DSPIC33EP32GS504-I/ML - 16-Bit 70 MIPS DSC 32KB Flash | Microchip
Teilenummer: DSPIC33EP32GS504-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.72 | $4,72 |
| 10 | $4.25 | $42,50 |
| 100 | $3.78 | $378,00 |
| 500 | $3.45 | $1.725,00 |
| 1.000 | $3.12 | $3.120,00 |
DSPIC33EP32GS504-I/ML Übersicht
A digital signal controller combines the computational throughput of a DSP core with the deterministic interrupt architecture and peripheral set of a microcontroller. Within the power-management hierarchy, the dsPIC33EP family occupies the role of the digital control loop engine in SMPS, PFC, and power-conversion systems, replacing analog control ICs where flexibility, adaptive algorithms, and communication are required.
Key differentiating features include a 70 MIPS dsPIC33E core operating at 3.3V, seven high-resolution PWM channels with advanced timing for peak current mode control, a 12-bit ADC capable of sampling up to 4 Msps in specific configurations, and hardware support for functional safety (FuSa) development. The interconnected PWM-ADC-comparator fabric minimizes control-loop latency, a decisive parameter in digital power conversion where loop delay directly limits achievable bandwidth.
The architecture couples a 16-bit modified Harvard core with DSP instructions (MAC, DSP multiply) executed in single cycle, plus an internal fast RC oscillator and PLL for clock generation. Operating temperature for the -I suffix is -40C to +85C (industrial), with supply voltage of 3.0V to 3.6V.
Typical applications include AC-DC and DC-DC digital power supplies, power factor correction stages, solar micro-inverters, battery chargers, LED drivers, and embedded motor control. Microchip's 750W AC-DC reference design (semi-bridgeless PFC followed by peak-current-controlled ZVS full-bridge with digital slope compensation) is based on this family.
Design consideration: budget PWM resolution against converter switching frequency - at 70 MIPS, effective PWM resolution degrades at very high switching frequencies, so verify step size per the family datasheet.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical digital-power design notes beyond what the manufacturer datasheet provides.
Drop-in-Alternativen für DSPIC33EP32GS504-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP32GS504-I/ML (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Core Architecture, Flash Program Memory, Functional Safety Support.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP16GS504-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GS504-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.45 / Stück
Datenblatt ansehen →DSPIC33EP128GS504-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP32MC504-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.65 / Stück
Datenblatt ansehen →DSPIC33EP32GS504-I/ML Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33E 16-bit DSC |
| Max CPU Speed | 70 MIPS |
| Flash Memory | 32KB (32K x 8) |
| RAM | 4K x 8 |
| Versorgungsspannung | 3.0 V to 3.6 V |
| Betriebstemperatur | -40C to +85C (industrial, -I suffix) |
| Gehäuse | 44-QFN (8x8 mm) with exposed pad |
| Montageart | Surface Mount |
| Product Family | dsPIC33EPXXGS50X (Digital Power) |
| Key Peripherals | High-Speed PWM, High-Speed ADC, DAC, PGA, Comparators |
| Primary Application Focus | Digital Power SMPS, Power Conversion |
| Functional Safety Support | Yes (FuSa) |
| Packaging | Tube |
| Lebenszyklusstatus | In Production |
DSPIC33EP32GS504-I/ML 44-qfn (8x8 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP32GS504-I/ML (44-qfn (8x8 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP32GS504-I/ML.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP32GS504-I/ML ist geeignet für 6 Anwendungs: Digital AC-DC Power Supplies, Power Factor Correction (PFC), DC-DC Converters and Point-of-Load, Solar Micro-Inverters, LED Drivers and Lighting Power, Digital Battery Chargers.
Digital AC-DC Power Supplies
The DSPIC33EP32GS504-I/ML is purpose-built for digitally controlled AC-DC converters. Its interconnected high-speed PWM, high-speed ADC and comparators close current-mode control loops with hardware-triggered sampling, minimizing loop delay that would otherwise limit bandwidth. Microchip's 750W AC-DC reference design demonstrates this exact role: semi-bridgeless PFC followed by a peak-current-controlled zero-voltage-switching full-bridge converter with digital slope compensation, achieving very high conversion efficiency. The 70 MIPS core executes compensation and housekeeping concurrently, while the 32KB Flash holds both loop code and PMBus-style supervisory logic. Designers place the DSC as the single controller for PFC and DC-DC stages, reducing BOM versus separate analog controllers. Verify PWM resolution against switching frequency per datasheet 70005127d to guarantee adequate duty-cycle step size at target operating frequency.
Empfohlen
Power Factor Correction (PFC)
For PFC stages, the DSPIC33EP32GS504-I/ML runs both the fast inner current loop and the slower outer voltage loop in one 70 MIPS controller. The interconnected high-speed PWM module supports advanced timing and dead-band control needed by semi-bridgeless and interleaved PFC topologies, while the high-speed ADC samples inductor current synchronized to PWM edges, keeping sampling delay predictable. The on-chip DAC and comparators support peak current limiting in hardware with sub-microsecond response, independent of software. Microchip's semi-bridgeless PFC reference design within the 750W AC-DC design is based on this family. With 3.0-3.6V operation and industrial -40C to +85C temperature range, the part suits server and telecom power supplies where efficiency regulations make digital PFC the default architecture.
Empfohlen
DC-DC Converters and Point-of-Load
In DC-DC conversion, the DSPIC33EP32GS504-I/ML provides multi-loop control of buck, boost, and LLC topologies from a single 44-QFN device. The high-resolution interconnected PWM gives the duty-cycle precision required at hundreds of kHz switching frequencies, and hardware comparators implement cycle-by-cycle current limiting without CPU intervention. The 12-bit high-speed ADC streams output voltage and current telemetry for adaptive tuning, while the 32KB Flash accommodates compensation networks, soft-start sequencing, and fault logging. Digital implementations allow runtime retuning of loop gains that fixed analog controllers cannot offer. The exposed-pad QFN package conducts heat to the PCB for reliable operation near hot power stages. Engineers should verify PWM effective resolution at the target switching frequency using the family datasheet tables before committing the design.
Empfohlen
Solar Micro-Inverters
Grid-tied micro-inverters demand MPPT algorithms, grid synchronization, and multiple interleaved power stages - a workload matched to the DSPIC33EP32GS504-I/ML. The 70 MIPS DSP core executes MPPT search and PLL-based grid phase locking, while the interconnected high-speed PWM generates precisely phased gate drives for interleaved stages. The high-speed ADC samples panel voltage, current, and grid waveforms with hardware-triggered timing, and the DAC/comparator fabric provides hardware over-current protection independent of the CPU. Digital slope compensation support, highlighted in Microchip's ZVS full-bridge reference design, directly benefits the isolation stage of an inverter. Industrial temperature rating and single 3.3V supply simplify integration on outdoor-rated electronics. Verify grid-code compliance firmware fits within 32KB Flash or select the pin-compatible 64KB sibling.
Empfohlen
LED Drivers and Lighting Power
Digitally controlled LED drivers use the DSPIC33EP32GS504-I/ML to combine constant-current regulation with dimming, communication, and protection in one controller. The high-speed PWM channels produce both the power-conversion switching waveform and independent dimming channels, while the high-speed ADC monitors LED current for tight regulation across temperature. Hardware comparators give open-circuit and short-circuit responses faster than any software loop, protecting the LED string. The 32KB Flash stores dimming curves, DALI/DMX-style protocol handlers, and fault diagnostics simultaneously. Operating from a 3.0-3.6V rail with -40C to +85C rating, the part suits industrial luminaires and outdoor drivers. Because lighting firmware is typically compact, the pin-compatible DSPIC33EP16GS504 offers a cost-down path within the identical 44-QFN footprint.
Empfohlen
Digital Battery Chargers
Smart battery chargers benefit from the DSPIC33EP32GS504-I/ML's ability to run charge-profile state machines, CC/CV regulation loops, and safety supervision concurrently. The interconnected PWM drives the charging converter stage, the high-speed ADC samples battery voltage and current with synchronized timing, and the DAC/comparator pair enforces hardware current limits that survive firmware faults. Charge termination algorithms, temperature derating, and status communication all fit within the 32KB Flash for common chemistries such as Li-ion and lead-acid. The 70 MIPS headroom allows adaptive algorithms that extend battery life versus fixed analog charge ICs. Industrial temperature range supports chargers embedded in power tools and e-mobility products. Designers should validate PWM resolution at their chosen switching frequency per datasheet 70005127d, and reserve headroom for future profile updates or step to the pin-compatible 64KB variant.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP32GS504-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP16GS504-I/ML | DSPIC33EP64GS504-I/ML | DSPIC33EP128GS504-I/ML | DSPIC33EP32MC504-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 32KB (32K x 8) | 16KB | 64KB | 128KB | 32KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Core | dsPIC33E 16-bit DSC | dsPIC33E 16-bit DSC | dsPIC33E 16-bit DSC | dsPIC33E 16-bit DSC | dsPIC33EP 16-bit (MC motor-control family) |
| Application Focus | Digital power SMPS, high-speed ADC, DAC | Digital power (reduced memory) | Digital power (expanded memory) | Digital power (maximum memory) | Motor control family |
| Operating Temperature | -40C to +85C (I suffix) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Pin-to-Pin Drop-In | Reference (44-QFN 8x8) | Yes - same footprint | Yes - same footprint | Yes - same footprint | Yes - same footprint, verify PWM feature mapping |
Wichtigste Unterscheidungsmerkmale
- Balanced memory at lowest cost point (vs. DSPIC33EP64GS504-I/ML)
- Double the Flash at same footprint (vs. DSPIC33EP16GS504-I/ML)
- Digital-power peripheral set (vs. DSPIC33EP32MC504-I/ML)
Designhinweise
Do not confuse DSPIC33EP32GS504-I/ML (44-QFN 8x8) with DSPIC33EP32GS504-I/PT (44-TQFP 10x10): the silicon is identical but the footprints are incompatible, so a PCB designed for /ML cannot accept /PT. When substituting across Flash sizes (16GS504, 64GS504, 128GS504), keep the same /ML package suffix to remain drop-in. Also confirm RAM and peripheral counts against datasheet 70005127d since minor family differences may exist between GS50X members.
The QFN exposed pad is the primary ground and thermal path: connect it to a solid ground plane through an array of vias (typically 5x5 or similar thermal via pattern under the pad). Decouple the 3.3V supply with at least one 0.1uF ceramic close to each VDD pin pair plus bulk capacitance. Keep the high-speed ADC input traces short and away from PWM switching nodes to preserve sampling accuracy in the digital control loop.
The device operates from a single 3.0V to 3.6V rail (3.3V nominal). Estimated: typical core currents for dsPIC33EP devices at 70 MIPS are in the tens-of-mA range, so a small LDO or buck output suffices; consult the family datasheet current-consumption tables for exact figures. For systems with 12V or 24V intermediate buses, place a small DC-DC to create the 3.3V digital rail, and sequence it so VDD is stable before PWM outputs drive external MOSFET gate drivers.
Compliance-Informationen
Compliance data not explicitly present in provided web data. Modern Microchip active parts are typically RoHS compliant, but this must be verified on the Microchip product page or datasheet before publication.
