DSPIC33CK512MP306T-I/PT - 16-Bit 100MIPS DSC, 512KB Flash | Microchip
Teilenummer: DSPIC33CK512MP306T-I/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.1 | $7,10 |
| 10 | $6.45 | $64,50 |
| 100 | $5.75 | $575,00 |
| 500 | $5.2 | $2.600,00 |
| 1.000 | $4.65 | $4.650,00 |
DSPIC33CK512MP306T-I/PT Übersicht
A digital signal controller combines the computational strengths of a microcontroller with the DSP capability of a digital signal processor in a single device. Within the power-management hierarchy, the dsPIC33CK family sits between general-purpose MCUs and dedicated DSPs, offering deterministic single-cycle MAC and DSP instructions alongside typical embedded control peripherals. This makes DSCs the de facto standard for digital power conversion and precision motor control.
Key differentiating features include the 100 MIPS deterministic core, dual-panel flash enabling live firmware updates, on-chip operational amplifiers that reduce external BOM cost for current-sense front ends, 12-bit ADCs supporting simultaneous multi-channel sampling, and high-resolution PWM modules suited to Field-Oriented Control (FOC). The industrial temperature grade (-40C to +85C, denoted by the -I suffix) and tape-and-reel delivery (T suffix) support automated high-volume assembly.
Architecturally, the dsPIC33CK single-core design uses an enhanced Harvard architecture with zero-overhead loops, hardware divide, and DSP multiply-accumulate instructions, providing cycle-deterministic interrupt latency essential for closed-loop control in digital power and motor drive systems.
Typical applications include brushless DC and PMSM motor Field-Oriented Control, digital switched-mode power supplies (PFC, LLC), solar micro-inverters, and e-mobility subsystems where the high-resolution PWM and fast 12-bit ADC directly improve control-loop bandwidth.
Design consideration: ensure 3.3V supply decoupling on all VDD/VDDCORE pins with low-ESR ceramics and verify flash wait-state settings at 100 MHz operation; dual-panel flash partitioning must be configured before committing to an OTA update strategy.
This page synthesizes distributor availability data, same-family drop-in alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33CK512MP306T-I/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CK512MP306T-I/PT (gleiche Bauform und Footprint) – abweichend in Package, Core, Operating Temperature, PWM, Packaging.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CK512MP306-I/PT
✅ Drop-In✓ Auf Lager
$3.98 / Stück
Datenblatt ansehen →DSPIC33CK512MP305-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.36 / Stück
Datenblatt ansehen →DSPIC33CK512MP306T-E/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CK256MP205-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.55 / Stück
Datenblatt ansehen →DSPIC33EP512MC506T-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.55 / Stück
Datenblatt ansehen →DSPIC33CK512MP306T-I/PT Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33CK 16-bit DSC core |
| Max CPU Speed | 100 MHz (100 MIPS) |
| Flash Memory | 512KB (512K x 8) dual-panel flash |
| SRAM | 64KB |
| ADC Resolution | 12-bit |
| Gehäuse | 64-TQFP (10x10 mm) |
| Versorgungsspannung | 3.0 V to 3.6 V |
| Betriebstemperatur | -40C to +85C (I grade) |
| On-chip Op Amps | Yes |
| PWM | High-resolution PWM |
| Montageart | Surface Mount |
| Packaging | Tape and Reel (T suffix) |
| Product Family | dsPIC33CK |
| Data Width | 16-bit |
| RoHS-Status | Compliant |
DSPIC33CK512MP306T-I/PT 64-tqfp (10x10 mm) Pinbelegungsleitfaden
Pinbelegung für DSPIC33CK512MP306T-I/PT (64-tqfp (10x10 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33CK512MP306T-I/PT.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33CK512MP306T-I/PT ist geeignet für 6 Anwendungs: FOC Motor Control (BLDC/PMSM), Digital Switch-Mode Power Supplies, Solar Micro-Inverters, E-Mobility and Battery Management, Industrial Automation and Robotics, Audio and DSP Signal Processing.
FOC Motor Control (BLDC/PMSM)
The DSPIC33CK512MP306T-I/PT is purpose-built for Field-Oriented Control of brushless DC and permanent-magnet synchronous motors. Its 100 MIPS deterministic core executes the Clarke/Park transforms and current PI loops with cycle-deterministic interrupt latency, while the high-resolution PWM delivers the fine duty resolution needed for low phase-current ripple at switching frequencies of 20-100 kHz. The on-chip op amps condition shunt current signals before the 12-bit ADC samples them, cutting external component count. Placed at the heart of the inverter board with 3.3V supply and current-shunt front ends, the MP306 closes current loops in single-digit microseconds, enabling smooth low-speed torque and sensorless operation via back-EMF observers stored in the 512KB flash.
Empfohlen
Digital Switch-Mode Power Supplies
In digital PFC, LLC, and buck converter designs, the DSPIC33CK512MP306T-I/PT replaces analog control loops with firmware-defined control. The 100 MHz core supports switching frequencies well beyond 100 kHz while the high-resolution PWM achieves sub-nanosecond effective duty steps, essential for tight output regulation and frequency control in LLC topologies. The 12-bit ADC with simultaneous sampling captures input voltage, output voltage, and inductor current within one switching period, and the integrated op amps buffer shunt signals without external amplifiers. The dual-panel 512KB flash allows live firmware retuning of control coefficients in deployed units, so compensation updates ship over the air without service intervention.
Empfohlen
Solar Micro-Inverters
Micro-inverter designs demand MPPT tracking, grid-synchronized current shaping, and safety compliance in a compact thermal envelope. The DSPIC33CK512MP306T-I/PT runs MPPT and grid-current control loops on the 100 MIPS core with the mathematical headroom of 512KB flash for anti-islanding, PLL grid synchronization, and compensation algorithms. High-resolution PWM drives the interleaved boost and DC-AC stages at switching frequencies that keep magnetics small, and the 12-bit ADC samples panel voltage/current and grid waveforms synchronously. The -40C to +85C industrial temperature grade suits rooftop enclosures, and live dual-panel flash updates allow MPPT firmware improvements in the installed base.
Empfohlen
E-Mobility and Battery Management
In e-bike, e-scooter, and light-EV subsystems, the DSPIC33CK512MP306T-I/PT handles traction motor FOC, battery pack monitoring, and CAN communication concurrently. The 100 MIPS core interleaves control interrupts with communication stacks from the 64KB RAM, and the 12-bit ADC plus on-chip op amps read pack current and cell voltages with minimal external circuitry. The -40C to +85C grade covers automotive-adjacent cabin and chassis environments, while the tape-and-reel format supports high-volume SMT production. The 512KB dual-panel flash stores FOC tables plus OTA bootloader images, enabling feature updates to deployed fleets over CAN without returning units to service.
Empfohlen
Industrial Automation and Robotics
Factory automation nodes require deterministic multi-axis coordination, encoder feedback processing, and robust communications. The DSPIC33CK512MP306T-I/PT processes quadrature/hall encoder inputs and executes per-axis servo loops on its 100 MIPS core, with the 12-bit ADC and integrated op amps handling analog position and current feedback. The 512KB flash holds multi-axis motion profiles and protocol stacks, while the 64KB RAM buffers trajectory data. Industrial environments benefit from the -40C to +85C rating and wide 3.0-3.6V tolerance on noisy 3.3V rails. Tape-and-reel supply supports the high volumes typical of conveyor, pick-and-place, and CNC peripheral manufacturers.
Empfohlen
Audio and DSP Signal Processing
The single-cycle DSP multiply-accumulate capability of the dsPIC33CK core makes the MP306 a fit for embedded audio processing: active noise cancellation, digital crossovers, and loudspeaker protection in powered speakers and amplifiers. The 100 MHz core sustains dozens of biquad filter sections per channel, the 12-bit ADC digitizes microphone or line-level inputs through the on-chip op amps, and PWM outputs can drive Class-D modulator stages directly. The 512KB flash stores coefficient tables and multiple tuning presets, and dual-panel flash allows A/B audio tuning updates in the field. Deterministic interrupt latency keeps filter phase behavior predictable across the audible band.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CK512MP306T-I/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CK512MP306-I/PT | DSPIC33CK512MP305-I/PT | DSPIC33CK512MP306T-E/PT | DSPIC33CK256MP205-I/PT | DSPIC33EP512MC506T-I/PT |
|---|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 70 MIPS (dsPIC33EP) |
| Flash Memory | 512KB dual-panel | 512KB dual-panel | 512KB dual-panel | 512KB dual-panel | 256KB | 512KB (single panel) |
| Temperature Grade | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) |
| On-chip Op Amps / Peripherals | Full set (op amps, 12-bit ADC, HR PWM) | Full set - identical | Trimmed set | Full set - identical | Trimmed set | EP-family set, no dual-panel flash |
| Delivery Format | Tape and Reel | Tray | Tray/Tape and Reel | Tape and Reel | Tray/Tape and Reel | Tape and Reel |
Wichtigste Unterscheidungsmerkmale
- Tape-and-reel packaging for high-volume SMT lines (vs. DSPIC33CK512MP306-I/PT)
- Full peripheral set with on-chip op amps (vs. DSPIC33CK512MP305-I/PT)
- 100 MHz dsPIC33CK core with dual-panel flash (vs. DSPIC33EP512MC506T-I/PT)
- Industrial temperature grade trade-off (vs. DSPIC33CK512MP306T-E/PT)
Designhinweise
Supply the DSPIC33CK512MP306T-I/PT from a clean 3.0-3.6V rail and decouple every VDD pin with 100 nF ceramics placed within 2 mm of the pin, plus one bulk 10 uF per supply domain. The 100 MHz core creates fast transient currents; a shared LDO with long trace inductance can cause core-voltage droop during flash write operations. Consider a dedicated 3.3V regulator or ferrite-isolated supply island for the DSC separate from high-current motor/gate-driver rails to preserve ADC accuracy.
On the 64-TQFP (10x10 mm) footprint, route PWM outputs to gate drivers as short, matched pairs and keep the ADC shunt-sense traces Kelvin-connected directly at the current shunt pads - do not share ground returns with power paths. Place the on-chip op amp feedback networks close to the respective AVDD/AGND pins. Use a solid ground plane under the DSC and stitch vias around the ADC section. Analog reference (AVDD) should be filtered with an RC or ferrite from the digital 3.3V rail.
Configure flash wait-states and verify oscillator configuration fuses before running at the full 100 MIPS - an incorrect PLL divider is the most common bring-up failure on dsPIC33CK designs. When using dual-panel flash for live updates, define the panel partition scheme in configuration words at first programming; changing partitioning later requires full-chip erase. Also confirm the I-grade (-40C to +85C) matches your worst-case enclosure temperature; select the E-grade part for up to +125C ambients.
Compliance-Informationen
RoHS compliance per standard Microchip green packaging for current-production dsPIC33CK parts; REACH and halogen-free status not stated in provided data.
