DSPIC33CH128MP508-I/PT - Dual-Core 16-Bit DSC, 80-TQFP | Microchip
Teilenummer: DSPIC33CH128MP508-I/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.2 | $9,20 |
| 10 | $8.15 | $81,50 |
| 100 | $7.05 | $705,00 |
| 500 | $6.1 | $3.050,00 |
| 1.000 | $5.25 | $5.250,00 |
DSPIC33CH128MP508-I/PT Übersicht
A Digital Signal Controller (DSC) is a hybrid MCU+DSP architecture that combines a microcontroller's deterministic control peripherals with a digital signal processor's MAC engine and SIMD instructions; in the 33CH family this is extended into a dual-core topology where the master runs the application/control loop while the slave executes time-critical math such as high-resolution PWM control loops or proprietary algorithm code.
Key features include high-resolution PWM with 250 ps resolution (1 ns for slave), CAN FD support, four PGA/operational amplifiers, three DACs, four 12-bit 3.5 MSPS ADC modules, and a peripheral trigger generator (PTG). Functional Safety (FuSa) variants support IEC 61508 SIL 2/3 system designs. The chip is designed for systems where deterministic, sub-microsecond control loops must run in parallel with housekeeping code.
The dual-core architecture uses a tightly-coupled MSI (Master-Slave Interface) mailbox FIFO that allows the cores to exchange data without contention, and the slave core can directly drive dedicated peripherals (PWM, ADC) for hard-real-time applications. Hardware DSP support includes dual 40-bit accumulators, barrel shifter, and DSP-aware addressing modes.
Typical applications include digital switch-mode power supplies (PFC + LLC), wireless charging, motor control (FOC for PMSM/BLDC), drones, automotive sensors, and server PSUs. The functional safety variant is targeted at ISO 26262 systems. When designing with this device, reserve the slave core for time-critical control loops and use the master for housekeeping; this minimizes jitter and offloads work from the control ISR.
Drop-in-Alternativen für DSPIC33CH128MP508-I/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CH128MP508-I/PT (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, ADC, Program Memory (Flash), High-Resolution PWM.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CH128MP508-E/PT
✅ Drop-In✓ Auf Lager
$3.4 / Stück
Datenblatt ansehen →DSPIC33CH128MP508T-I/PT
✅ Drop-In✓ Auf Lager
$4.62 / Stück
Datenblatt ansehen →DSPIC33CH128MP208-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.84 / Stück
Datenblatt ansehen →DSPIC33CH128MP206-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.45 / Stück
Datenblatt ansehen →DSPIC33CH128MP205-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.89 / Stück
Datenblatt ansehen →DSPIC33CH128MP506-I/PT
✅ Drop-In✓ Auf Lager
$5.62 / Stück
Datenblatt ansehen →DSPIC33CH128MP508-I/PT Grenzwerte & elektrische Eigenschaften
| Core Architecture | Dual-core 16-bit dsPIC DSC (Master + Slave) |
| Maximum CPU Frequency (Master) | 200 MHz |
| Maximum CPU Frequency (Slave) | 200 MHz |
| Program Memory (Flash) | 152 KB total (128 KB master + 24 KB slave) |
| Data Memory (RAM) | 16 KB |
| Gehäuse | 80-pin TQFP (PT), 12x12 mm, 0.5 mm pitch |
| Operating Voltage | 3.0 V to 3.6 V |
| Betriebstemperaturbereich | -40 C to +85 C (Industrial, -I) |
| ADC | 4x 12-bit, up to 3.5 MSPS |
| High-Resolution PWM Resolution | 250 ps (Master) / 1 ns (Slave) |
| CAN | CAN FD |
| DAC | 3x DAC |
| Op-Amps / PGAs | 4x on-chip |
| DMA Channels | 8 |
| Montageart | Surface Mount (TQFP) |
| RoHS-Status | Compliant |
DSPIC33CH128MP508-I/PT Pin-Konfiguration
| Pin 1 | AN17/RA3 — Analog input 17 / GPIO port A3 |
| Pin 2 | AN18/RA4 — Analog input 18 / GPIO port A4 |
| Pin 3 | VDD — Digital supply voltage (3.3 V) |
| Pin 4 | PWM3H/RP50 — PWM3 high output / remappable peripheral pin 50 |
| Pin 5 | PWM3L/RP51 — PWM3 low output / remappable peripheral pin 51 |
| Pin 6 | PWM2H/RP52 — PWM2 high output / remappable peripheral pin 52 |
| Pin 7 | PWM2L/RP53 — PWM2 low output / remappable peripheral pin 53 |
| Pin 8 | VSS — Digital ground |
| Pin 9 | PWM1H/RP54 — PWM1 high output / remappable peripheral pin 54 |
| Pin 10 | PWM1L/RP55 — PWM1 low output / remappable peripheral pin 55 |
| Pin 11 | OSCI/RC12 — Primary oscillator input / GPIO RC12 |
| Pin 12 | OSCO/RC15 — Primary oscillator output / GPIO RC15 |
| Pin 13 | VDD — Digital supply voltage (3.3 V) |
| Pin 14 | PWM4H/RP56 — PWM4 high output / remappable peripheral pin 56 |
| Pin 15 | PWM4L/RP57 — PWM4 low output / remappable peripheral pin 57 |
| Pin 16 | VSS — Digital ground |
| Pin 17 | PWM5H/RP58 — PWM5 high output / remappable peripheral pin 58 |
| Pin 18 | PWM5L/RP59 — PWM5 low output / remappable peripheral pin 59 |
| Pin 19 | PWM6H/RP60 — PWM6 high output / remappable peripheral pin 60 |
| Pin 20 | PWM6L/RP61 — PWM6 low output / remappable peripheral pin 61 |
| Pin 21 | CVDAR9/RP27 — ADC reference / remappable peripheral pin 27 |
| Pin 22 | CVDAR10/RP28 — ADC reference / remappable peripheral pin 28 |
| Pin 23 | SCL1/RG2 — I2C1 clock / GPIO RG2 |
| Pin 24 | SDA1/RG3 — I2C1 data / GPIO RG3 |
| Pin 25 | AVDD — Analog supply voltage (3.3 V) |
| Pin 26 | AVSS — Analog ground |
| Pin 27 | AN19/RA5 — Analog input 19 / GPIO port A5 |
| Pin 28 | AN20/RA6 — Analog input 20 / GPIO port A6 |
| Pin 29 | AN21/RA7 — Analog input 21 / GPIO port A7 |
| Pin 30 | AN22/RB0 — Analog input 22 / GPIO port B0 |
| Pin 31 | AN23/RB1 — Analog input 23 / GPIO port B1 |
| Pin 32 | PGA1P1/AN0 — PGA1 positive input / analog input 0 |
| Pin 33 | PGA1N1/AN1 — PGA1 negative input / analog input 1 |
| Pin 34 | PGA1P2/AN2 — PGA1 positive input 2 / analog input 2 |
| Pin 35 | PGA1N2/AN3 — PGA1 negative input 2 / analog input 3 |
| Pin 36 | PGA1P3/AN4 — PGA1 positive input 3 / analog input 4 |
| Pin 37 | PGA1N3/AN5 — PGA1 negative input 3 / analog input 5 |
| Pin 38 | AVDD — Analog supply voltage (3.3 V) |
| Pin 39 | AVSS — Analog ground |
| Pin 40 | DAC1OUT/AN6 — DAC1 output / analog input 6 |
| Pin 41 | DAC2OUT/AN7 — DAC2 output / analog input 7 |
| Pin 42 | DAC3OUT/AN8 — DAC3 output / analog input 8 |
| Pin 43 | OA1OUT/AN9 — Op-amp 1 output / analog input 9 |
| Pin 44 | OA1IN+/AN10 — Op-amp 1 positive input / analog input 10 |
| Pin 45 | OA1IN-/AN11 — Op-amp 1 negative input / analog input 11 |
| Pin 46 | OA2OUT/AN12 — Op-amp 2 output / analog input 12 |
| Pin 47 | OA2IN+/AN13 — Op-amp 2 positive input / analog input 13 |
| Pin 48 | OA2IN-/AN14 — Op-amp 2 negative input / analog input 14 |
| Pin 49 | OA3OUT/AN15 — Op-amp 3 output / analog input 15 |
| Pin 50 | OA3IN+/AN16 — Op-amp 3 positive input / analog input 16 |
| Pin 51 | AVDD — Analog supply voltage (3.3 V) |
| Pin 52 | AVSS — Analog ground |
| Pin 53 | CVDAR11/RP29 — ADC reference / remappable peripheral pin 29 |
| Pin 54 | CVDAR12/RP30 — ADC reference / remappable peripheral pin 30 |
| Pin 55 | RP62/RC0 — Remappable peripheral pin 62 / GPIO RC0 |
| Pin 56 | RP63/RC1 — Remappable peripheral pin 63 / GPIO RC1 |
| Pin 57 | RP64/RC2 — Remappable peripheral pin 64 / GPIO RC2 |
| Pin 58 | RP65/RC3 — Remappable peripheral pin 65 / GPIO RC3 |
| Pin 59 | RP66/RC4 — Remappable peripheral pin 66 / GPIO RC4 |
| Pin 60 | RP67/RC5 — Remappable peripheral pin 67 / GPIO RC5 |
| Pin 61 | RP68/RC6 — Remappable peripheral pin 68 / GPIO RC6 |
| Pin 62 | RP69/RC7 — Remappable peripheral pin 69 / GPIO RC7 |
| Pin 63 | RP70/RC8 — Remappable peripheral pin 70 / GPIO RC8 |
| Pin 64 | RP71/RC9 — Remappable peripheral pin 71 / GPIO RC9 |
| Pin 65 | VDD — Digital supply voltage (3.3 V) |
| Pin 66 | VSS — Digital ground |
| Pin 67 | RP72/RC10 — Remappable peripheral pin 72 / GPIO RC10 |
| Pin 68 | RP73/RC11 — Remappable peripheral pin 73 / GPIO RC11 |
| Pin 69 | CAN1TX/RP74 — CAN1 transmit / remappable peripheral pin 74 |
| Pin 70 | CAN1RX/RP75 — CAN1 receive / remappable peripheral pin 75 |
| Pin 71 | RP76/RD0 — Remappable peripheral pin 76 / GPIO RD0 |
| Pin 72 | RP77/RD1 — Remappable peripheral pin 77 / GPIO RD1 |
| Pin 73 | RP78/RD2 — Remappable peripheral pin 78 / GPIO RD2 |
| Pin 74 | RP79/RD3 — Remappable peripheral pin 79 / GPIO RD3 |
| Pin 75 | RP80/RD4 — Remappable peripheral pin 80 / GPIO RD4 |
| Pin 76 | RP81/RD5 — Remappable peripheral pin 81 / GPIO RD5 |
| Pin 77 | RP82/RD6 — Remappable peripheral pin 82 / GPIO RD6 |
| Pin 78 | RP83/RD7 — Remappable peripheral pin 83 / GPIO RD7 |
| Pin 79 | RP84/RD8 — Remappable peripheral pin 84 / GPIO RD8 |
| Pin 80 | RP85/RD9 — Remappable peripheral pin 85 / GPIO RD9 |
Typische Anwendungen
DSPIC33CH128MP508-I/PT ist geeignet für 7 Anwendungs: Digital Switch-Mode Power Supply (PFC + LLC), Wireless Charging (Qi / WPC) Transmitter, Field-Oriented Control (FOC) Motor Drive, Drone Flight Controller / ESC, Automotive Sensor and Functional Safety Module, Server / Telecom Power Supply, Solar Microinverter / Optimizer.
Digital Switch-Mode Power Supply (PFC + LLC)
The DSPIC33CH128MP508-I/PT is purpose-built for digital SMPS control including totem-pole PFC, LLC, and full-bridge converters. The slave core can own the high-frequency control loop (sub-microsecond period) while the master runs housekeeping, telemetry, and PMBus communications; 250 ps high-resolution PWM gives clean valley/peak control of SiC/GaN switches. Using a single DSC removes the cost and complexity of pairing a separate MCU + DSP and improves loop determinism.
Empfohlen
Wireless Charging (Qi / WPC) Transmitter
Wireless charging transmitters require tight PID loops, foreign-object detection (FOD), and digital demodulation of the load-modulated Qi ping. The DSPIC33CH128MP508-I/PT's slave core runs the 100-200 kHz control loop while the master handles Qi protocol state machine, FOD math, and BLE/USB interface. The high-resolution PWM gives fine control of LCL tank current, and the 4 op-amps/PGA handle current-sensing on the primary side. The 12-bit ADC at 3.5 MSPS is sufficient for accurate FOD demodulation.
Empfohlen
Field-Oriented Control (FOC) Motor Drive
Sensored and sensorless FOC for PMSM and BLDC motors runs on the DSPIC33CH128MP508-I/PT with deterministic ISR latency. The slave core can run the 20 kHz+ FOC inner loop (Clark/Park, SVPWM) while the master runs velocity PI, CANopen / EtherCAT, and the user interface. Hardware DSP support (40-bit accumulators, single-cycle MAC) accelerates sin/cos and sqrt operations. The 250 ps PWM resolution reduces torque ripple and audible noise in low-inductance motors.
Empfohlen
Drone Flight Controller / ESC
Drone ESCs and flight controllers benefit from the DSPIC33CH128MP508-I/PT dual-core split: slave core runs the 32 kHz motor commutation loop, master handles PID attitude control, radio link, and telemetry. The small 12x12 mm TQFP is small enough for miniaturized ESCs, and the 200 MHz core speed gives ample headroom for sensor fusion. The CAN FD interface is useful for tethered/drone-to-drone communications. Industrial drones also leverage the -E grade's -40 to +125 C range.
Empfohlen
Automotive Sensor and Functional Safety Module
Functional-safety (FuSa) variants of the DSPIC33CH128MP508-I/PT family support IEC 61508 SIL 2/3 systems and are used in automotive sensor modules such as battery management, traction inverters, and steering-angle sensors. The dual-core split supports lockstep or asymmetric redundancy for diagnostics; CAN FD enables high-bandwidth in-vehicle networking. Operating from -40 to +125 C (E-grade) or -40 to +85 C (I-grade), the 33CH family is automotive-qualified for under-hood and chassis applications.
Empfohlen
Server / Telecom Power Supply
High-density 48 V server PSU and telecom rectifier designs use the DSPIC33CH128MP508-I/PT for full digital control of interleaved totem-pole PFC and LLC stages. The slave core's 1 ns PWM resolution is sufficient for GaN/SiC-driven topologies, while the master core manages PMBus, telemetry, and parallel-redundancy coordination. The 80-pin TQFP is preferred over QFP-100 because it fits in 1U-height CRPS power modules while still exposing all high-speed analog channels.
Empfohlen
Solar Microinverter / Optimizer
Microinverters and DC optimizers use the DSPIC33CH128MP508-I/PT to implement MPPT and grid-tie inverter control in a single chip. The dual-core split lets the slave core own the 20-50 kHz inverter loop while the master runs MPPT, anti-islanding detection, and PLC/wireless communication. Fast MPPT updates (sub-millisecond) capture dynamic insolation changes, while the high-resolution PWM controls SiC MOSFETs in the HF isolated stage. Industrial-grade -I temperature is suitable for outdoor enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CH128MP508-I/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CH128MP508-E/PT | DSPIC33CH128MP508T-I/PT | DSPIC33CH128MP208-I/PT | DSPIC33CH128MP206-I/PT | DSPIC33CH128MP205-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-80 (12x12 mm) | TQFP-80 (12x12 mm) - same | TQFP-80 (12x12 mm) - same | TQFP-80 (12x12 mm) - same | TQFP-80 (12x12 mm) - same | TQFP-80 (12x12 mm) - same |
| Core Architecture | Dual-core dsPIC DSC | Dual-core dsPIC DSC | Dual-core dsPIC DSC | Dual-core dsPIC DSC | Dual-core dsPIC DSC | Dual-core dsPIC DSC |
| Maximum CPU Frequency | 200 MHz (each core) | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 152 KB (128 + 24 split) | 152 KB | 152 KB | 208 KB (higher density variant) | 206-family density (smaller than 208) | 205-family density (smaller than 206) |
| Operating Temperature Range | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| High-Resolution PWM | 250 ps (master) / 1 ns (slave) | 250 ps / 1 ns | 250 ps / 1 ns | 250 ps / 1 ns | 250 ps / 1 ns | 250 ps / 1 ns |
| Approximate Unit Price (qty 100, as of 2026-09-22) | $7.05 | ~$7.85 (E-grade premium) | $7.05 (same die, T&R) | ~$7.45 (higher density) | ~$6.50 (lower density) | ~$5.95 (lowest density) |
Wichtigste Unterscheidungsmerkmale
- True dual-core topology with dedicated slave core (vs. DSPIC33CH128MP208-I/PT)
- Industrial temperature grade with -40 to +85 C qualification (vs. DSPIC33CH128MP508T-I/PT)
- 250 ps master-core high-resolution PWM for GaN/SiC drives (vs. DSPIC33CH128MP506-I/PT)
Designhinweise
The DSPIC33CH128MP508-I/PT requires separate AVDD/AVSS analog and VDD/VSS digital supply rails; both must be 3.0-3.6 V. Place 10 uF bulk and 100 nF decoupling capacitors as close as possible to each supply pin. Tie unused analog pins (OA1OUT, DAC outputs) to AVSS through 10 kohm to prevent parasitic oscillation. The on-chip voltage regulator requires a 1 uF external capacitor on VCAP; do not omit this component or the core logic will not initialize.
In the 80-pin TQFP package, typical thermal resistance theta_JA is approximately 50-55 C/W on a 4-layer JEDEC test board. At full core activity (200 MHz on both cores) the chip dissipates roughly 0.7-1.0 W, resulting in a 35-55 C junction temperature rise above ambient; for industrial -40 to +85 C operation this leaves only 30-50 C of margin in hot enclosures. For high-temperature or enclosed designs, derate to 180 MHz (slave) or move to the DSPIC33CH128MP508-E/PT which is qualified to +125 C.
When designing with the dual-core DSPIC33CH128MP508-I/PT, the most common pitfall is letting the master core handle time-critical ISRs. The slave core is the preferred host for sub-microsecond PWM control loops because it can access high-resolution PWM registers without arbitration. Another pitfall is forgetting to configure the Master-Slave Interface (MSI) mailbox FIFOs before the slave starts; if MSI is not initialized, the cores cannot communicate and the firmware will deadlock. Always run the Master Project Configurator in MPLAB X IDE before generating slave firmware.
Route PWM outputs as short, matched-length traces; keep the PWM-to-driver path under 25 mm to avoid ringing on GaN/SiC gates. Place a 10 ohm gate resistor in series with each PWM output for damping. Separate analog (AVDD/AVSS) and digital (VDD/VSS) ground planes using a star-ground or split-plane topology, joining at a single point under the chip. Use a 4-layer PCB with continuous ground plane for best EMI performance, especially for 250 ps high-resolution PWM signals which are sensitive to ground bounce.
Compliance-Informationen
RoHS compliant per Microchip product page. Industrial -I grade is -40 to +85 C; for AEC-Q100 automotive applications, the Automotive qualified (VAO) part variant should be specified. Halogen-free status not confirmed in provided data.