DSPIC33CK32MP103-E/M5 - 100MHz 16-bit DSC 32KB Flash | Microchip
Teilenummer: DSPIC33CK32MP103-E/M5 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.08 | $30,80 |
| 100 | $2.74 | $274,00 |
| 500 | $2.46 | $1.230,00 |
| 1.000 | $2.19 | $2.190,00 |
DSPIC33CK32MP103-E/M5 Übersicht
A digital signal controller combines the compute power of a digital signal processor (DSP) with the peripheral integration and deterministic control of a microcontroller (MCU). In the embedded systems hierarchy, the dsPIC33CK sits between a general-purpose MCU and a full DSP, offering single-cycle MAC instructions and fast interrupt handling for closed-loop control loops in power conversion and motor drive systems.
Key features include the 100 MHz dsPIC33CK core with DSP-enhanced instruction set, Functional Safety (FuSa) support per Microchip's safety documentation, high-speed analog peripherals, and High-Resolution PWM for precision power conversion. The E-grade suffix specifies extended operating temperature, supporting automotive and AEC-Q100-aligned deployments per distributor listings (Hotenda lists this part as Automotive, AEC-Q100).
The architecture pairs a fast 16-bit CPU with on-chip high-speed ADC, op amps, comparators, and high-resolution PWM outputs (per the Microchip dsPIC33CK32MP103 family datasheet title), enabling single-chip control of PFC stages, LLC converters, BLDC/PMSM motors, and sensor fusion nodes. Two on-chip op amps reduce external BOM count in current-sense paths.
Typical applications include 48V-to-12V DC/DC brick power modules (e.g., the Microchip EPC9143 reference design using the dsPIC33CK32MP102 sibling), digital power supplies, brushless motor control, and advanced sensing systems.
Design consideration: budget code space carefully at 32 KB FLASH and validate ADC sampling timing against the 100 MHz core clock; the exposed-pad UQFN requires solid thermal grounding.
This page synthesizes distributor data, drop-in family alternatives, and design guidance not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33CK32MP103-E/M5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CK32MP103-E/M5 (gleiche Bauform und Footprint) – abweichend in Package, Program Memory Size, Core Processor, Operating Temperature, Packaging.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CK32MP103-I/M5
✅ Drop-In✓ Auf Lager
$2.64 / Stück
Datenblatt ansehen →DSPIC33CK32MP105-I/M5
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33CK32MC105-E/M4
✅ Drop-In✓ Auf Lager
$3.2 / Stück
Datenblatt ansehen →DSPIC33CK32MP102-I/M5
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CK128MC503T-I/M5
✅ Drop-In✓ Auf Lager
$3 / Stück
Datenblatt ansehen →DSPIC33CK32MP303-I/M5
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33CK32MP103-E/M5 Grenzwerte & elektrische Eigenschaften
| Core Processor | dsPIC 33CK (16-bit DSC core) |
| Core Size | 16-bit |
| Maximum Clock Speed | 100 MHz |
| Program Memory Size | 32 KB (32K x 8) FLASH |
| Program Memory Type | FLASH |
| Series | dsPIC 33CK, Functional Safety (FuSa) |
| Versorgungsspannung | 3.3 V (per Hotenda listing) |
| Gehäuse / Bauform | 36-UQFN (5x5 mm) with exposed pad |
| Montageart | Surface Mount |
| Peripherals | High-Speed ADC, Op Amps, Comparators, High-Resolution PWM |
| Product Category | Digital Signal Controllers & Processors (DSC) |
| Qualification | Automotive, AEC-Q100 (per distributor listing) |
| Functional Safety | FuSa supported (per DigiKey listing) |
| Temperature Grade | E (extended), per part number suffix |
| Product Status | Active |
DSPIC33CK32MP103-E/M5 36-uqfn (5x5 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33CK32MP103-E/M5 (36-uqfn (5x5 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33CK32MP103-E/M5.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33CK32MP103-E/M5 ist geeignet für 6 Anwendungs: 48V to 12V DC/DC Power Module, Brushless DC / PMSM Motor Control, Digital Power Factor Correction (PFC), Automotive Sensing and Control Nodes, Advanced Sensing and Condition Monitoring, LED Lighting and Electronic Ballast Control.
48V to 12V DC/DC Power Module
The DSPIC33CK32MP103-E/M5 fits 48V-to-12V brick power modules because its 100 MHz dsPIC33CK core executes voltage- and current-mode compensation loops with cycle-level determinism, and its High-Resolution PWM provides sub-nanosecond-effective duty-cycle resolution for tight regulation. Microchip's EPC9143 reference design, built with Efficient Power Conversion around the same-family dsPIC33CK32MP102, demonstrates this architecture driving eGaN FETs. In a typical topology the DSC samples output voltage and inductor current through the on-chip high-speed ADC, computes the control law, and updates PWM comparators each switching period. The integrated op amps condition current-shunt signals without external amplifiers, and the extended E temperature grade plus AEC-Q100 qualification (per distributor listing) supports telecom and automotive brick environments.
Empfohlen
Brushless DC / PMSM Motor Control
Field-oriented control (FOC) of BLDC and PMSM motors demands fast, deterministic current loops - exactly what the DSPIC33CK32MP103-E/M5 delivers with its 100 MHz 16-bit core, single-cycle DSP MAC instructions, and high-speed ADC triggering synchronized to the PWM carrier. The on-chip op amps amplify low-level shunt or in-line phase-current signals directly, and comparators support overcurrent trip shutdown in hardware with microsecond-class response, protecting power stages independently of software latency. In a typical FOC implementation, phase currents are sampled at PWM center, Clarke/Park transforms and PI loops run in firmware, and the high-resolution PWM drives a three-phase inverter. The 32 KB FLASH accommodates FOC plus commutation and communication firmware for fans, pumps, power tools, and servo drives.
Empfohlen
Digital Power Factor Correction (PFC)
Continuous-conduction-mode boost PFC benefits directly from the DSPIC33CK32MP103-E/M5's architecture: the high-speed ADC samples input voltage, inductor current, and bus voltage each switching cycle, while the 100 MHz core executes average-current-mode compensation with DSP multiply-accumulate throughput that analog controllers cannot match in flexibility. High-Resolution PWM reduces pulse-width quantization jitter, improving THD at light load and enabling high switching frequencies that shrink the inductor. The on-chip comparators implement cycle-by-cycle overcurrent limiting in hardware. Because the part is qualified to AEC-Q100 per distributor data and rated for extended temperatures, it suits server power supplies, telecom rectifiers, and onboard chargers. Firmware-based control also allows adaptive mode switching between CRM and CCM for efficiency optimization across the load range.
Empfohlen
Automotive Sensing and Control Nodes
The DSPIC33CK32MP103-E/M5 targets automotive and functional-safety-oriented nodes: DigiKey identifies the dsPIC33CK family as Functional Safety (FuSa) capable, and distributor Hotenda lists this MPN as Automotive, AEC-Q100 qualified with an extended E temperature grade. In a 3.3V sensor acquisition node, the on-chip op amps and high-speed ADC digitize resistive or ratiometric sensor signals, while the 100 MHz core performs filtering, linearization, and diagnostic calculations locally, offloading the central ECU. Deterministic interrupt latency supports time-critical sensing loops such as position, pressure, and current monitoring. Designers should follow Microchip's FuSa documentation when the node contributes to a safety function, and use the exposed-pad UQFN grounded design for EMC robustness in electrically noisy vehicle environments.
Empfohlen
Advanced Sensing and Condition Monitoring
Condition-monitoring and smart-sensor endpoints use the DSPIC33CK32MP103-E/M5's combination of analog integration and DSP throughput: the high-speed ADC plus on-chip op amps capture vibration, current, or pressure waveforms, and the 100 MHz core executes FFT, RMS, envelope, or threshold algorithms locally, transmitting only condensed health indicators over UART/SPI/I2C. The 32 KB FLASH is sufficient for acquisition plus a compact analysis library when coded with DSP-enhanced instructions. Local intelligence reduces bus traffic and enables sub-millisecond fault detection in pumps, compressors, and industrial drives. The 5x5 mm UQPN footprint allows integration directly into sensor heads, and the extended E temperature rating supports harsh enclosures. AEC-Q100 qualification (per distributor listing) additionally permits use in transportation sensing applications.
Empfohlen
LED Lighting and Electronic Ballast Control
High-power LED drivers and HID/electronic ballasts are classic DSC applications, and the DSPIC33CK32MP103-E/M5 handles them well: its High-Resolution PWM generates phase-shifted or interleaved converter control with fine duty resolution, the high-speed ADC closes current-regulation loops each cycle for flicker-free constant-current output, and hardware comparators provide cycle-by-cycle protection against lamp or LED-string faults. The 100 MHz core also manages burst/dimming algorithms, communication (DALI-style protocols over UART), and thermal derating using on-chip temperature sensing. Because digital control stores the compensation in firmware, a single hardware platform can serve multiple wattage ratings by parameter change, cutting SKU proliferation. The compact 36-UQFN 5x5 mm package fits driver boards where clearance and height are constrained.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CK32MP103-E/M5 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CK32MP103-I/M5 | DSPIC33CK32MP105-I/M5 | DSPIC33CK32MC105-E/M4 | DSPIC33CK128MC503T-I/M5 |
|---|---|---|---|---|---|
| Package | 36-UQFN (5x5 mm), exposed pad | 36-UQFN (5x5) - same | 36-UQFN (5x5) - same | 36-UQFN (5x5) - same | 36-UQFN (5x5) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | dsPIC33CK 16-bit @ 100 MHz | dsPIC33CK @ 100 MHz | dsPIC33CK @ 100 MHz | dsPIC33CK @ 100 MHz | dsPIC33CK @ 100 MHz |
| FLASH Memory | 32 KB | 32 KB | 32 KB (family variant) | 32 KB | 128 KB |
| Temperature Grade | E (extended), AEC-Q100 per distributor | I (industrial) | I (industrial) | E (extended) | I (industrial) |
| On-chip Op Amps / Analog | Yes (MP family: high-speed ADC, op amps, comparators) | Yes - identical MP analog set | Yes - MP analog set | MC analog configuration (verify per datasheet) | MC analog configuration (verify per datasheet) |
| Functional Safety (FuSa) Family | Yes (dsPIC33CK FuSa) | Yes | Yes | Yes (dsPIC33CK FuSa) | Yes (dsPIC33CK FuSa) |
Wichtigste Unterscheidungsmerkmale
- Extended temperature + AEC-Q100 grade (vs. DSPIC33CK32MP103-I/M5)
- MP family integrated analog signal chain (vs. DSPIC33CK32MC105-E/M4)
- Minimal footprint for FuSa-capable control (vs. DSPIC33CK256MP205-E/M4)
- Higher on-chip memory ceiling option without package change (vs. DSPIC33CK128MC503T-I/M5)
Designhinweise
The M5 package is a 36-pad UQFN with exposed pad. Solder the exposed pad to a grounded copper island on the top layer with a 3x3 or larger via array stitched to internal ground planes. This is essential for heat dissipation from the 100 MHz core and for a low-inductance ground reference that keeps the high-speed ADC and PWM switching edges clean. Follow the land-pattern dimensions in the Microchip family datasheet rather than a generic UQFN-36 footprint; paste apertures under the pad should be segmented (typically 50-70% coverage) to avoid voiding during reflow.
The part operates from a 3.3V supply (per Hotenda listing). Decouple each VDD pin with 100 nF ceramics placed within 2 mm of the pin, plus one bulk 4.7-10 uF per supply rail. In digital power applications where the DSC shares a board with high dv/dt switch nodes, isolate the analog supply with an LC filter or ferrite bead and route the analog ground as a quiet island tied to digital ground at a single star point under the exposed pad. Verify the exact VDD pin assignments in the 36-UQFN pin table of the family datasheet.
Do not exceed 32 KB FLASH headroom: budget for bootloader, safety/diagnostic code, and the control algorithm before committing to this MPN - if code is projected above ~24 KB, step to a larger-FLASH family sibling (e.g., 128 KB variants) in the same package family instead of re-spinning later. Also note that MP vs MC family members differ in on-chip analog configuration (op amps/comparators); confirm the specific peripheral set in the dsPIC33CK32MP103 family datasheet before copying MC-family pinmux or analog code.
In motor and power-conversion layouts, keep PWM output traces short and route them away from the op amp / ADC input traces to prevent capacitive coupling of switching edges into current-sense signals. Trigger ADC sampling synchronously with the PWM carrier (center-aligned trigger) so current samples land away from switching transients; the dsPIC33CK ADC/PWM synchronization hardware supports this directly and should be configured instead of free-running sampling for best noise immunity in closed-loop designs.
Compliance-Informationen
Distributor Hotenda lists DSPIC33CK32MP103-E/M5 as Automotive, AEC-Q100. RoHS/REACH/lead-free certificate text was not present in the verified data - confirm on Microchip product page compliance documents.
