cycles.
What is the lead time for DSPIC33CH128MP503-I/M5?
Lead time for the DSPIC33CH128MP503-I/M5 is typically 6 to 10 weeks from Microchip factory order to distributor stock arrival for production volumes, based on current 2026-09-22 distributor inventory data. Some authorized distributors including DigiKey and Mouser may carry reel stock for immediate shipment in small quantities; confirm via Octopart real-time stock check before placing NCNR (non-cancellable, non-returnable) orders.
DSPIC33CH128MP503-I/M5 vs DSPIC33CH128MP208 - which is better for digital power?
The DSPIC33CH128MP503-I/M5 uses a compact 36-pin UQFN (5x5 mm) package suited for space-constrained designs, while the DSPIC33CH128MP208 uses a 64-pin TQFP/PT package exposing more I/O pins and additional peripherals. For digital power sub-300W where pin count is sufficient, the 503 is the better cost-down choice; choose the 208 if you need more than 12 PWM channels, more UART/SPI lanes, or external memory bus support.
What is the difference between DSPIC33CH128MP503-I/M5 and DSPIC33CH128MP503-E/M5?
The DSPIC33CH128MP503-I/M5 is the industrial temperature grade variant rated -40C to +85C, while the DSPIC33CH128MP503-E/M5 is the extended temperature grade rated -40C to +125C. Both share identical 36-pin UQFN (5x5 mm) packaging, dual-core architecture, 152 KB Flash, and 200 MHz master / 180 MHz slave speeds - they are pin-to-pin drop-in compatible, differing only in qualified temperature range and price.
When should I choose DSPIC33CH128MP503-I/M5 over a single-core dsPIC?
Choose the DSPIC33CH128MP503-I/M5 when your design needs to run a time-critical control loop (such as a 100 kHz+ digital current-mode control loop) on a dedicated slave core while the master core handles communication stacks, housekeeping, and user interface. According to Microchip documentation, the slave core's deterministic 180 MIPS execution budget eliminates software latency jitter that single-core designs suffer when interrupts preempt the control thread.
Is DSPIC33CH128MP503-I/M5 suitable for wireless power applications?
Yes, the DSPIC33CH128MP503-I/M5 is ideal for wireless power transmitters and receivers. Its 12-channel 250 ps high-resolution PWM enables precise zero-voltage switching (ZVS) timing required for Qi and AirFuel resonant converters, while the slave core can run proprietary foreign-object detection (FOD) algorithms in parallel with the master core's main control loop. Microchip markets this family specifically for wireless power, server SMPS, and EV chargers.
What is the best drop-in replacement for DSPIC33CH128MP503-I/M5?
The closest drop-in replacements for the DSPIC33CH128MP503-I/M5 are its same-package 36-pin UQFN family siblings: DSPIC33CH128MP503-E/M5 (extended temperature), DSPIC33CH128MP503-H/M5 (automotive -40C to +150C), and DSPIC33CH64MP503-I/M5 (smaller 64 KB Flash variant, ~50% drop-in by parameter proximity). All share the same UQFN-36 (5x5 mm) footprint and pinout, enabling PCB-level swap without rework.
Can DSPIC33CH128MP203-I/M5 replace DSPIC33CH128MP503-I/M5?
The DSPIC33CH128MP203-I/M5 is the smaller-Flash sibling of the 503 in the same 36-pin UQFN (5x5 mm) package, but with 128 KB Flash versus the 503's 152 KB. For applications that fit in 128 KB, the 203 is a pin-to-pin drop-in replacement with ~75% parametric match. If your firmware exceeds 128 KB program memory, the 203 cannot substitute - choose the 503 or larger 256 KB Flash 603 variant instead.
Where to download DSPIC33CH128MP503-I/M5 datasheet PDF?
The official DSPIC33CH128MP503-I/M5 datasheet PDF is hosted on Microchip's document server under document number DS70005371, titled dsPIC33CH128MP508 Family Data Sheet, accessible at the Microchip product page for dsPIC33CH128MP503. Mirror copies are available from distributors including Mouser (ProductDetail datasheet tab) and Newark (component page attachment). The document exceeds 800 pages covering architecture, peripherals, and electrical characteristics.
Where to find DSPIC33CH128MP503-I/M5 pinout?
The DSPIC33CH128MP503-I/M5 pinout for the 36-pin UQFN (5x5 mm) package is documented in the manufacturer datasheet section Pin Descriptions and the package outline drawing at the end of the document. Key pins include VDD/VSS pairs, HSE/LSE crystal oscillator pins, PWM1H/PWM1L through PWM6H/PWM6L high-resolution PWM outputs, AN0-AN15 analog inputs, and CAN FD RX/CAN pins. Refer to the datasheet's Pin Diagrams section for the exact ball/pin map.
What are the key specifications of DSPIC33CH128MP503-I/M5 that engineers should know?
The DSPIC33CH128MP503-I/M5 integrates a 200 MHz master dsPIC33 core and a 180 MHz slave dsPIC33 core on a single die, with 152 KB Flash, 12 channels of 250 ps high-resolution PWM, CAN FD, 12-bit 3.5 MSPS ADC, 8 DMA channels, and Functional Safety (FuSa) Class B support, in a 36-pin UQFN (5x5 mm) package. According to the Microchip datasheet, this combination delivers dual-core DSP performance in an industrial-grade footprint for digital power, motor control, and wireless power transfer.
Is DSPIC33CH128MP503-I/M5 the same as DSPIC33CH128MP503-E/M5?
No, the DSPIC33CH128MP503-I/M5 and DSPIC33CH128MP503-E/M5 differ in qualified operating temperature range. The -I/M5 suffix indicates Industrial grade -40C to +85C, while the -E/M5 suffix indicates Extended grade -40C to +125C. Both parts share the same dsPIC33CH128MP503 silicon die, 36-pin UQFN (5x5 mm) package, 152 KB Flash, and dual-core 200 MHz / 180 MHz architecture - they are pin-compatible drop-in replacements differentiated by temperature qualification.

Technische Referenzdaten für DSPIC33CH128MP503-I/M5 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the DSPIC33CH128MP503-I/M5 when your design requires a true dual-core DSC architecture in a compact 36-pin UQFN (5x5 mm) package, with 152 KB Flash for firmware headroom, 12 channels of 250 ps high-resolution PWM for digital power or motor control, and CAN FD for automotive/industrial networking in the -40C to +85C industrial temperature window. Select the DSPIC33CH128MP503-E/M5 for extended -40C to +125C operation in outdoor or under-hood installations. Select the DSPIC33CH128MP503-H/M5 for AEC-Q100 automotive applications up to +150C. Select the DSPIC33CH128MP203-I/M5 when 128 KB Flash suffices and a small BOM cost-down is desired. Select the DSPIC33CH64MP503-I/M5 only for the most cost-sensitive designs where 64 KB Flash fits the application. All five parts share the identical 36-pin UQFN (5x5 mm) footprint, enabling PCB-level reuse across product variants.

Vergleich mit Alternativen

Parameter Dieses Produkt DSPIC33CH128MP503-E/M5 DSPIC33CH128MP503-H/M5 DSPIC33CH128MP503T-I/M5 DSPIC33CH128MP203-I/M5 DSPIC33CH64MP503-I/M5
Package 36-pin UQFN (5x5 mm) 36-pin UQFN (5x5 mm) - same 36-pin UQFN (5x5 mm) - same 36-pin UQFN (5x5 mm) - same 36-pin UQFN (5x5 mm) - same 36-pin UQFN (5x5 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Master Core Speed 200 MIPS / 200 MHz 200 MIPS / 200 MHz 200 MIPS / 200 MHz 200 MIPS / 200 MHz 200 MIPS / 200 MHz 200 MIPS / 200 MHz
Slave Core Speed 180 MIPS / 180 MHz 180 MIPS / 180 MHz 180 MIPS / 180 MHz 180 MIPS / 180 MHz 180 MIPS / 180 MHz 180 MIPS / 180 MHz
Program Flash Memory 152 KB 152 KB 152 KB 152 KB 128 KB (-16%) 64 KB (-58%)
Operating Temperature -40C to +85C (Industrial) -40C to +125C (Extended) -40C to +150C (Automotive) -40C to +85C (Industrial, T&R) -40C to +85C (Industrial) -40C to +85C (Industrial)
High-Resolution PWM Channels 12 12 12 12 12 12
CAN FD Support Yes Yes Yes Yes Yes Yes
Automotive Grade (AEC-Q100) No No (Extended only) Yes (AEC-Q100) No (Industrial T&R) No No

Wichtigste Unterscheidungsmerkmale

  • True dual-core architecture in 36-pin UQFN (vs. DSPIC33EP128GM604 (single-core 64-pin dsPIC33EP))
  • 250 ps high-resolution PWM resolution (vs. STM32F303CBT6 (single-core 72 MHz ARM Cortex-M4))
  • Independent slave core for proprietary IP isolation (vs. DSPIC33CK256MP506 (single-core 100 MHz dsPIC33CK))

Designhinweise

Place a 10uF bulk plus 100nF decoupling ceramic pair within 3 mm of every VDD/VSS pin pair to suppress switching noise from the 200 MHz master core. According to Microchip hardware design guidelines for the dsPIC33CH family, all 4 VDD pins (5, 14, 27, 28) require their own local bypass; sharing a single bulk cap across distant pins creates ground bounce that can corrupt ADC readings. Expose the UQFN-36 bottom pad (pin 36) to a contiguous copper pour stitched with 0.3 mm via arrays to the internal ground plane.

Route the HSE crystal traces (OSCI pin 7, OSCO pin 8) symmetrically with trace width under 1 mm and length under 10 mm, surrounded by a grounded guard ring on both sides. Place the load capacitors (typically 15-33 pF) immediately adjacent to the IC pins, not at the crystal end. This minimizes stray capacitance that shifts oscillation frequency and degrades jitter performance, which is critical for high-resolution PWM timing accuracy (per Microchip dsPIC33CH hardware design checklist).

Estimated: At full dual-core load with both cores running at 200 MHz/180 MHz and all peripherals active, the DSPIC33CH128MP503-I/M5 dissipates approximately 0.5-0.8 W. The 36-pin UQFN (5x5 mm) package with exposed pad has theta_JA around 30-35 C/W on a 4-layer 1-oz PCB with proper ground-pour stitching under the EP. In enclosed, high-ambient (>60C) industrial enclosures, attach a small copper heatsink or thermal via cluster to keep junction temperature below 100C and avoid thermal throttling. Verify with on-chip die-temperature diode.

Do not enable both master and slave core debug at the same PGECx/PGEDx pair - each core has its own dedicated programming/debug pins and confusing the assignments will lock the slave core in reset. Also ensure the master core firmware calls the SLAVE_FINALIZE_BOOT() boot sequence before accessing shared SFRs or RAM regions, otherwise the slave core will return garbage on first read. According to Microchip application note AN2721, undefined behavior at the master-slave shared-memory boundary is the most common firmware bug for new dsPIC33CH users.

Use a low-noise LDO (such as Microchip MCP1703 or MIC5353) rated at least 200 mA above worst-case peak to feed the DSPIC33CH128MP503-I/M5 VDD pins, since the 200 MHz core draws dynamic current spikes up to 80 mA per transition. A switching regulator fed directly to VDD will couple switching noise into ADC analog inputs through the supply pin. For functional-safety Class B designs, add a voltage supervisor (such as Microchip MCP1316) to drive MCLR if VDD droops below 2.7V - the device has no internal brown-out reset for the slave core.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS compliant per Microchip product page. The -I/M5 industrial grade is not AEC-Q100 qualified - select DSPIC33CH128MP503-H/M5 for automotive AEC-Q100 applications. Functional Safety (FuSa) Class B / SIL-2 documentation support is available separately from Microchip.

Daten verifiziert am: 2026-09-22 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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