DSPIC33EP128GM304-E/ML - 70 MIPS 16-bit DSC 128KB Flash | Microchip
Teilenummer: DSPIC33EP128GM304-E/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.12 | $6,12 |
| 10 | $5.55 | $55,50 |
| 100 | $4.98 | $498,00 |
| 500 | $4.52 | $2.260,00 |
| 1.000 | $4.1 | $4.100,00 |
DSPIC33EP128GM304-E/ML Übersicht
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and control-oriented architecture of a microcontroller. Within the semiconductor hierarchy, the DSC sits above a general-purpose MCU and below a dedicated DSP processor, making the dsPIC33E family a power-management-friendly single-chip solution for embedded control systems that need math acceleration without an external DSP.
Key features include the 70 MIPS dsPIC DSC core with integrated DSP engine (single-cycle MAC, 40-bit accumulator), 3.3V operation, on-chip operational amplifiers, dual quadrature encoder interfaces (QEI), and multiple capture/compare and PWM channels. These peripherals directly target precision motor control systems, eliminating external analog front-end components.
Technical depth comes from the Enhanced Flash architecture with ECC and the Peripheral Pin Select (PPS) system, which allows digital peripherals to be remapped to many I/O pins, dramatically improving PCB layout flexibility. The GM3 family variant offers a balanced memory/peripheral configuration suited to general-purpose digital power and sensing applications.
Typical applications include sensorless and sensored brushless DC and PMSM motor control, digital power supplies (PFC, LLC), UPS systems, and industrial sensing front-ends where the integrated op-amps condition current-shunt signals before on-chip ADC sampling.
Design consideration: the -E suffix denotes the extended temperature range (-40C to +125C); the -I variant covers -40C to +85C at lower cost, so match the suffix to your thermal environment. The exposed pad must be soldered to a grounded copper pour for thermal and signal integrity.
This page synthesizes distributor data, same-family drop-in alternatives, application guidance, and design notes not found in the standard Microchip datasheet, providing selection and cross-reference value beyond the raw specifications.
Drop-in-Alternativen für DSPIC33EP128GM304-E/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP128GM304-E/ML (gleiche Bauform und Footprint) – abweichend in Core, Qualification, Package, Architecture, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP128GM304-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP256GM304-E/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.35 / Stück
Datenblatt ansehen →DSPIC33EP64GM304-E/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP128MC304-E/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC24EP128GP304-E/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP128GM304-E/ML Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33EP 16-bit DSC core |
| CPU Speed | 70 MIPS |
| Program Memory Size | 128KB (43K x 24) Flash |
| RAM Size | 16KB |
| Versorgungsspannung | 3.3 V |
| Gehäuse | 44-QFN (8x8 mm) with exposed pad |
| Betriebstemperaturbereich | -40C to +125C (E grade) |
| Montageart | Surface Mount |
| Architecture | 16-bit RISC with DSP engine |
| Program Memory Type | Flash |
| Peripheral Pin Select (PPS) | Yes |
| On-chip Op-Amps | Yes |
| Quadrature Encoder Interfaces | 2 |
| Capture/Compare Channels | 8/8 |
| Packaging | Tube |
DSPIC33EP128GM304-E/ML 44-qfn (8x8 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP128GM304-E/ML (44-qfn (8x8 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP128GM304-E/ML.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP128GM304-E/ML ist geeignet für 6 Anwendungs: Brushless DC / PMSM Motor Control, Digital Power Supplies (PFC / LLC), Uninterruptible Power Supplies (UPS), Industrial Sensing and Data Acquisition, Automotive-Adjacent and High-Temperature Embedded Control, Embedded Audio and Signal Processing.
Brushless DC / PMSM Motor Control
The DSPIC33EP128GM304-E/ML fits sensored and sensorless BLDC/PMSM drives because its dual quadrature encoder interfaces accept position feedback directly and its eight capture/compare channels and PWM outputs generate the three-phase gating signals. On-chip operational amplifiers amplify low-level shunt-resistor currents ahead of ADC sampling, enabling field-oriented control loops at 70 MIPS without external analog front-ends. The DSP engine's single-cycle MAC accelerates Clarke/Park transforms within one PWM period. Placed as the single controller between gate drivers and current-sense shunts, it removes a separate DSP from the BOM; the trade-off is a 3.3V-only supply requiring a logic-level gate-driver interface.
Empfohlen
Digital Power Supplies (PFC / LLC)
For switch-mode power conversion, the DSPIC33EP128GM304-E/ML executes voltage- and current-mode control loops within a single PWM cycle thanks to its 70 MIPS core and PWM-to-ADC synchronization. The on-chip op-amps condition inductor-current and output-voltage feedback signals, while the DSP MAC handles compensator math (PI/PID and notch filters) at low jitter. Used as the sole supervisory controller between the rectified input and the gate-driver stage, it supports PFC plus LLC topologies with adaptive dead-time control. The extended -40C to +125C rating suits enclosed server and telecom power supplies; designers must budget for its 3.3V rail and code-space footprint of 128KB Flash.
Empfohlen
Uninterruptible Power Supplies (UPS)
The DSPIC33EP128GM304-E/ML suits line-interactive and double-conversion UPS control because one 70 MIPS DSC can close the inverter voltage loop, manage battery charging, and sequence transfer relays. Its dual QEI and capture resources monitor auxiliary encoder or tachometer signals in rotary UPS designs, while the on-chip op-amps and ADCs sample bus voltage and current through shunt networks with minimal external circuitry. The 128KB Flash accommodates full control firmware plus communication stacks, and Peripheral Pin Select simplifies routing dense signals inside the compact 44-QFN 8x8 mm footprint. The -E temperature grade withstands the elevated ambient temperatures typical of UPS enclosures.
Empfohlen
Industrial Sensing and Data Acquisition
In industrial sensing nodes, the DSPIC33EP128GM304-E/ML integrates signal conditioning and processing in one device: its op-amps amplify bridge or shunt sensor outputs, the ADC digitizes them, and the DSP engine applies digital filtering and FFT-based analysis at 70 MIPS. Peripheral Pin Select maps UART, SPI, or I2C to whichever pins best reach the connector, which is valuable on a 44-QFN 8x8 mm board with dense routing. The 128KB Flash holds calibration tables and communication stacks (Modbus, CAN) alongside the acquisition firmware. The -40C to +125C range supports sensors mounted near motors, engines, or heating elements where industrial -I parts would exceed rating.
Empfohlen
Automotive-Adjacent and High-Temperature Embedded Control
Although not AEC-Q100 qualified, the -E grade of the DSPIC33EP128GM304 (-40C to +125C ambient) makes it practical for under-hood-adjacent and high-temperature industrial modules such as pumps, fans, actuators, and chargers. The 70 MIPS DSP core handles sensorless commutation and power-conversion loops, while the integrated op-amps reduce component count in harsh-environment boards where reliability favors fewer parts. Designers should derate for junction temperature using the family datasheet thermal data and ensure the exposed pad is bonded to a ground plane for heat spreading. Communication with vehicle or machine networks is handled via an external CAN transceiver.
Empfohlen
Embedded Audio and Signal Processing
The dsPIC33EP DSP engine gives the DSPIC33EP128GM304-E/ML credible capability for embedded audio processing: single-cycle MAC and dual 40-bit accumulators implement biquad IIR filters, limiters, and mixing at 70 MIPS, sufficient for multi-channel audio effects and active-crossover processing. DCI (Data Converter Interface) style serial audio ports, remappable through Peripheral Pin Select, connect directly to audio codecs, while the 128KB Flash stores filter coefficient sets and multiple presets. In powered speakers and automotive amplifiers, the same chip can also close the power-supply and protection loops. Designers should confirm codec timing against the family datasheet serial-interface specifications.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP128GM304-E/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP128GM304-I/ML | DSPIC33EP256GM304-E/ML | DSPIC33EP64GM304-E/ML | DSPIC33EP128MC304-E/ML | PIC24EP128GP304-E/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 128KB (43K x 24) | 128KB (43K x 24) | 256KB (86K x 24) | 64KB (22K x 24) | 128KB (43K x 24) | 128KB (43K x 24) |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Temperature Range | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| DSP Engine / On-chip Op-Amps | Yes (DSP MAC + op-amps) | Yes | Yes | Yes | DSP engine yes; MC-family peripheral mix | No DSP engine (MCU variant) |
| Peripheral Pin Select (PPS) | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Extended temperature range for harsh environments (vs. DSPIC33EP128GM304-I/ML)
- DSP engine with on-chip op-amps (vs. PIC24EP128GP304-E/ML)
- Cost-down path on the identical footprint (vs. DSPIC33EP256GM304-E/ML)
Designhinweise
The 44-QFN (8x8 mm) package has an exposed pad on the bottom that must be soldered to a ground copper pour - it is not optional decoration; it carries heat and ground return. Design the PCB land pattern per the Microchip family datasheet with a thermal via array (typically 5x5 vias at 1.0 mm pitch) under the pad. Peripheral Pin Select (PPS) lets you assign digital functions after layout, so route decoupling and crystal traces first, then optimize peripheral placement in firmware rather than respinning the board.
The device operates from a single 3.3V rail. Place a 0.1 uF ceramic capacitor within 2 mm of each VDD pin and a bulk 4.7-10 uF capacitor near the package; dsPIC33EP devices at 70 MIPS draw transient core current that causes brown-out resets if the local decoupling is inadequate. Enable the on-chip Brown-Out Reset and configure the internal voltage regulator per the family datasheet recommendations. Estimated: at typical operating currents documented in the datasheet electrical specifications, a linear 5V-to-3.3V regulator dissipation is modest, but switching regulators are preferred above ~100 mA system budget.
Common pitfalls when substituting within the GM3 family: (1) Flash size differs between 64GM304, 128GM304, and 256GM304 - linker scripts and configuration-bit files must be regenerated; (2) MC3 variants (e.g., DSPIC33EP128MC304) are pin-compatible but use a different PWM module, so motor-control firmware does not port directly; (3) PIC24EP128GP304 lacks the DSP engine - DSP library calls will fail to link. Always verify the target device in the MPLAB X project properties and re-run configuration-bit checks before building for a substitute part.
Compliance-Informationen
Compliance status was not stated in the provided Verified Web Data; confirm RoHS/REACH status on the official Microchip product page or environmental datasheet before design-in.
