DSPIC33CK32MP103-E/M5 - 100MHz 16-bit DSC 32KB Flash | Microchip
MPN: DSPIC33CK32MP103-E/M5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.08 | $30.80 |
| 100 | $2.74 | $274.00 |
| 500 | $2.46 | $1,230.00 |
| 1,000 | $2.19 | $2,190.00 |
DSPIC33CK32MP103-E/M5 Overview
A digital signal controller combines the compute power of a digital signal processor (DSP) with the peripheral integration and deterministic control of a microcontroller (MCU). In the embedded systems hierarchy, the dsPIC33CK sits between a general-purpose MCU and a full DSP, offering single-cycle MAC instructions and fast interrupt handling for closed-loop control loops in power conversion and motor drive systems.
Key features include the 100 MHz dsPIC33CK core with DSP-enhanced instruction set, Functional Safety (FuSa) support per Microchip's safety documentation, high-speed analog peripherals, and High-Resolution PWM for precision power conversion. The E-grade suffix specifies extended operating temperature, supporting automotive and AEC-Q100-aligned deployments per distributor listings (Hotenda lists this part as Automotive, AEC-Q100).
The architecture pairs a fast 16-bit CPU with on-chip high-speed ADC, op amps, comparators, and high-resolution PWM outputs (per the Microchip dsPIC33CK32MP103 family datasheet title), enabling single-chip control of PFC stages, LLC converters, BLDC/PMSM motors, and sensor fusion nodes. Two on-chip op amps reduce external BOM count in current-sense paths.
Typical applications include 48V-to-12V DC/DC brick power modules (e.g., the Microchip EPC9143 reference design using the dsPIC33CK32MP102 sibling), digital power supplies, brushless motor control, and advanced sensing systems.
Design consideration: budget code space carefully at 32 KB FLASH and validate ADC sampling timing against the 100 MHz core clock; the exposed-pad UQFN requires solid thermal grounding.
This page synthesizes distributor data, drop-in family alternatives, and design guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK32MP103-E/M5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK32MP103-E/M5 (same form factor and footprint) — differing in Core Processor, Operating Temperature, Package, Packaging, Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK32MP103-I/M5
✅ Drop-In✓ In Stock
$2.64 / Unit
View Datasheet →DSPIC33CK32MP105-I/M5
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK32MC105-E/M4
✅ Drop-In✓ In Stock
$3.2 / Unit
View Datasheet →DSPIC33CK32MP102-I/M5
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CK128MC503T-I/M5
✅ Drop-In✓ In Stock
$3 / Unit
View Datasheet →DSPIC33CK32MP303-I/M5
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK32MP103-E/M5 Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC 33CK (16-bit DSC core) |
| Core Size | 16-bit |
| Maximum Clock Speed | 100 MHz |
| Program Memory Size | 32 KB (32K x 8) FLASH |
| Program Memory Type | FLASH |
| Series | dsPIC 33CK, Functional Safety (FuSa) |
| Supply Voltage | 3.3 V (per Hotenda listing) |
| Package / Case | 36-UQFN (5x5 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Peripherals | High-Speed ADC, Op Amps, Comparators, High-Resolution PWM |
| Product Category | Digital Signal Controllers & Processors (DSC) |
| Qualification | Automotive, AEC-Q100 (per distributor listing) |
| Functional Safety | FuSa supported (per DigiKey listing) |
| Temperature Grade | E (extended), per part number suffix |
| Product Status | Active |
DSPIC33CK32MP103-E/M5 36-uqfn (5x5 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33CK32MP103-E/M5 (36-uqfn (5x5 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK32MP103-E/M5.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK32MP103-E/M5 is suitable for 6 applications: 48V to 12V DC/DC Power Module, Brushless DC / PMSM Motor Control, Digital Power Factor Correction (PFC), Automotive Sensing and Control Nodes, Advanced Sensing and Condition Monitoring, LED Lighting and Electronic Ballast Control.
48V to 12V DC/DC Power Module
The DSPIC33CK32MP103-E/M5 fits 48V-to-12V brick power modules because its 100 MHz dsPIC33CK core executes voltage- and current-mode compensation loops with cycle-level determinism, and its High-Resolution PWM provides sub-nanosecond-effective duty-cycle resolution for tight regulation. Microchip's EPC9143 reference design, built with Efficient Power Conversion around the same-family dsPIC33CK32MP102, demonstrates this architecture driving eGaN FETs. In a typical topology the DSC samples output voltage and inductor current through the on-chip high-speed ADC, computes the control law, and updates PWM comparators each switching period. The integrated op amps condition current-shunt signals without external amplifiers, and the extended E temperature grade plus AEC-Q100 qualification (per distributor listing) supports telecom and automotive brick environments.
Recommended
Brushless DC / PMSM Motor Control
Field-oriented control (FOC) of BLDC and PMSM motors demands fast, deterministic current loops - exactly what the DSPIC33CK32MP103-E/M5 delivers with its 100 MHz 16-bit core, single-cycle DSP MAC instructions, and high-speed ADC triggering synchronized to the PWM carrier. The on-chip op amps amplify low-level shunt or in-line phase-current signals directly, and comparators support overcurrent trip shutdown in hardware with microsecond-class response, protecting power stages independently of software latency. In a typical FOC implementation, phase currents are sampled at PWM center, Clarke/Park transforms and PI loops run in firmware, and the high-resolution PWM drives a three-phase inverter. The 32 KB FLASH accommodates FOC plus commutation and communication firmware for fans, pumps, power tools, and servo drives.
Recommended
Digital Power Factor Correction (PFC)
Continuous-conduction-mode boost PFC benefits directly from the DSPIC33CK32MP103-E/M5's architecture: the high-speed ADC samples input voltage, inductor current, and bus voltage each switching cycle, while the 100 MHz core executes average-current-mode compensation with DSP multiply-accumulate throughput that analog controllers cannot match in flexibility. High-Resolution PWM reduces pulse-width quantization jitter, improving THD at light load and enabling high switching frequencies that shrink the inductor. The on-chip comparators implement cycle-by-cycle overcurrent limiting in hardware. Because the part is qualified to AEC-Q100 per distributor data and rated for extended temperatures, it suits server power supplies, telecom rectifiers, and onboard chargers. Firmware-based control also allows adaptive mode switching between CRM and CCM for efficiency optimization across the load range.
Recommended
Automotive Sensing and Control Nodes
The DSPIC33CK32MP103-E/M5 targets automotive and functional-safety-oriented nodes: DigiKey identifies the dsPIC33CK family as Functional Safety (FuSa) capable, and distributor Hotenda lists this MPN as Automotive, AEC-Q100 qualified with an extended E temperature grade. In a 3.3V sensor acquisition node, the on-chip op amps and high-speed ADC digitize resistive or ratiometric sensor signals, while the 100 MHz core performs filtering, linearization, and diagnostic calculations locally, offloading the central ECU. Deterministic interrupt latency supports time-critical sensing loops such as position, pressure, and current monitoring. Designers should follow Microchip's FuSa documentation when the node contributes to a safety function, and use the exposed-pad UQFN grounded design for EMC robustness in electrically noisy vehicle environments.
Recommended
Advanced Sensing and Condition Monitoring
Condition-monitoring and smart-sensor endpoints use the DSPIC33CK32MP103-E/M5's combination of analog integration and DSP throughput: the high-speed ADC plus on-chip op amps capture vibration, current, or pressure waveforms, and the 100 MHz core executes FFT, RMS, envelope, or threshold algorithms locally, transmitting only condensed health indicators over UART/SPI/I2C. The 32 KB FLASH is sufficient for acquisition plus a compact analysis library when coded with DSP-enhanced instructions. Local intelligence reduces bus traffic and enables sub-millisecond fault detection in pumps, compressors, and industrial drives. The 5x5 mm UQPN footprint allows integration directly into sensor heads, and the extended E temperature rating supports harsh enclosures. AEC-Q100 qualification (per distributor listing) additionally permits use in transportation sensing applications.
Recommended
LED Lighting and Electronic Ballast Control
High-power LED drivers and HID/electronic ballasts are classic DSC applications, and the DSPIC33CK32MP103-E/M5 handles them well: its High-Resolution PWM generates phase-shifted or interleaved converter control with fine duty resolution, the high-speed ADC closes current-regulation loops each cycle for flicker-free constant-current output, and hardware comparators provide cycle-by-cycle protection against lamp or LED-string faults. The 100 MHz core also manages burst/dimming algorithms, communication (DALI-style protocols over UART), and thermal derating using on-chip temperature sensing. Because digital control stores the compensation in firmware, a single hardware platform can serve multiple wattage ratings by parameter change, cutting SKU proliferation. The compact 36-UQFN 5x5 mm package fits driver boards where clearance and height are constrained.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK32MP103-E/M5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK32MP103-I/M5 | DSPIC33CK32MP105-I/M5 | DSPIC33CK32MC105-E/M4 | DSPIC33CK128MC503T-I/M5 |
|---|---|---|---|---|---|
| Package | 36-UQFN (5x5 mm), exposed pad | 36-UQFN (5x5) - same | 36-UQFN (5x5) - same | 36-UQFN (5x5) - same | 36-UQFN (5x5) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | dsPIC33CK 16-bit @ 100 MHz | dsPIC33CK @ 100 MHz | dsPIC33CK @ 100 MHz | dsPIC33CK @ 100 MHz | dsPIC33CK @ 100 MHz |
| FLASH Memory | 32 KB | 32 KB | 32 KB (family variant) | 32 KB | 128 KB |
| Temperature Grade | E (extended), AEC-Q100 per distributor | I (industrial) | I (industrial) | E (extended) | I (industrial) |
| On-chip Op Amps / Analog | Yes (MP family: high-speed ADC, op amps, comparators) | Yes - identical MP analog set | Yes - MP analog set | MC analog configuration (verify per datasheet) | MC analog configuration (verify per datasheet) |
| Functional Safety (FuSa) Family | Yes (dsPIC33CK FuSa) | Yes | Yes | Yes (dsPIC33CK FuSa) | Yes (dsPIC33CK FuSa) |
Key Differentiators
- Extended temperature + AEC-Q100 grade (vs DSPIC33CK32MP103-I/M5)
- MP family integrated analog signal chain (vs DSPIC33CK32MC105-E/M4)
- Minimal footprint for FuSa-capable control (vs DSPIC33CK256MP205-E/M4)
- Higher on-chip memory ceiling option without package change (vs DSPIC33CK128MC503T-I/M5)
Design Notes
The M5 package is a 36-pad UQFN with exposed pad. Solder the exposed pad to a grounded copper island on the top layer with a 3x3 or larger via array stitched to internal ground planes. This is essential for heat dissipation from the 100 MHz core and for a low-inductance ground reference that keeps the high-speed ADC and PWM switching edges clean. Follow the land-pattern dimensions in the Microchip family datasheet rather than a generic UQFN-36 footprint; paste apertures under the pad should be segmented (typically 50-70% coverage) to avoid voiding during reflow.
The part operates from a 3.3V supply (per Hotenda listing). Decouple each VDD pin with 100 nF ceramics placed within 2 mm of the pin, plus one bulk 4.7-10 uF per supply rail. In digital power applications where the DSC shares a board with high dv/dt switch nodes, isolate the analog supply with an LC filter or ferrite bead and route the analog ground as a quiet island tied to digital ground at a single star point under the exposed pad. Verify the exact VDD pin assignments in the 36-UQFN pin table of the family datasheet.
Do not exceed 32 KB FLASH headroom: budget for bootloader, safety/diagnostic code, and the control algorithm before committing to this MPN - if code is projected above ~24 KB, step to a larger-FLASH family sibling (e.g., 128 KB variants) in the same package family instead of re-spinning later. Also note that MP vs MC family members differ in on-chip analog configuration (op amps/comparators); confirm the specific peripheral set in the dsPIC33CK32MP103 family datasheet before copying MC-family pinmux or analog code.
In motor and power-conversion layouts, keep PWM output traces short and route them away from the op amp / ADC input traces to prevent capacitive coupling of switching edges into current-sense signals. Trigger ADC sampling synchronously with the PWM carrier (center-aligned trigger) so current samples land away from switching transients; the dsPIC33CK ADC/PWM synchronization hardware supports this directly and should be configured instead of free-running sampling for best noise immunity in closed-loop designs.
Compliance Information
Distributor Hotenda lists DSPIC33CK32MP103-E/M5 as Automotive, AEC-Q100. RoHS/REACH/lead-free certificate text was not present in the verified data - confirm on Microchip product page compliance documents.
