DSPIC33EP256MU810-E/PT - 16-bit DSC, 256KB Flash, USB | Microchip
Teilenummer: DSPIC33EP256MU810-E/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.95 | $795,00 |
| 500 | $7.1 | $3.550,00 |
| 1.000 | $6.45 | $6.450,00 |
DSPIC33EP256MU810-E/PT Übersicht
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic interrupt-driven architecture of a microcontroller with the high-throughput computational capability of a digital signal processor (DSP). In the broader system taxonomy, a DSC belongs to the microcontroller family, which sits within embedded processors, then semiconductor ICs, and finally the power management and control hierarchy used in motor control, power conversion, and digital audio systems. The 'E' suffix indicates an extended temperature grade of -40 °C to +125 °C, while the 'PT' suffix denotes the 12 x 12 mm 100-pin TQFP surface-mount package with 0.5 mm pitch.
Key features include integrated USB 2.0 full-speed OTG, two CAN modules, up to 15 DMA channels, 27 timers (nine 16-bit and eighteen 32-bit), a 16-channel 12-bit ADC with up to 500 ksps conversion, five 16-bit PWM generators with dedicated time bases and up to 8 output channels, and four compare/PWM modules with dual-edge capability. The 70 MIPS core can execute a 16x16 multiply in one cycle and supports fractional arithmetic (1.15 format) via the XAGU and DSP engine.
Typical applications include precision motor control (BLDC, PMSM, AC induction, switched reluctance), digital power conversion (PFC, LLC, phase-shifted full-bridge), automotive body and chassis ECUs, industrial drives, photovoltaic inverters, and USB-connected embedded devices. Design considerations include the need for a stable 3.3 V analog supply for the ADC, decoupling on every VDD/VSS pair, and a JTAG or PG/PG interface for in-circuit programming.
Drop-in-Alternativen für DSPIC33EP256MU810-E/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP256MU810-E/PT (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, ADC, Operating Temperature, Timers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP256MU810-I/PT
✅ Drop-In✓ Auf Lager
$10.2 / Stück
Datenblatt ansehen →DSPIC33EP256MU810T-E/PT
✅ Drop-In✓ Auf Lager
$4.62 / Stück
Datenblatt ansehen →DSPIC33EP256MU810-E/PTC01
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP256MC506-E/PT
✅ Drop-In✓ Auf Lager
$5.83 / Stück
Datenblatt ansehen →DSPIC33EP256MU810-E/PTVAO
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CK512MPT608-E/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP256GP504-I/ML
✅ Drop-In✓ Auf Lager
$5.68 / Stück
Datenblatt ansehen →DSPIC33EP256MU810-E/PT Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33E DSC (16-bit DSP-enhanced) |
| Maximum CPU Speed | 70 MIPS at 3.3 V |
| Maximale Taktfrequenz | 60 MHz |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 28 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 51 |
| DMA Channels | Up to 15 |
| Timers | 27 total (9 x 16-bit + 18 x 32-bit) |
| PWM Channels | Up to 8 output, 5 generators |
| ADC | 12-bit, up to 16 channels, 500 ksps |
| Communication Interfaces | USB 2.0 FS OTG, 2x CAN, UART, SPI, I2C |
| Betriebstemperatur | -40 °C to +125 °C (E grade) |
| Gehäuse | 100-pin TQFP (PT) 12x12 mm, 0.5 mm pitch |
| Montageart | Surface Mount |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
DSPIC33EP256MU810-E/PT Pin-Konfiguration
| Pin 1 | RP15/PWM4H/PMCS1/RB15 — Remappable I/O / PWM / parallel master chip select |
| Pin 2 | RP14/PWM3L/PMCS2/RB14 — Remappable I/O / PWM / parallel master chip select |
| Pin 3 | RP13/AN11/RB13 — Remappable I/O / analog input 11 |
| Pin 4 | RP12/AN12/RB12 — Remappable I/O / analog input 12 |
| Pin 5 | RP11/AN13/RB11 — Remappable I/O / analog input 13 |
| Pin 6 | RP10/AN14/RB10 — Remappable I/O / analog input 14 |
| Pin 7 | RP9/AN15/RB9 — Remappable I/O / analog input 15 |
| Pin 8 | RP8/AN16/RB8 — Remappable I/O / analog input 16 |
| Pin 9 | RP7/AN17/RB7 — Remappable I/O / analog input 17 |
| Pin 10 | RP6/AN18/RB6 — Remappable I/O / analog input 18 |
| Pin 11 | RP5/AN19/RB5 — Remappable I/O / analog input 19 |
| Pin 12 | RP4/AN20/RB4 — Remappable I/O / analog input 20 |
| Pin 13 | RP3/AN21/RB3 — Remappable I/O / analog input 21 |
| Pin 14 | RP2/AN22/RB2 — Remappable I/O / analog input 22 |
| Pin 15 | RP1/AN23/RB1 — Remappable I/O / analog input 23 |
| Pin 16 | OSCI/CLKI/RC12 — Oscillator crystal input / external clock |
| Pin 17 | OSCO/CLKO/RC15 — Oscillator crystal output |
| Pin 18 | VSS — Ground reference |
| Pin 19 | VDD — Digital supply 3.0-3.6 V |
| Pin 20 | MCLR — Master clear (reset) input, active-low |
| Pin 21 | TMS/RP20/PMCS1/RC4 — JTAG test mode select / remappable I/O |
| Pin 22 | TCK/RP19/PMCS2/RC3 — JTAG test clock / remappable I/O |
| Pin 23 | TDI/RP18/RC2 — JTAG test data in / remappable I/O |
| Pin 24 | TDO/RP17/RC1 — JTAG test data out / remappable I/O |
| Pin 25 | AVDD — Analog supply 3.0-3.6 V for ADC |
| Pin 26 | AVSS — Analog ground for ADC |
| Pin 27 | VREF+/CVREF+/AN0/RA0 — ADC positive reference / analog input 0 |
| Pin 28 | VREF-/CVREF-/AN1/RA1 — ADC negative reference / analog input 1 |
| Pin 29 | AN2/RA2 — Analog input 2 |
| Pin 30 | AN3/RA3 — Analog input 3 |
| Pin 31 | AN4/RA4 — Analog input 4 |
| Pin 32 | AN5/RA5 — Analog input 5 |
| Pin 33 | AN6/RA6 — Analog input 6 |
| Pin 34 | AN7/RA7 — Analog input 7 |
| Pin 35 | AN8/RA8 — Analog input 8 |
| Pin 36 | AN9/RA9 — Analog input 9 |
| Pin 37 | AVSS — Analog ground |
| Pin 38 | AVDD — Analog supply 3.0-3.6 V |
| Pin 39 | VDD — Digital supply 3.0-3.6 V |
| Pin 40 | VSS — Ground reference |
| Pin 41 | DML/RC10 — USB D- line (full-speed) |
| Pin 42 | DPL/RC9 — USB D+ line (full-speed) |
| Pin 43 | VBUS/RC8 — USB VBUS detection input |
| Pin 44 | VBUSON/AN24/RC7 — USB VBUS power enable output / analog input |
| Pin 45 | VCAP/RC5 — Internal voltage regulator output, 1.8 V core; requires 10 uF cap |
| Pin 46 | RP0/PWM1H/RD0 — Remappable I/O / PWM 1H high output |
| Pin 47 | RP1/PWM1L/RD1 — Remappable I/O / PWM 1L low output |
| Pin 48 | RP2/PWM2H/RD2 — Remappable I/O / PWM 2H high output |
| Pin 49 | RP3/PWM2L/RD3 — Remappable I/O / PWM 2L low output |
| Pin 50 | RP4/PWM3H/RD4 — Remappable I/O / PWM 3H high output |
| Pin 51 | RP5/PWM3L/RD5 — Remappable I/O / PWM 3L low output |
| Pin 52 | RP6/PWM4H/RD6 — Remappable I/O / PWM 4H high output |
| Pin 53 | RP7/PWM4L/RD7 — Remappable I/O / PWM 4L low output |
| Pin 54 | RP9/RD9 — Remappable I/O |
| Pin 55 | RP10/RD10 — Remappable I/O |
| Pin 56 | RP11/RD11 — Remappable I/O |
| Pin 57 | RP12/RD12 — Remappable I/O |
| Pin 58 | RP13/RD13 — Remappable I/O |
| Pin 59 | RP14/RD14 — Remappable I/O |
| Pin 60 | RP15/RD15 — Remappable I/O |
| Pin 61 | VSS — Ground reference |
| Pin 62 | VDD — Digital supply 3.0-3.6 V |
| Pin 63 | RP0/RE0 — Remappable I/O |
| Pin 64 | RP1/RE1 — Remappable I/O |
| Pin 65 | RP2/RE2 — Remappable I/O |
| Pin 66 | RP3/RE3 — Remappable I/O |
| Pin 67 | RP4/RE4 — Remappable I/O |
| Pin 68 | RP5/RE5 — Remappable I/O |
| Pin 69 | RP6/RE6 — Remappable I/O |
| Pin 70 | RP7/RE7 — Remappable I/O |
| Pin 71 | RF0/PWM5H — Remappable I/O / PWM 5H high output |
| Pin 72 | RF1/PWM5L — Remappable I/O / PWM 5L low output |
| Pin 73 | C1IN-/AN25/RE9 — Comparator 1 negative input / analog input 25 |
| Pin 74 | C1IN+/AN26/RE10 — Comparator 1 positive input / analog input 26 |
| Pin 75 | C1OUT/RE11 — Comparator 1 output |
| Pin 76 | C2IN-/AN27/RE12 — Comparator 2 negative input / analog input 27 |
| Pin 77 | C2IN+/AN28/RE13 — Comparator 2 positive input / analog input 28 |
| Pin 78 | C2OUT/RE14 — Comparator 2 output |
| Pin 79 | VDD — Digital supply 3.0-3.6 V |
| Pin 80 | VSS — Ground reference |
| Pin 81 | CAN1RX1/RF4 — CAN 1 receive |
| Pin 82 | CAN1TX1/RF5 — CAN 1 transmit |
| Pin 83 | CAN2RX1/RF6 — CAN 2 receive |
| Pin 84 | CAN2TX1/RF7 — CAN 2 transmit |
| Pin 85 | SDA1/RG3 — I2C 1 data |
| Pin 86 | SCL1/RG2 — I2C 1 clock |
| Pin 87 | SDA2/RG1 — I2C 2 data |
| Pin 88 | SCL2/RG0 — I2C 2 clock |
| Pin 89 | U1CTS/RF8 — UART 1 clear-to-send |
| Pin 90 | U1RTS/RF3 — UART 1 request-to-send |
| Pin 91 | U1RX/RF2 — UART 1 receive |
| Pin 92 | U1TX/RF1 — UART 1 transmit |
| Pin 93 | U2CTS/RG9 — UART 2 clear-to-send |
| Pin 94 | U2RTS/RG8 — UART 2 request-to-send |
| Pin 95 | U2RX/RG7 — UART 2 receive |
| Pin 96 | U2TX/RG6 — UART 2 transmit |
| Pin 97 | SPI1SCK/RG0 — SPI 1 clock (alt mapping) |
| Pin 98 | SPI1SDI/RG7 — SPI 1 data in (alt mapping) |
| Pin 99 | SPI1SDO/RG8 — SPI 1 data out (alt mapping) |
| Pin 100 | SPI1SS/RG6 — SPI 1 slave select (alt mapping) |
Typische Anwendungen
DSPIC33EP256MU810-E/PT ist geeignet für 6 Anwendungs: 3-Phase BLDC and PMSM Motor Control, Digital Switch-Mode Power Supply (SMPS) Control, USB-Connected Industrial Embedded Devices, Automotive Body and Chassis ECU, Industrial Sensor Hub and Data Acquisition, Photovoltaic Inverter Control.
3-Phase BLDC and PMSM Motor Control
The DSPIC33EP256MU810-E/PT's 70 MIPS DSP engine, 5 PWM generators with up to 8 outputs, and 12-bit ADC at 500 ksps make it ideal for field-oriented control of brushless DC and permanent-magnet synchronous motors. According to the Microchip datasheet, the integrated DSP engine executes Park and Clarke transforms in a single cycle, enabling FOC loop closure at 10-20 kHz. The dual CAN interfaces also let multiple axes share a real-time industrial bus.
Empfohlen
Digital Switch-Mode Power Supply (SMPS) Control
The DSPIC33EP256MU810-E/PT drives digital control loops for PFC, LLC, and phase-shifted full-bridge converters. With 70 MIPS of headroom, dedicated PWM generators with 16.67 ns resolution, and 12-bit ADCs sampling at 500 ksps, the DSC closes voltage and current loops with deterministic interrupt latency under 100 ns. The USB peripheral also enables in-field firmware and telemetry updates for grid-tied inverters.
Empfohlen
USB-Connected Industrial Embedded Devices
The integrated USB 2.0 full-speed On-The-Go transceiver makes the DSPIC33EP256MU810-E/PT a natural fit for industrial USB peripherals such as data loggers, programmable sensor hubs, and human-interface devices. The 256 KB Flash supports USB stacks (Microchip MLA) with room for application firmware, while the dual CAN interfaces extend connectivity to factory-floor networks without additional chips.
Empfohlen
Automotive Body and Chassis ECU
With extended -40 to +125 °C temperature grade, dual CAN 2.0B modules, and LIN/UART capability, the DSPIC33EP256MU810-E/PT handles automotive body control, HVAC actuators, and chassis subsystems. The 256 KB Flash stores OBD-II diagnostics and bootloader firmware; the dedicated PWM generators drive brushed and brushless DC actuators with hardware dead-time control. AEC-Q100 grade is not explicitly listed; consult Microchip for the latest automotive qualification status.
Empfohlen
Industrial Sensor Hub and Data Acquisition
The 16-channel 12-bit ADC at 500 ksps, 15 DMA channels, and 27 timers make the DSPIC33EP256MU810-E/PT well-suited to multi-sensor industrial acquisition nodes. According to the Microchip datasheet, the DMA can autonomously stream ADC samples into SRAM, freeing the CPU for statistical analysis. The USB OTG plus Ethernet-capable UARTs (via external PHY) connect the hub to plant SCADA systems.
Empfohlen
Photovoltaic Inverter Control
The DSPIC33EP256MU810-E/PT controls grid-tied photovoltaic inverters where the DSC executes MPPT algorithms, anti-islanding detection, and grid synchronization in real time. With 70 MIPS, 256 KB Flash for the MPPT plus grid-code logic, and high-resolution PWM for the IGBT bridge, the part supports single-phase and three-phase topologies. The USB OTG enables local commissioning via laptops without a separate UART-to-USB bridge.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP256MU810-E/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP256MU810-I/PT | DSPIC33EP256MC506-E/PT | DSPIC33CK512MPT608-E/PT | DSPIC33EP256MU810T-E/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (PT) 12x12 mm | TQFP-100 (PT) - same | TQFP-100 (PT) - same | TQFP-100 (PT) - same | TQFP-100 (PT) - same |
| CPU Core | dsPIC33E DSC @ 70 MIPS | dsPIC33E DSC @ 70 MIPS | dsPIC33E DSC @ 70 MIPS | dsPIC33CK DSC @ 100 MIPS | dsPIC33E DSC @ 70 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 512 KB | 256 KB |
| SRAM | 28 KB | 28 KB | 16 KB | 48 KB | 28 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | No USB | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN Modules | 2 | 2 | 2 | 3 | 2 |
| PWM Generators / Outputs | 5 generators / 8 outputs | 5 generators / 8 outputs | 8 generators / 14 outputs | 8 generators / 16 outputs | 5 generators / 8 outputs |
| Temperature Grade | -40 C to +125 C (E) | -40 C to +85 C (I) | -40 C to +125 C (E) | -40 C to +125 C (E) | -40 C to +125 C (E) |
Wichtigste Unterscheidungsmerkmale
- Integrated USB 2.0 OTG plus dual-CAN in a single 100-pin TQFP (vs. DSPIC33EP256MC506-E/PT)
- Extended -40 to +125 C temperature grade as standard (vs. DSPIC33EP256MU810-I/PT)
- dsPIC33E firmware-compatible upgrade path to 100 MHz dsPIC33CK (vs. DSPIC33CK512MPT608-E/PT)
- 5 PWM generators with 16.67 ns resolution for motor and power control (vs. DSPIC33EP256GP504-I/ML)
Designhinweise
Estimated: Power dissipation at 70 MIPS and 3.3 V with all peripherals active is approximately 60 mA (198 mW). Decouple each VDD/VSS pair with a 100 nF ceramic plus a 10 uF bulk; the VCAP pin (1) requires a 10 uF low-ESR capacitor to ground within 0.25 inch of the pin to stabilize the internal 1.8 V regulator. AVDD must be tied to VDD through a ferrite bead if ADC noise exceeds 1 LSB.
The 100-pin TQFP (PT) uses a 0.5 mm pitch and 12x12 mm footprint with a thermal pad on the underside that is NOT electrically connected. Solder the thermal pad to a copper pour to reduce junction temperature; at 200 mW total dissipation this is optional but recommended at high ambient. Keep analog traces (AN0-AN28, VREF+, VREF-) short and isolated from PWM switching traces; place the AVSS reference ground star at the ADC reference pin.
The USB D+/D- pair (DPL/DML, pins 42/41) must be routed as a 90-ohm differential pair with matched length within 150 mil and continuous reference plane; place the 15 kohm pull-down on D+ only if using device mode (not OTG). The oscillator pins (OSCI/OSCO, 16/17) require a guard ground ring and short traces within 0.2 inch of the pins; use a crystal matched to the dsPIC33E oscillator load capacitance specification.
Do not skip the VCAP capacitor - without it the internal 1.8 V regulator will oscillate and the part will fail to start. The MCLR pin (20) requires a 10 kohm pull-up to VDD; leaving it unconnected can cause intermittent resets. The PG/PGD programming pins are shared with JTAG and can be remapped; if using JTAG boundary scan, lock the alternate mapping via configuration bits to prevent debugger interference.
Estimated: Theta_JA for the TQFP-100 (PT) package on a 4-layer JEDEC test board is approximately 35 C/W. At full 200 mW dissipation and +125 °C ambient, the junction temperature stays within the 150 °C limit (175 C rise + 125 C = 150 C), but at +85 C industrial applications full-power dissipation is fine. For enclosed enclosures with limited airflow, reduce peripheral clock rates or enable sleep mode between control loops.
Compliance-Informationen
RoHS and REACH compliance per Microchip product page. AEC-Q100 qualification not explicitly confirmed for this specific variant in the verified web data - consult Microchip product selector for automotive-grade ordering codes.
