DSPIC33EP256GM304-E/ML - 16-Bit DSC 256KB Flash 44-QFN | Microchip
MPN: DSPIC33EP256GM304-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.15 | $7.15 |
| 10 | $6.76 | $67.60 |
| 25 | $6.42 | $160.50 |
| 100 | $5.86 | $586.00 |
| 1,000 | $5.35 | $5,350.00 |
DSPIC33EP256GM304-E/ML Overview
A digital signal controller is a hybrid device that merges the computational throughput of a digital signal processor with the peripheral integration and control architecture of a microcontroller. Within the semiconductor hierarchy, the dsPIC33EP belongs to the 16-bit microcontroller and DSC class, sitting above 8-bit MCUs and below 32-bit application processors, and is optimized for deterministic, math-intensive real-time control loops.
Key features include the enhanced dsPIC core executing up to 70 MIPS, integrated DSP engine with multiply-accumulate hardware, and enhanced on-chip peripherals tailored for precision digital power and motor control. The -E/ML suffix denotes the extended (-40C to +125C) temperature grade, supporting harsh environments. Communication and analog peripherals, along with input capture, output compare, and quadrature encoder interface functions, support closed-loop control systems directly.
The architecture pairs the Harvard-style 16-bit core with a DSP engine, enabling single-cycle MAC operations commonly used in field-oriented control, filtering, and power-conversion algorithms. The exposed-pad QFN package provides low-inductance ground return and good thermal performance for a compact 8x8 mm footprint.
Typical applications include precision motor control (BLDC, PMSM, stepper), digital power supplies and inverters, and embedded control systems in automotive and industrial equipment.
When designing with this device, connect all VDD and VSS pin pairs and use any matched PGECx/PGEDx pair consistently for ICSP programming and debugging.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256GM304-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GM304-E/ML (same form factor and footprint) — differing in Package, Core, Program Memory Size, Quadrature Encoder Interfaces, Packaging.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GM304-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128GM304T-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.62 / Unit
View Datasheet →DSPIC33EP128GM306-E/PT
✅ Drop-In✓ In Stock
$6.15 / Unit
View Datasheet →DSPIC33EP256GM304-E/ML Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EP 16-bit DSC |
| Max CPU Speed | 70 MIPS |
| Program Memory Size | 256KB (85.5K x 24) Flash |
| Data RAM Size | 16KB |
| Supply Voltage | 3.3 V |
| Package | 44-QFN (8x8 mm) exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (E grade) |
| Qualification | Automotive / AEC-Q100 per Xecor product data |
| Architecture | Harvard, 16-bit with DSP engine |
| Peripherals | Input Capture x2, Output Compare x2, QEI x4, OpAmp per Mouser listing |
| Brown-Out Detect/Reset | Yes |
| Programming/Debug | ICSP via PGECx/PGEDx pairs |
| RoHS Status | RoHS3 compliant per JAK Electronics |
| Packaging | Tube |
| Product Status | Active |
DSPIC33EP256GM304-E/ML 44-qfn (8x8 mm) exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP256GM304-E/ML (44-qfn (8x8 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GM304-E/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GM304-E/ML is suitable for 6 applications: Precision Motor Control, Digital Power Supplies, Automotive Embedded Control, Industrial Automation, Digital Signal Processing Nodes, Embedded Systems Development.
Precision Motor Control
The DSPIC33EP256GM304-E/ML fits precision motor control because its 70 MIPS dsPIC33EP core executes field-oriented control (FOC) loops for BLDC and PMSM motors with deterministic timing, while integrated QEI, input capture, and output compare peripherals handle encoder feedback and PWM generation without external logic. The on-chip op-amp supports current-sense signal conditioning directly. In a typical design, the DSC generates complementary PWM for a three-phase inverter, samples phase currents each PWM cycle, and closes the current loop in software; the 256KB Flash leaves ample room for FOC tables, commutation logic, and a bootloader. The extended -40C to +125C grade suits automotive traction and pump drives.
Recommended
Digital Power Supplies
In digitally controlled AC-DC and DC-DC converters, the DSPIC33EP256GM304-E/ML provides the math throughput for compensator algorithms (PID, 3p3z) at switching frequencies of hundreds of kHz, using its DSP MAC engine and fast ADC-triggered control interrupts. The extended temperature rating and brown-out reset protect conversion integrity during supply transients, which Xecor product data highlights for the -E grade. The controller reads voltage/current feedback, computes duty cycle, and drives PWM gates with cycle-by-cycle current limiting. The 256KB Flash accommodates multiple conversion topologies, soft-start state machines, and PMBus-style communication firmware in one image, and the 44-QFN exposed-pad package simplifies thermal layout near power stages.
Recommended
Automotive Embedded Control
The -E/ML grade is positioned for automotive electronics: distributor data (FindIC, Jotrin, Xecor) identifies it as an automotive 44-pin QFN part and Xecor states AEC-Q100 compliance. Body control functions, actuator drivers, sensor fusion nodes, and small motor modules benefit from the 70 MIPS core, 256KB Flash for OTA-updatable firmware, and brown-out detect/reset that prevents corruption during crank transients. Designers typically run the DSC from a 3.3V rail derived from a load-dump-protected supply, use matched PGECx/PGEDx pairs for in-field flashing, and exploit the -40C to +125C range for under-hood placement. The compact 8x8 mm QFN conserves board area in zonal control modules.
Recommended
Industrial Automation
Industrial equipment such as conveyor drives, pumps, fans, and robotics joints requires deterministic real-time control, and the DSPIC33EP256GM304-E/ML delivers it with a 70 MIPS 16-bit DSC core, hardware QEI for position feedback, and output-compare PWM for drive stages. The 256KB Flash supports protocol stacks and diagnostics alongside the control loop, while 16KB RAM handles filter state and telemetry buffers. Its extended temperature range and robust brown-out protection suit factory-floor environments with noisy supplies and wide ambient swings. The ICSP programming interface with multiple PGEC/PGED pair choices allows flexible header placement for in-cabinet reflashing, and the exposed-pad QFN provides solid grounding against EMI from adjacent switching stages.
Recommended
Digital Signal Processing Nodes
The dsPIC33EP architecture pairs a 16-bit Harvard core with a DSP engine, and the GM304 leverages it for embedded signal processing: single-cycle MAC operations accelerate FIR/IIR filtering, FFT-based analysis, and sensor-fusion math in vibration monitors, audio front ends, and instrumentation. The 256KB Flash stores coefficient tables and algorithm libraries that a 128KB part could not hold, and 16KB RAM buffers capture windows. Peripheral integration - input capture for period measurement, output compare for stimulus generation, and on-chip op-amps per Mouser data - reduces external component count in compact sensing nodes. Sampling at 3.3V with deterministic interrupt latency keeps spectral measurements repeatable across the -40C to +125C extended temperature span.
Recommended
Embedded Systems Development
The DSPIC33EP256GM304-E/ML is a practical platform for embedded product development: Microchip's MPLAB ecosystem, free compilers, and widely available debug probes (PICkit, ICD, REAL ICE, NSDSP per Northern Software) lower tooling cost, while the 256KB Flash and 70 MIPS core give firmware teams headroom for feature growth without a migration. Multiple PGECx/PGEDx pairs let engineers place a 5-pin ICSP header at the board edge for production programming and field updates. The 44-QFN (8x8) footprint is hand-assemblable at prototype quantities and panelizes cleanly for volume. Students and professional teams alike use this family for capstone motor-control and digital-power projects backed by Microchip reference designs and motor-control PIMs.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GM304-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM304-I/ML | DSPIC33EP128GM304T-I/ML | DSPIC33EP128GM306-E/PT |
|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | Verify - listed as 64-TQFP on DigiKey |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Performance | dsPIC33EP 16-bit, 70 MIPS | dsPIC33EP 16-bit, 70 MIPS | dsPIC33EP 16-bit, 70 MIPS | dsPIC33EP 16-bit, 70 MIPS |
| Flash Memory | 256KB (85.5K x 24) | 256KB (85.5K x 24) | 128KB | 128KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- Extended temperature grade in the same footprint (vs DSPIC33EP256GM304-I/ML)
- Double the program memory versus the 128KB variant (vs DSPIC33EP128GM304T-I/ML)
- Integrated DSC peripherals reduce external component count (vs DSPIC33EP128GM306-E/PT)
Design Notes
Connect ALL VDD and VSS pin pairs of the 44-QFN package - omitting any pair is a common cause of erratic operation and failed programming on dsPIC33EP devices. The exposed pad on the 8x8 mm QFN should be soldered to a grounded copper pour for thermal dissipation and low-inductance ground return; Northern Software's dsPIC33EP256GM304 support page explicitly requires all VSS/VDD pins connected. Use a solid ground plane beneath the package and place 100 nF decoupling capacitors at every VDD pin with short, direct traces.
The dsPIC33EP256GM304 provides multiple PGECx/PGEDx pin pairs for ICSP. You may use any pair, but ICSPCLK and ICSPDAT must come from the SAME numbered pair - for example, PGEC2 for ICSPCLK requires PGED2 for ICSPDAT (per Northern Software's programming guide). Mixing pairs is a frequent prototype-bring-up failure. Route exactly one chosen pair plus MCLR to a programming header, and avoid loading these pins with LEDs or pull-downs that conflict with the programmer.
Run the device from a clean 3.3V rail. The brown-out detect/reset function (noted by Xecor product data) should be enabled in configuration bits so control firmware does not execute during supply dips - important in automotive and motor-drive systems with load-dump and inrush transients. Estimated: for typical dsPIC33EP operation near 70 MIPS, dynamic current is in the tens-of-mA range; size the regulator for the I/O load of PWM drivers in addition to the core.
Compliance Information
RoHS3 compliant per JAK Electronics product listing. AEC-Q100 automotive compliance stated by Xecor product data; verify grade level with Microchip. REACH and halogen-free status not stated in provided data.
