PIC16F18877-I/ML - 8-Bit 32MHz 56KB Flash XLP MCU | Microchip
Teilenummer: PIC16F18877-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.74 | $3,74 |
| 10 | $3.36 | $33,60 |
| 100 | $2.98 | $298,00 |
| 500 | $2.65 | $1.325,00 |
| 1.000 | $2.4 | $2.400,00 |
PIC16F18877-I/ML Übersicht
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, optimized for deterministic real-time control, low power consumption, and low BOM cost. Within the broader semiconductor taxonomy, 8-bit MCUs sit below 16-bit and 32-bit MCUs in arithmetic throughput but excel in motor control, simple sensor hubs, and battery-powered IoT edge nodes where simplicity, latency determinism, and cost matter more than raw MIPS. The PIC16F18877 implements Microchip's enhanced mid-range core with a 14-bit instruction word and XLP (eXtreme Low Power) technology.
Key features include 56KB Flash, 4KB SRAM, 256B EEPROM, 32MHz internal oscillator (no external crystal required), a 10-bit ADC with computation, multiple Core Independent Peripherals (CIPs) such as CLC, NCO, and PWM, and eXtreme Low Power modes with sub-uA sleep currents. Communication peripherals include I2C, SPI, UART with LIN/DMX/IrDA support, making the device flexible across wired and industrial protocols.
The PIC16F18877 architecture uses an internal 32MHz oscillator combined with PLL, eliminating external clock components in most designs. Functional Safety peripherals such as CRC/SCAN and HLT (Hardware Limit Timer) are integrated for safety-capable systems. The 44-QFN package integrates an exposed pad that doubles as the primary thermal path and the device ground reference.
Typical applications include IoT sensor nodes, wearable fitness devices, low-power remote controls, HVAC control, LED lighting controllers, automotive body/comfort modules, consumer appliances, and industrial sensor interfaces. XLP sleep currents in the sub-uA range make the part well-suited for energy-harvesting or coin-cell powered products where battery life dominates the BOM.
When designing with this part, observe the decoupling recommendations: place a 100nF capacitor near each VDD pin and a bulk capacitor on VDDCORE. The exposed thermal pad on the 44-QFN must be soldered to the PCB ground plane for thermal dissipation and electrical grounding per Microchip QFN package guidelines.
This page synthesizes distributor pricing, drop-in alternative MPNs, application notes, and design considerations not found in the manufacturer datasheet alone, helping procurement and engineering teams evaluate the PIC16F18877-I/ML for new designs and pin-compatible retrofits.
Drop-in-Alternativen für PIC16F18877-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F18877-I/ML (gleiche Bauform und Footprint) – abweichend in Package, ADC, Program Memory (Flash), Core Architecture, Timers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16F18877-I/PT
✅ Drop-In✓ Auf Lager
$2.18 / Stück
Datenblatt ansehen →PIC16F18857-I/ML
✅ Drop-In✓ Auf Lager
$1.39 / Stück
Datenblatt ansehen →PIC16F18876-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.15 / Stück
Datenblatt ansehen →PIC16F18875-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.55 / Stück
Datenblatt ansehen →PIC16F15376-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.45 / Stück
Datenblatt ansehen →PIC16F18877-I/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC enhanced mid-range 8-bit |
| Instruction Word Size | 14-bit |
| Program Memory (Flash) | 56 KB (32K x 14) |
| SRAM | 4 KB |
| EEPROM | 256 B |
| Maximum CPU Frequency | 32 MHz |
| Internal Oscillator | 32 MHz (no external clock required) |
| Supply Voltage (VDD) | 2.3 V to 5.5 V |
| ADC | 10-bit with computation |
| Communication Peripherals | I2C, SPI, UART (LIN/DMX/IrDA) |
| Core Independent Peripherals (CIP) | CLC, NCO, PWM, CRC/SCAN, HLT |
| Functional Safety (FuSa) | CRC/SCAN, Hardware Limit Timer (HLT) |
| Betriebstemperatur | -40 C to +85 C (Industrial) |
| Gehäuse | 44-QFN (8x8 mm) with exposed pad |
| Montageart | Surface Mount |
| MSL-Level | 3 |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC16F18877-I/ML 44-qfn (8x8 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für PIC16F18877-I/ML (44-qfn (8x8 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC16F18877-I/ML.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC16F18877-I/ML ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Node, Wearable Fitness / Health Device, Automotive Body / Comfort Module, Industrial HVAC Sensor Interface, LED Lighting Controller, Consumer Appliance Control Board.
Battery-Powered IoT Sensor Node
The PIC16F18877-I/ML's XLP technology with sub-uA sleep currents makes it an ideal host for coin-cell or 2xAA powered IoT sensor nodes transmitting on LoRa, sub-GHz, or BLE. The 32MHz core handles sensor-fusion DSP for temperature, humidity, and motion sensors while Core Independent Peripherals (CLC, NCO) offload timing-critical tasks from the CPU. Designers typically pair this MCU with an SPI temperature sensor and a UART-connected radio module, using the deep-sleep current of <1uA to achieve multi-year battery life. The 56KB Flash accommodates OTA update images and TLS-style handshake stacks common in modern IoT firmware.
Empfohlen
Wearable Fitness / Health Device
Wearable fitness bands require a small-footprint MCU with low active current and rich peripheral integration; the PIC16F18877-I/ML delivers both in a 44-QFN 8x8 mm package. The 10-bit ADC with computation handles optical heart-rate (PPG) signal conditioning, while the PWM and CLC peripherals drive vibration motors and LED indicators without CPU wakeup. According to Microchip's XLP benchmarks, active current stays under 5mA at 32MHz, supporting all-day battery life on a 100mAh Li-Po cell. The 4KB SRAM accommodates short BLE packet buffers when paired with a co-processor.
Empfohlen
Automotive Body / Comfort Module
The PIC16F18877-I/ML's Functional Safety peripherals (CRC/SCAN, Hardware Limit Timer) make it suitable for ASIL-capable body controllers in non-safety-critical paths such as interior lighting, mirror adjustment, and seat-position memory. LIN bus support via the EUSART module enables direct connection to automotive LIN transceivers without external protocol logic. Operating temperature range of -40C to +85C (industrial) or -40C to +125C (extended) covers cabin and underhood zones. The 56KB Flash supports multiple LIN slave node personalities and bootloader code for end-of-line reprogramming.
Empfohlen
Industrial HVAC Sensor Interface
Industrial HVAC controllers benefit from the PIC16F18877-I/ML's 10-bit ADC with computation, multiple PWM outputs for valve and damper actuators, and I2C/SPI connectivity for environmental sensors. The 32MHz core runs Modbus RTU or BACnet MS/TP stacks on the UART while simultaneously sampling temperature/humidity at 1kHz. The wide 2.3-5.5V VDD range accepts 24VAC-derived DC rails with simple regulators. CRC/SCAN peripherals support IEC 61508 SIL-classified HVAC safety functions such as freeze-stat and over-temperature shutdown.
Empfohlen
LED Lighting Controller
The PIC16F18877-I/ML is well-suited to digital-addressable LED lighting controllers (WS2812B, APA102, SK6812) where multiple PWM channels and tight timing are critical. Core Independent Peripherals (CLC, NCO) generate the precise 800kHz/1.2MHz WS2812 waveform without CPU intervention, freeing the 32MHz core for higher-level protocols such as DMX-512 or Art-Net over UART. The 56KB Flash accommodates color-space conversion (HSV to RGB) and animation effect libraries. The 44-QFN package's exposed pad simplifies thermal management in high-current LED driver boards.
Empfohlen
Consumer Appliance Control Board
Consumer appliances (coffee machines, washing machines, microwave ovens) require a low-cost MCU with adequate I/O for switch scanning, relay drive, and user-display interface. The PIC16F18877-I/ML provides 36+ I/O pins in the 44-QFN package, multiple timers for PWM-driven motor control, and I2C/SPI for character-LCD or segment-LCD displays. The XLP sleep modes reduce standby power below EU eco-design thresholds (typically <0.5W). The 256-byte EEPROM stores user preferences such as wash-program selection and clock settings across power cycles.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16F18877-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16F18877-I/PT | PIC16F18857-I/ML | PIC16F18876-I/ML | PIC16F18875-I/ML | PIC16F15376-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Flash | 56 KB | 56 KB | 28 KB | 28 KB | 14 KB | 28 KB |
| SRAM | 4 KB | 4 KB | 2 KB | 2 KB | 1 KB | 2 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Max CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| VDD Range | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V |
| Core Independent Peripherals | CLC, NCO, PWM, CRC/SCAN, HLT | CLC, NCO, PWM, CRC/SCAN, HLT | CLC, NCO, PWM, CRC/SCAN, HLT | CLC, NCO, PWM, CRC/SCAN, HLT | CLC, NCO, PWM, CRC/SCAN, HLT | CLC, NCO, PWM, CRC (different CIP set) |
| Unit Price (qty 1, USD) | $3.74 | $3.74 | $3.10 | $3.10 | $2.80 | $3.20 |
Wichtigste Unterscheidungsmerkmale
- Functional Safety peripherals (CRC/SCAN, HLT) integrated in base part (vs. PIC16F18857-I/ML)
- Pin-compatible migration path within PIC16F1887X family (vs. PIC16F18875-I/ML)
- Modern CIP set vs legacy PIC16F877A peripheral mix (vs. PIC16F877A-I/P (legacy))
Designhinweise
Estimated: at VDD=3.3V and 32MHz active, the PIC16F18877-I/ML consumes approximately 5mA active and <1uA in deep sleep per Microchip XLP datasheet figures. For battery-powered designs, prefer the PIC16F18877's XLP sleep mode (DOZE + IDLE + deep sleep) over bare SLEEP to minimize peripheral wakeup latency. Always disable unused peripherals via PMD registers before entering sleep to avoid phantom current draw; an unconfigured ADC can leak tens of uA.
The 44-QFN (8x8 mm) exposed pad must be soldered to a contiguous PCB ground plane via an array of thermal vias (typically 9-16 vias on a 1.2mm pitch) to meet the package's thermal and electrical ground requirements. Per Microchip QFN layout guidelines, do not route signal traces under the EP pad. Place a 100nF decoupling capacitor within 2mm of each VDD pin and a 1uF-10uF bulk capacitor near VDDCORE to suppress regulator switching noise.
Avoid the common mistake of assuming the internal 32MHz oscillator is accurate enough for UART communication without calibration. Per the Microchip datasheet, the uncalibrated HFINTOSC tolerance is +/-2% across temperature; UART baud rates require OSCTUNE calibration or a crystal for reliable LIN/CAN/RS-485 operation. Also note that the 18877 differs from the legacy 877A in register names and peripheral libraries - do not port 877A firmware directly without checking the header file mapping.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40C to +85C); for AEC-Q100 automotive qualification use the PIC16F18877-E/ML extended-temperature variant or PIC16F18877-I/MLVAO.
