DSPIC33EP256MU810-I/PT - 60MHz 256KB DSC 100-TQFP | Microchip
Teilenummer: DSPIC33EP256MU810-I/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $13.01 | $13,01 |
| 10 | $12.4 | $124,00 |
| 100 | $11.5 | $1.150,00 |
| 500 | $10.8 | $5.400,00 |
| 1.000 | $10.2 | $10.200,00 |
DSPIC33EP256MU810-I/PT Übersicht
A digital signal controller combines the compute pipeline of a digital signal processor (DSP) with the peripheral set and control architecture of a microcontroller (MCU). Within the power management hierarchy of embedded systems, the dsPIC33EP family sits above basic 16-bit MCUs and provides hardware multiply-accumulate (MAC) DSP instructions, making it a bridge between general-purpose microcontrollers and dedicated DSPs for real-time control.
Key features include high-speed PWM modules for precision motor control, dual CAN 2.0B controllers, an integrated full-speed USB 2.0 device module, multiple UART/SPI/I2C serial ports, advanced analog peripherals (12-bit ADC with multiple sample-and-hold channels), and up to 51 general-purpose I/O. The extended DSP instruction set enables single-cycle MAC and 40-bit accumulators for control-loop mathematics.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with 24-bit instruction words, hardware looping, and bit-reversal addressing for FFT operations. Flash is self-programmable, supporting field firmware updates. The peripheral ecosystem is supported by MPLAB X IDE and XC16 compiler toolchains.
Typical applications include dual-axis brushless DC and PMSM motor drives, digital power supplies (PFC, LLC), UPS systems, industrial automation nodes using dual CAN, and USB-connected instrumentation where the on-chip USB device controller removes the need for an external interface chip.
Design consideration: the 3.0-3.6 V supply requires a clean 3.3 V rail with local 0.1 uF decoupling on every VDD/VSS pair; use MPLAB Code Configurator to reduce peripheral bring-up time.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33EP256MU810-I/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP256MU810-I/PT (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Maximum CPU Speed, Core, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP256MU810-E/PT
✅ Drop-In✓ Auf Lager
$6.45 / Stück
Datenblatt ansehen →DSPIC33EP256MU810-I/PF
✅ Drop-In✓ Auf Lager
$5.4 / Stück
Datenblatt ansehen →DSPIC33EP256MU810T-I/PT
✅ Drop-In✓ Auf Lager
$4.8 / Stück
Datenblatt ansehen →DSPIC33EP256GM710T-I/PF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.4 / Stück
Datenblatt ansehen →DSPIC33EP256MU810-I/PT Grenzwerte & elektrische Eigenschaften
| Core Architecture | 16-bit dsPIC33E DSC |
| CPU Speed | 60 MHz (up to 70 MIPS) |
| Flash Program Memory | 256 KB |
| SRAM | 28 KB |
| Versorgungsspannung | 3 V to 3.6 V (3.3 V nominal) |
| I/O Ports | 51 I/O |
| Gehäuse | 100-TQFP (12x12 mm, PT) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (I grade) |
| USB | USB 2.0 full-speed device |
| CAN Controllers | Dual CAN 2.0B |
| Timers | General purpose timers / high-speed PWM |
| Serial Interfaces | UART, SPI, I2C |
| ROM Type | Flash (self-programmable) |
| Lifecycle Stage | Active |
| RoHS-Status | Compliant |
DSPIC33EP256MU810-I/PT 100-tqfp (12x12 mm, pt) Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP256MU810-I/PT (100-tqfp (12x12 mm, pt)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP256MU810-I/PT.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP256MU810-I/PT ist geeignet für 6 Anwendungs: Precision Motor Control (BLDC/PMSM Drives), Digital Power Supplies (PFC / LLC / UPS), USB-Connected Industrial Instruments, Industrial Automation and CAN Networking Nodes, Automotive-Style Body and Ancillary Control, Audio and Signal Processing Applications.
Precision Motor Control (BLDC/PMSM Drives)
Microchip positions the dsPIC33EP MU family explicitly for high-performance precision motor control. The high-speed PWM modules generate complementary outputs with dead-time insertion for three-phase inverters, while the 70 MIPS DSP core with single-cycle MAC executes field-oriented control (FOC) loops fast enough for low-inductance servo motors. The 256 KB flash holds FOC stacks plus communication firmware, and 28 KB SRAM supports state observers. The DSPIC33EP256MU810-I/PT's dual CAN 2.0B controllers connect drives into industrial networks, and its -40C to +85C grade suits drive enclosures. Use current-sense amplifiers feeding the 12-bit ADC for phase-current sampling synchronized to PWM triggers, and verify 3.3 V rail integrity at the high dV/dt environment.
Empfohlen
Digital Power Supplies (PFC / LLC / UPS)
In digitally controlled power conversion, the DSPIC33EP256MU810-I/PT closes current and voltage loops with its high-speed PWM (phase-shifted and complementary modes) and fast 12-bit ADC triggered directly from the PWM module for deterministic sampling instants. The DSP core's 40-bit accumulators handle loop-filter arithmetic without saturation concerns at 70 MIPS. The 3.0-3.6 V supply and -I temperature grade fit controller boards inside UPS and telecom rectifier enclosures. Design trade-off: unlike analog controllers, firmware-based control gives programmable protection and adaptive modes, but adds firmware validation burden; Microchip application notes provide reference software for PFC and LLC topologies on the dsPIC33EP platform.
Empfohlen
USB-Connected Industrial Instruments
The integrated USB 2.0 full-speed device module (confirmed in Mouser and Hotenda listings as '60MHz USB') lets the DSPIC33EP256MU810-I/PT enumerate directly as a USB device - no external USB interface chip required. This makes it a strong controller for bench instruments, data-logger front ends, and motor-tuning adapters that stream sensor data to a PC. Combined with UART/SPI/I2C for local sensors and 51 I/O for status and control, a single 100-pin TQFP replaces what historically required an MCU plus a USB bridge IC. Budget the 256 KB flash for the USB stack plus application; Microchip provides USB device stacks for the dsPIC33EP family in MPLAB libraries.
Empfohlen
Industrial Automation and CAN Networking Nodes
With dual independent CAN 2.0B controllers, the DSPIC33EP256MU810-I/PT can bridge two CAN buses or act as a gateway between a machine bus and a higher-level network - a common requirement in factory automation, building control, and CANopen devices. The 70 MIPS core processes protocol stacks while servicing control tasks, and 51 I/O handle digital I/O expansion. Pair the CAN controllers with 3.3 V CAN transceivers and proper bus termination. The -40C to +85C industrial rating and RoHS compliance suit standard industrial BOM requirements, and dual CAN redundancy improves node availability in safety-relevant segments of the network.
Empfohlen
Automotive-Style Body and Ancillary Control
The dual CAN interface, high-speed PWM, and rich analog integration of the dsPIC33EP256MU810-I/PT map well to auxiliary vehicle controllers - pump control, fan modules, lighting controllers, and actuator drivers - especially in off-highway and specialty equipment where a full AEC-Q100 part is not mandated. The DSP core handles sensor filtering (IIR/FIR) and PWM output stages, while CAN links the node to the vehicle backbone. Note that the -I grade is -40C to +85C; for under-hood locations verify ambient derating or evaluate the extended-temperature -E/PT variant of the same die. Use the 12-bit ADC with ratiometric sensor configurations for robust analog inputs in noisy 12 V/24 V electrical environments.
Empfohlen
Audio and Signal Processing Applications
The dsPIC33E core's DSP instruction set - single-cycle multiply-accumulate, dual operand fetch, bit-reversal addressing for FFTs - makes the DSPIC33EP256MU810-I/PT effective for real-time audio processing: active crossovers, equalization, echo cancellation, and effects processing at 48 kHz sample rates. The 12-bit ADC digitizes inputs while PWM-based or external DAC stages reconstruct output; the 70 MIPS budget supports multiple biquad filters per channel. The 256 KB flash accommodates parameter storage and multiple processing profiles. For higher-fidelity designs, pair with a dedicated audio codec over I2S-class serial interfaces or use SPI DACs; evaluate latency and dynamic range against dedicated DSP alternatives early in the design.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP256MU810-I/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP256MU810-E/PT | DSPIC33EP256MU810-I/PF | DSPIC33EP256GM710T-I/PF |
|---|---|---|---|---|
| Package | 100-TQFP (12x12 mm, PT) | 100-TQFP (PT) - same | TQFP-100 - same footprint | TQFP-100 - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MHz (70 MIPS) | 60 MHz (70 MIPS) | 60 MHz (70 MIPS) | 60 MHz (70 MIPS) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB |
| USB Module | Yes (full-speed device) | Yes (full-speed device) | Yes (full-speed device) | No (GM family) |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Lifecycle Status | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- USB device integrated on-chip (vs. DSPIC33EP256GM710T-I/PF)
- Extended temperature option on identical die (vs. DSPIC33EP256MU810-E/PT)
- Dual CAN plus USB in a single 100-pin DSC (vs. DSPIC33EP256MU810-I/PF)
Designhinweise
The DSPIC33EP256MU810-I/PT requires a 3.0-3.6 V supply. Place 0.1 uF ceramic decoupling capacitors at every VDD/VSS pin pair (the 100-pin TQFP has multiple power pairs) plus bulk capacitance near the device. Estimated: at 70 MIPS with all peripherals active, core current is in the tens-of-mA class per Microchip family data; verify exact ICC from the datasheet electrical characteristics table for your supply budget. Avoid sharing this rail with high-current PWM gate drivers - star-route or use a ferrite bead to isolate the controller rail from switching noise.
For the 100-TQFP (PT) footprint, use a 0.5 mm pitch land pattern per Microchip's package drawing and keep VDD/VSS via stubs short. Route the crystal (primary oscillator) traces short and guard them with ground; keep PWM outputs away from analog ADC inputs. The ICSP/ICD programming pins (PGD/PGC) should be brought to a 5-pin header with series 100-ohm resistors so production programming does not conflict with application circuitry. Provide testpoints on CAN_H/CAN_L for bus compliance checking.
Common pitfalls: (1) substituting a /PF part without checking the mechanical TQFP drawing - electrically identical but confirm the footprint; (2) assuming 5 V tolerance - the device is 3.0-3.6 V only; (3) forgetting to configure configuration words (oscillator source, watchdog, code protection) which are stored in flash and reset the part if wrong; (4) using the -I grade above +85C ambient - switch to the -E/PT variant for extended temperature. Always verify the USB module clock source (requires the correct oscillator setup for 12 Mbps timing).
Compliance-Informationen
RoHS compliance indicated in distributor comparison listings (etei.com RoHS field comparisons). REACH, halogen-free, and conflict-minerals status should be confirmed from Microchip's official environmental data page for this MPN.
