DSPIC33CH128MP503-I/M5 - Dual-Core 180MHz DSC, 128KB Flash | Microchip
Référence : DSPIC33CH128MP503-I/M5 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.3 | $6,30 |
| 10 | $5.67 | $56,70 |
| 100 | $5.05 | $505,00 |
| 500 | $4.55 | $2 275,00 |
| 1 000 | $4.04 | $4 040,00 |
| 3 000 | $3.55 | $10 650,00 |
DSPIC33CH128MP503-I/M5 Présentation
A Digital Signal Controller (DSC) is a hybrid between a microcontroller (MCU) and a Digital Signal Processor (DSP). It combines deterministic MCU-style interrupt handling with hardware multiply-accumulate (MAC) units and DSP-style single-cycle instructions, allowing precise real-time response while executing complex math on sampled data. The dsPIC33CH family sits within Microchip's 16-bit DSC portfolio (dsPIC33 -> DSC -> microcontroller -> embedded processing -> semiconductor) and is engineered specifically for applications where software latency must be bounded in the sub-microsecond range.
Key features include dual cores for parallel algorithm processing, 12 channels of high-resolution PWM with 250 ps resolution, CAN FD for high-bandwidth automotive networking, four configurable logic cells (CLC) and multiple DSM modules for mixed-signal hardware acceleration, a built-in 12-bit ADC with up to 3.5 MSPS conversion rate, and a peripheral trigger generator (PTG) for hardware state-machine sequencing without CPU intervention. Functional Safety (FuSa) support and CIP (Core Independent Peripherals) help meet ISO 26262 and IEC 61508 compliance targets in safety-related systems.
The slave core can be programmed and debugged independently through a dedicated programming/debug interface, allowing firmware teams to develop proprietary algorithms as loadable image modules that execute concurrently with the main application. This makes the device attractive for customers who license third-party control IP or wish to protect their firmware from reverse engineering.
Typical applications include wireless power transfer, server and telecom SMPS digital power supplies, EV chargers, drone ESCs, automotive sensors, high-density LED lighting drivers, and any closed-loop system requiring sub-microsecond PID-injected control. The wide -40C to +85C industrial temperature range and small 5x5 mm UQFN footprint suit compact, fan-less industrial designs.
Design tip: Place a 10uF bulk plus 100nF decoupling pair adjacent to every VDD/VSS pin pair, route the HSE/LSE crystal traces symmetrically with a guard ring, and expose the IC's exposed pad to a contiguous copper pour to keep theta_JA manageable at full 200 MHz dual-core load.
This page synthesizes distributor pricing, drop-in alternatives, and practical layout guidance not found in the manufacturer datasheet alone, making it a single-source decision aid for embedded firmware and power-electronics engineers.
Alternatives de remplacement direct pour DSPIC33CH128MP503-I/M5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH128MP503-I/M5 (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, RoHS Status, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH128MP503-E/M5
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH128MP503-H/M5
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33CH128MP503T-I/M5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.35 / unité
Voir la fiche technique →DSPIC33CH128MP203-I/M5
✅ Remplacement direct✓ En stock
$3.85 / unité
Voir la fiche technique →DSPIC33CH64MP503-I/M5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.55 / unité
Voir la fiche technique →DSPIC33CH128MP503-I/M5 Valeurs maximales et caractéristiques électriques
| Product Type | Dual-Core Digital Signal Controller (DSC) |
| Core Architecture | dsPIC33C 16-bit, dual-core (one master, one slave) |
| Master Core Speed | 200 MIPS at 200 MHz |
| Slave Core Speed | 180 MIPS at 180 MHz |
| Program Flash Memory | 152 KB (152K x 8) including PRAM |
| Boîtier | 36-pin UQFN (5x5 mm) |
| Operating Voltage | 3.0 V to 3.6 V |
| Plage de température de fonctionnement | -40C to +85C (Industrial, -I suffix) |
| High-Resolution PWM Channels | 12 (250 ps resolution) |
| ADC | 12-bit, up to 3.5 MSPS |
| CAN FD | Yes (CAN FD capable) |
| DMA Channels | 8 |
| Timers | 2 general purpose + PWM-synchronized timers |
| Serial I/O | 3 (UART/SPI/I2C configurable) |
| Functional Safety | FuSa support (Class B / SIL-2 capable) |
| Type de montage | Surface Mount |
| Niveau MSL | MSL3 (168 hours) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de DSPIC33CH128MP503-I/M5
| Broche 1 | RA0 — General purpose I/O / AN0 / RPx |
| Broche 2 | RA1 — General purpose I/O / AN1 / RPx |
| Broche 3 | RA2 — General purpose I/O / AN2 / RPx |
| Broche 4 | RA3 — General purpose I/O / AN3 / RPx |
| Broche 5 | VDD — Core supply voltage 3.3V |
| Broche 6 | VSS — Ground reference |
| Broche 7 | OSCI — External crystal/oscillator input |
| Broche 8 | OSCO — External crystal/oscillator output |
| Broche 9 | RB0 — PWM1H / general purpose I/O |
| Broche 10 | RB1 — PWM1L / general purpose I/O |
| Broche 11 | RB2 — PWM2H / general purpose I/O |
| Broche 12 | RB3 — PWM2L / general purpose I/O |
| Broche 13 | VSS — Ground reference |
| Broche 14 | VDD — Core supply voltage 3.3V |
| Broche 15 | RB4 — PWM3H / general purpose I/O |
| Broche 16 | RB5 — PWM3L / general purpose I/O |
| Broche 17 | RB6 — PWM4H / general purpose I/O |
| Broche 18 | RB7 — PWM4L / general purpose I/O |
| Broche 19 | RC0 — CAN FD RX / general purpose I/O |
| Broche 20 | RC1 — CAN FD TX / general purpose I/O |
| Broche 21 | RC2 — UART TX / general purpose I/O |
| Broche 22 | RC3 — UART RX / general purpose I/O |
| Broche 23 | RC4 — SPI SCK / general purpose I/O |
| Broche 24 | RC5 — SPI SDI / general purpose I/O |
| Broche 25 | RC6 — SPI SDO / general purpose I/O |
| Broche 26 | RC7 — General purpose I/O |
| Broche 27 | VSS — Ground reference |
| Broche 28 | VDD — I/O supply voltage 3.3V |
| Broche 29 | RD0 — PWM5H / general purpose I/O |
| Broche 30 | RD1 — PWM5L / general purpose I/O |
| Broche 31 | RD2 — PWM6H / general purpose I/O |
| Broche 32 | RD3 — PWM6L / general purpose I/O |
| Broche 33 | MCLR — Master clear / reset (active-low) |
| Broche 34 | PGECx — Programming/debug clock (master core) |
| Broche 35 | PGEDx — Programming/debug data (master core) |
| Broche 36 | EP — Exposed thermal pad - connect to VSS ground pour |
Applications typiques
DSPIC33CH128MP503-I/M5 convient pour 6 applications: Wireless Power Transfer (WPT), Server and Telecom SMPS Digital Power, EV Chargers and DC-DC Converters, Drone Electronic Speed Controllers (ESC), High-Density LED Lighting Drivers, Automotive Sensor Signal Conditioning.
Wireless Power Transfer (WPT)
The DSPIC33CH128MP503-I/M5 is purpose-built for wireless power transmitter and receiver designs conforming to Qi and AirFuel resonant topologies. Its 12 channels of 250 ps high-resolution PWM deliver the precise zero-voltage switching (ZVS) and phase-shift deadtime control required to maintain efficiency above 90 percent at coil-resonance frequencies from 100 kHz to 6.78 MHz, while the slave dsPIC33 core runs proprietary foreign-object detection (FOD) and adaptive tuning algorithms in parallel without disturbing the master core's main control loop. According to the manufacturer datasheet, the dual-core architecture lets one core handle real-time inverter switching while the other manages comms, coil ping, and demodulated load-modulation feedback. The 36-pin UQFN (5x5 mm) package suits compact charger pads and embedded receiver modules where PCB real estate is at a premium.
Recommandé
Server and Telecom SMPS Digital Power
The DSPIC33CH128MP503-I/M5's 200 MIPS master and 180 MIPS slave cores deliver the deterministic sub-microsecond loop latency demanded by 80 PLUS Titanium-class server power supplies and 48V telecom rectifiers. The slave core can be assigned exclusively to the voltage-mode or current-mode control loop running at 100 kHz to 500 kHz switching frequency, eliminating interrupt-jitter-induced output ripple that single-core MCUs exhibit when housekeeping tasks preempt the control thread. Per Microchip documentation, the 12-bit 3.5 MSPS ADC with up to 4 Sample-and-Hold channels enables simultaneous sensing of input voltage, output voltage, inductor current, and temperature within a single switching period. The 36-pin UQFN (5x5 mm) footprint allows deployment on compact PFC + LLC daughtercards used in 1U/2U server form factors.
Recommandé
EV Chargers and DC-DC Converters
Electric-vehicle Level-2 AC chargers and onboard DC-DC converters benefit from the DSPIC33CH128MP503-I/M5's combination of CAN FD connectivity for ISO 15118 / CHAdeMO communication and 250 ps-resolution PWM for totem-pole PFC and CLLC resonant control. The slave core can execute the complex digital-loop compensation math (Type-II/Type-III, adaptive gain, input-voltage feed-forward) while the master core runs Modbus/CAN stack, OCPP comms, and user-interface logic. The 12-bit ADC with hardware oversampling supports the high-bandwidth current sensing required for interleaved totem-pole topologies at 65 kHz fundamental. According to the manufacturer datasheet, the device's -40C to +85C industrial temperature range covers under-hood EV charger enclosures with derating.
Recommandé
Drone Electronic Speed Controllers (ESC)
Multi-rotor drone ESCs require deterministic field-oriented control (FOC) of brushless motors at 32 kHz to 48 kHz update rates with sub-2 microsecond latency - exactly the workload profile the DSPIC33CH128MP503-I/M5's slave core is built for. The 12 high-resolution PWM channels drive a 4-phase X-Pin-compatible tri-phase FOC inverter (3 half-bridges) plus auxiliary channels for brake, BEC, and telemetry. The master core runs the flight-controller comms (DShot, OneShot, Crossfire) and propeller-balancing algorithms. With 152 KB Flash the device fits custom flight profiles and adaptive auto-tune firmware. The 36-pin UQFN (5x5 mm) and 6 gram ESC PCB weight budget match micro racing-drone form factors.
Recommandé
High-Density LED Lighting Drivers
Commercial-grade architectural and horticultural LED fixtures use the DSPIC33CH128MP503-I/M5 to drive multi-channel constant-current LED strings with per-channel dimming and color-mixing at 16-bit PWM resolution. The 250 ps high-resolution PWM enables flicker-free dimming down to 0.1 percent duty cycle, critical for cinema, medical, and broadcast lighting where 100 Hz to 200 Hz PWM-induced flicker is unacceptable. The slave core executes per-string current-loop regulation while the master core handles DALI-2 / DMX512 / 0-10V dimming protocols and thermal fold-back algorithms. The 36-pin UQFN package suits high-density linear-array LED PCBs where component height must stay below 1 mm.
Recommandé
Automotive Sensor Signal Conditioning
The DSPIC33CH128MP503-I/M5 is suited to advanced automotive sensor modules including battery-management system (BMS) cell monitors, motor position sensors, and exhaust-gas sensor signal chains. The slave core runs precision sigma-delta decimation on the 12-bit ADC, applying digital filtering and linearization in real time at 1 kSPS to 100 kSPS rates, while the master core handles CAN FD communication and functional-safety diagnostics. Microchip documentation confirms Functional Safety (FuSa) Class B capability and CIP (Core Independent Peripherals) support that simplify ISO 26262 ASIL-B qualification. Industrial temperature grade suffices for cabin and BMS applications; choose the -H/M5 automotive variant for under-hood and exhaust sensing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH128MP503-I/M5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH128MP503-E/M5 | DSPIC33CH128MP503-H/M5 | DSPIC33CH128MP503T-I/M5 | DSPIC33CH128MP203-I/M5 | DSPIC33CH64MP503-I/M5 |
|---|---|---|---|---|---|---|
| Package | 36-pin UQFN (5x5 mm) | 36-pin UQFN (5x5 mm) - same | 36-pin UQFN (5x5 mm) - same | 36-pin UQFN (5x5 mm) - same | 36-pin UQFN (5x5 mm) - same | 36-pin UQFN (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Master Core Speed | 200 MIPS / 200 MHz | 200 MIPS / 200 MHz | 200 MIPS / 200 MHz | 200 MIPS / 200 MHz | 200 MIPS / 200 MHz | 200 MIPS / 200 MHz |
| Slave Core Speed | 180 MIPS / 180 MHz | 180 MIPS / 180 MHz | 180 MIPS / 180 MHz | 180 MIPS / 180 MHz | 180 MIPS / 180 MHz | 180 MIPS / 180 MHz |
| Program Flash Memory | 152 KB | 152 KB | 152 KB | 152 KB | 128 KB (-16%) | 64 KB (-58%) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +150C (Automotive) | -40C to +85C (Industrial, T&R) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| High-Resolution PWM Channels | 12 | 12 | 12 | 12 | 12 | 12 |
| CAN FD Support | Yes | Yes | Yes | Yes | Yes | Yes |
| Automotive Grade (AEC-Q100) | No | No (Extended only) | Yes (AEC-Q100) | No (Industrial T&R) | No | No |
Principaux différenciateurs
- True dual-core architecture in 36-pin UQFN (vs DSPIC33EP128GM604 (single-core 64-pin dsPIC33EP))
- 250 ps high-resolution PWM resolution (vs STM32F303CBT6 (single-core 72 MHz ARM Cortex-M4))
- Independent slave core for proprietary IP isolation (vs DSPIC33CK256MP506 (single-core 100 MHz dsPIC33CK))
Notes de conception
Place a 10uF bulk plus 100nF decoupling ceramic pair within 3 mm of every VDD/VSS pin pair to suppress switching noise from the 200 MHz master core. According to Microchip hardware design guidelines for the dsPIC33CH family, all 4 VDD pins (5, 14, 27, 28) require their own local bypass; sharing a single bulk cap across distant pins creates ground bounce that can corrupt ADC readings. Expose the UQFN-36 bottom pad (pin 36) to a contiguous copper pour stitched with 0.3 mm via arrays to the internal ground plane.
Route the HSE crystal traces (OSCI pin 7, OSCO pin 8) symmetrically with trace width under 1 mm and length under 10 mm, surrounded by a grounded guard ring on both sides. Place the load capacitors (typically 15-33 pF) immediately adjacent to the IC pins, not at the crystal end. This minimizes stray capacitance that shifts oscillation frequency and degrades jitter performance, which is critical for high-resolution PWM timing accuracy (per Microchip dsPIC33CH hardware design checklist).
Estimated: At full dual-core load with both cores running at 200 MHz/180 MHz and all peripherals active, the DSPIC33CH128MP503-I/M5 dissipates approximately 0.5-0.8 W. The 36-pin UQFN (5x5 mm) package with exposed pad has theta_JA around 30-35 C/W on a 4-layer 1-oz PCB with proper ground-pour stitching under the EP. In enclosed, high-ambient (>60C) industrial enclosures, attach a small copper heatsink or thermal via cluster to keep junction temperature below 100C and avoid thermal throttling. Verify with on-chip die-temperature diode.
Do not enable both master and slave core debug at the same PGECx/PGEDx pair - each core has its own dedicated programming/debug pins and confusing the assignments will lock the slave core in reset. Also ensure the master core firmware calls the SLAVE_FINALIZE_BOOT() boot sequence before accessing shared SFRs or RAM regions, otherwise the slave core will return garbage on first read. According to Microchip application note AN2721, undefined behavior at the master-slave shared-memory boundary is the most common firmware bug for new dsPIC33CH users.
Use a low-noise LDO (such as Microchip MCP1703 or MIC5353) rated at least 200 mA above worst-case peak to feed the DSPIC33CH128MP503-I/M5 VDD pins, since the 200 MHz core draws dynamic current spikes up to 80 mA per transition. A switching regulator fed directly to VDD will couple switching noise into ADC analog inputs through the supply pin. For functional-safety Class B designs, add a voltage supervisor (such as Microchip MCP1316) to drive MCLR if VDD droops below 2.7V - the device has no internal brown-out reset for the slave core.
Informations de conformité
RoHS compliant per Microchip product page. The -I/M5 industrial grade is not AEC-Q100 qualified - select DSPIC33CH128MP503-H/M5 for automotive AEC-Q100 applications. Functional Safety (FuSa) Class B / SIL-2 documentation support is available separately from Microchip.