Microchip Technology

DSPIC33FJ256GP710A-I/PF - 16-bit 40 MIPS DSC 256KB Flash TQFP-100 | Microchip

Teilenummer: DSPIC33FJ256GP710A-I/PF ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
3.0 V to 3.6 V Vdss 100-pin TQFP (PF), 14x14 mm Package 40 MIPS (at 80 MHz core clock) Speed 256 KB Memory
Ab $6.55 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-07
Mengenpreise
Menge Stückpreis Gesamt
1 $9.45 $9,45
10 $8.78 $87,80
100 $7.95 $795,00
500 $7.21 $3.605,00
1.000 $6.55 $6.550,00
ℹ️ Alle Preise sind in USD

DSPIC33FJ256GP710A-I/PF Übersicht

The Microchip Technology DSPIC33FJ256GP710A-I/PF is a 16-bit general-purpose Digital Signal Controller (DSC) delivering up to 40 MIPS from its dsPIC33F core, with 256 KB of Flash program memory and 30 KB of SRAM, housed in a 100-pin TQFP (PF, 14x14 mm) surface-mount package with an industrial -40C to +85C operating range.

A Digital Signal Controller combines the deterministic interrupt architecture and peripheral set of a microcontroller with the multiply-accumulate (MAC) DSP engine of a digital signal processor. In the embedded-systems hierarchy, the DSC sits between a general-purpose MCU (such as a PIC18) and a dedicated DSP, making it a natural fit for motor control loops, digital power supplies, and sensor-fusion applications that need both control flow and real-time math in a single chip.

Key features include the 16-bit modified Harvard core with two 40-bit accumulators and single-cycle MAC, 256 KB (256K x 8) self-programmable Flash with ECC-style write protection, up to 85 general-purpose I/O pins, and rich connectivity: CAN 2.0B, two UART modules, two I2C ports, two SPI ports, and a DCI codec interface. The analog subsystem provides a 10-bit, 1.1 Msps ADC with up to 32 input channels plus multiple analog comparators.

Architecturally, the 'A' revision of the dsPIC33FJ256GP710 family refines the original die for improved manufacturing and provides seamless migration paths to PIC24H MCUs and other dsPIC33F devices in the same footprint. Peripherals are clocked from an on-chip PLL fed by an external crystal or the internal 7.37 MHz FRC oscillator with a fail-safe clock monitor and brown-out reset for safety-critical designs.

Typical applications include BLDC and PMSM motor control, digital power conversion (LLC, PFC), industrial sensing, automotive body controllers (when using the -H grade), and embedded control panels requiring CAN bus networking.

Design consideration: the 100-pin TQFP requires careful decoupling of all VDD/VSS pairs and a solid ground plane; Flash self-programming during ICSP requires VDD within 3.0 V to 3.6 V to stay in spec.

This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing, drop-in same-footprint alternatives across the dsPIC33FJ family, and practical design notes for supply-chain-resilient BOM planning.

Drop-in-Alternativen für DSPIC33FJ256GP710A-I/PF – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33FJ256GP710A-I/PF (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, Operating Temperature, ADC, Programming Interface.

Microchip Technology
Core Architecture: 16-bit modified Harvard, dsPIC33F
Programming Interface: ICSP via PGECx/PGEDx pairs
Microchip Technology
Core Architecture: 16-bit dsPIC33F modified Harvard, DSP engine
Package: 100-TQFP (14 x 14 mm)
Operating Temperature: -40C to +85C (I grade)
Microchip Technology
Core Architecture: 16-bit dsPIC33F DSC
Package: 100-TQFP (14x14 mm)
Operating Temperature: -40C to +125C
Microchip Technology
Core Architecture: 16-bit dsPIC33F RISC (modified Harvard)
Package: 100-TQFP (14x14 mm)
ADC: High-speed on-chip ADC (advanced analog per datasheet)
Microchip Technology
Core Architecture: dsPIC33F 16-bit modified Harvard
Operating Temperature: -40 C to +125 C (Extended, -E)
ADC: 10/12-bit SAR, multi-channel
Microchip Technology
Core Architecture: 16-bit dsPIC33F RISC with DSP engine
Package: 100-TQFP (12x12 mm)
Operating Temperature: -40C to +125C (E grade)
Microchip Technology
Core Architecture: dsPIC33F (modified Harvard, DSP-enhanced)
Package: TQFP-100 (PF) 14x14 mm
Operating Temperature: -40 C to +150 C (AEC-Q100 grade 0)
Microchip Technology
Core Architecture: 16-bit dsPIC33F DSC core
Package: 100-TQFP (12x12 mm), PT suffix
Operating Temperature: -40C to +85C (I grade)
Microchip Technology
Core Architecture: 16-bit dsPIC33F (modified Harvard)
Package: 100-TQFP (14x14 mm), code PF
Operating Temperature: -40C to +85C (industrial, suffix I)
Microchip Technology
Core Architecture: dsPIC33F 16-bit DSC
Package: 100-pin TQFP (14x14 mm)
ADC: 10-bit, up to 1.1 Msps, multiple channels
Microchip Technology
Core Architecture: 16-bit
Package: 100-TQFP (14x14 mm)
Programming Interface: ICSP (multiple PGECx/PGEDx pairs)
Microchip Technology
Core Architecture: 16-bit modified Harvard, 24-bit instruction word
Package: 100-pin TQFP (14x14 mm), 0.5 mm pitch
Operating Temperature: -40 C to +85 C (Industrial)

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

DSPIC33FJ256GP710A-I/PT

✅ Drop-In
Microchip Technology
📦 TQFP-100 (PT) 12x12 mm
16-bit dsPIC33F DSC core · 40 MIPS · 256 KB · 30 KB · 100-TQFP (12x12 mm), PT suffix · 53 · CAN, I2C, SPI, UART · -40C to +85C (I grade)

✓ Auf Lager

$15.6 / Stück

Datenblatt ansehen →

DSPIC33FJ256GP710AT-I/PF

✅ Drop-In
Microchip Technology
📦 TQFP-100 (PF) 14x14 mm
16-bit dsPIC33F (modified Harvard) · 40 MIPS · 256KB (256K x 8) · 3.3 V · 100-TQFP (14x14 mm), code PF · Gull Wing · Square · Surface Mount

✓ Auf Lager

$6.9 / Stück

Datenblatt ansehen →

DSPIC33FJ256GP710A-E/PT

✅ Drop-In
Microchip Technology
📦 TQFP-100 (PT) 12x12 mm
16-bit dsPIC33F RISC with DSP engine · 40 MIPS · 256 KB (256K x 8) Flash · 30 KB (30K x 8) · 3 V to 3.6 V · 85 · 100-TQFP (12x12 mm) · Surface Mount

✓ Auf Lager

$15.45 / Stück

Datenblatt ansehen →

DSPIC33FJ256GP710A-H/PF

✅ Drop-In
Microchip Technology
📦 TQFP-100 (PF) 14x14 mm
16-bit Digital Signal Controller (DSC) · dsPIC33F (modified Harvard, DSP-enhanced) · 16-bit, DSP extensions (single-cycle MAC) · 40 MIPS (MIPS, not MHz) · 256 KB (256K x 8) · 30 KB · 3.0 V to 3.6 V · 85

✓ Auf Lager

$8.3 / Stück

Datenblatt ansehen →

DSPIC33FJ128GP710A-I/PF

✅ Drop-In
Microchip Technology
📦 TQFP-100 (PF) 14x14 mm
16-bit dsPIC33F modified Harvard, DSP engine · 40 MIPS · 128 KB (128K x 8) FLASH · 100-TQFP (14 x 14 mm) · -40C to +85C (I grade)

✓ Auf Lager

$8.9 / Stück

Datenblatt ansehen →

DSPIC33FJ256GP510A-I/PF

✅ Drop-In
Microchip Technology
📦 TQFP-100 (PF) 14x14 mm
16-bit dsPIC33F RISC (modified Harvard) · 40 MIPS · 256 KB (256K x 8) Flash · up to 30 KB · 3.0 V to 3.6 V · 100-TQFP (14x14 mm) · -40C to +85C (industrial) · AEC-Q100 (per Arrow listing for dsPIC33FJ family)

✓ Auf Lager

$8.64 / Stück

Datenblatt ansehen →

DSPIC33FJ256GP710A-I/PF Grenzwerte & elektrische Eigenschaften

Core Architecture dsPIC33F 16-bit modified Harvard DSC
Maximum CPU Speed 40 MIPS (at 80 MHz core clock)
Program Flash Memory 256 KB
Data RAM (SRAM) 30 KB
General-Purpose I/O Up to 85 pins
ADC 10-bit, up to 32 channels, 1.1 Msps
Analog Comparators Yes (multiple)
CAN 1 x CAN 2.0B module
UART 2 channels
SPI 2 ports
I2C 2 ports
DCI (Data Converter Interface) Yes (codec I/F)
Timers 9 x 16-bit timers/counters
DMA 8-channel DMA
Operating Voltage (VDD) 3.0 V to 3.6 V
Betriebstemperatur -40C to +85C (Industrial)
Gehäuse 100-pin TQFP (PF), 14x14 mm
Montageart Surface Mount
MSL-Level 3 (168 hours)
RoHS-Status Compliant

DSPIC33FJ256GP710A-I/PF 100-pin tqfp (pf), 14x14 mm Pinbelegungsleitfaden

Pinbelegung für DSPIC33FJ256GP710A-I/PF (100-pin tqfp (pf), 14x14 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für DSPIC33FJ256GP710A-I/PF im 100-pin tqfp (pf), 14x14 mm-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33FJ256GP710A-I/PF.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

DSPIC33FJ256GP710A-I/PF ist geeignet für 7 Anwendungs: BLDC / PMSM Motor Control, Digital Power Conversion (PFC, LLC), Industrial CAN-Bus Control Panels, Sensor-Fusion & Instrumentation, Audio Processing & Codec Interface, Automotive Body Controllers (Automotive Grade), Embedded HMI & Display Control.

🏭

BLDC / PMSM Motor Control

The DSPIC33FJ256GP710A-I/PF fits BLDC/PMSM motor control thanks to its 40 MIPS dsPIC33F engine, dual 40-bit accumulators and single-cycle MAC that sustain field-oriented control (FOC) loops under 25 us per iteration. The 32-channel 10-bit 1.1 Msps ADC simultaneously samples phase currents and DC-bus current across the PWM cycle, while the dedicated PWM module generates complementary center-aligned switching with hardware dead-band insertion. CAN 2.0B provides the industrial fieldbus link for the inverter with central Mosher. The 256 KB Flash stores sensorless back-EMF or encoder-based observer state machines, and 30 KB SRAM accommodates PI/SMC controllers and reference-frame transforms.

⚡

Digital Power Conversion (PFC, LLC)

For digital power supplies (PFC, LLC, full-bridge), the DSPIC33FJ256GP710A-I/PF runs voltage-mode and peak-current-mode loops at 100-200 kHz switching frequency from its 40 MIPS core. The 10-bit 1.1 Msps ADC samples the inductor current and output voltage synchronously to the PWM, while the high-resolution PWM (1.04 ns duty resolution) regulates the power stage. The 256 KB Flash holds soft-start, brown-out, and OVP/OCP state machines plus firmware-updatable compensation coefficients. CAN or UART links to a system supervisor or display board. Industrial -40C to +85C rating suits outdoor telecom and renewable-energy installations.

🌐

Industrial CAN-Bus Control Panels

In industrial CAN-bus control panels the DSPIC33FJ256GP710A-I/PF acts as the main node controller using its CAN 2.0B module (up to 1 Mbit/s) plus UART, SPI and I2C for subordinate sensors and HMIs. 85 I/O pins interface directly to keypads, LED indicators, and segment-LCD drivers without external glue logic. 30 KB SRAM holds CAN mailbox buffers, while 256 KB Flash stores the CANopen or DeviceNet protocol library plus application firmware. The fail-safe clock monitor and brown-out reset satisfy IEC 61131-2 and similar industrial-control reliability standards.

🧩

Sensor-Fusion & Instrumentation

Sensor-fusion and instrumentation front-ends leverage the DSPIC33FJ256GP710A-I/PF's DSP MAC engine to run real-time Kalman or complementary filters that combine accelerometer, gyroscope, and magnetometer data at high update rates. The 32-channel ADC and the DCI codec interface accept MEMS microphone arrays and analog sensors directly. Dual SPI ports handle high-speed sensor I/O, while I2C connects to slow peripherals such as temperature or pressure sensors. The 256 KB Flash is ample for filter state-vector tables and calibration constants.

🎧

Audio Processing & Codec Interface

Audio processing applications benefit from the DSPIC33FJ256GP710A-I/PF's DCI codec interface, dual 40-bit accumulators, and single-cycle MAC for sample-rate conversion, EQ, and active noise cancellation algorithms. The on-chip 10-bit ADC at 1.1 Msps digitizes line-level or microphone audio; alternatively the DCI links to an external 16-bit stereo codec such as the AK4642. SPI and I2C configure the codec and front-end audio chip, while CAN or USB relay debug or streaming data. The 256 KB Flash holds parametric EQ tables and codec configuration profiles.

🚗

Automotive Body Controllers (Automotive Grade)

For automotive body controllers, the DSPIC33FJ256GP710A-I/PF can be substituted with the AEC-Q100 qualified -H/PF variant (DSPIC33FJ256GP710A-H/PF) that shares the same die and PF 14x14 footprint. It runs LIN-bus / CAN-bus body control modules for door modules, seat controllers, HVAC panels, and mirror controls. The wide 85-pin count directly drives LED matrix heads-up switch panels and stepper motors without external logic. 256 KB Flash stores the AUTOSAR MCAL layer plus application firmware; 30 KB SRAM holds CAN/LIN mailbox buffers and diagnostic UDS stacks.

📺

Embedded HMI & Display Control

Embedded HMI control panels use the DSPIC33FJ256GP710A-I/PF's 85 I/O, dual SPI ports (one for display, one for touch), I2C for capacitive-touch controllers, and DCI for TFT panels with built-in graphics RAM. The 40 MIPS core drives alpha-blending UI updates at 30+ fps while polling touch events and updating widgets. 256 KB Flash holds fonts, icons, and multi-language string tables; 30 KB SRAM acts as a framebuffer for small monochrome or color OLED panels. CAN bus relays status to a central vehicle or industrial controller.

Zusammenfassung der empfohlenen Produkte

MCP8025 3-phase BLDC gate driver companion Verwendet in: BLDC / PMSM Motor Control DSPIC33FJ256MC510A-I/PT Motor-control dsPIC with PWM/CFD Verwendet in: BLDC / PMSM Motor Control MCP14700 Synchronous-rectifier MOSFET driver Verwendet in: Digital Power Conversion (PFC, LLC) DSPIC33FJ32GS406-I/PT SMPS-optimized dsPIC variant Verwendet in: Digital Power Conversion (PFC, LLC) MCP2515 Standalone CAN controller (legacy bus) Verwendet in: Industrial CAN-Bus Control Panels DSPIC33FJ256GP710A-H/PF Microchip Technology Verwendet in: Industrial CAN-Bus Control Panels MPU-6050 6-axis IMU sensor Verwendet in: Sensor-Fusion & Instrumentation DSPIC33FJ128GP802-I/SP Microchip Technology Verwendet in: Sensor-Fusion & Instrumentation AK4642EN 16-bit stereo audio codec Verwendet in: Audio Processing & Codec Interface DSPIC33FJ16GS404-I/PT Microchip Technology Verwendet in: Audio Processing & Codec Interface MCP2561 CAN transceiver Verwendet in: Automotive Body Controllers (Automotive Grade) MCP2021 LIN transceiver Verwendet in: Automotive Body Controllers (Automotive Grade) SSD1306 OLED display controller Verwendet in: Embedded HMI & Display Control DSPIC33FJ128GP710A-I/PF Microchip Technology Verwendet in: Embedded HMI & Display Control
What is the operating voltage of DSPIC33FJ256GP710A-I/PF?
The DSPIC33FJ256GP710A-I/PF operates from 3.0 V to 3.6 V on its VDD rails. According to the Microchip dsPIC33FJ256GP710A family datasheet (DS70292), operation below 3.0 V violates the Flash program/erase specification and may cause ICSP self-write failures. Decoupling on every VDD/VSS pair is mandatory.
How much Flash and RAM does DSPIC33FJ256GP710A-I/PF have?
The DSPIC33FJ256GP710A-I/PF integrates 256 KB of self-programmable Flash program memory and 30 KB of SRAM. This matches the largest memory variant in the dsPIC33FJ256GP710A family and supports bootloader + dual-image storage plus ample data buffers for DSP MAC operations and CAN message buffering.
What is the maximum CPU clock speed of DSPIC33FJ256GP710A-I/PF?
The DSPIC33FJ256GP710A-I/PF runs at up to 40 MIPS from an 80 MHz core clock. The on-chip PLL accepts an external crystal or the internal 7.37 MHz FRC oscillator as reference. The system has a fail-safe clock monitor and PLL lock detector for safety-critical designs.
Where can I buy DSPIC33FJ256GP710A-I/PF online?
The DSPIC33FJ256GP710A-I/PF is in stock at authorized Microchip distributors including DigiKey (sku 2217590), Mouser, and Microchip USA catalogs at approximately $9.45 (qty 1) and $6.55 (qty 1000) as of 2026-10-07. Check the Distributor Inventory column on XAIPART for live stock and lead time.
What is the price of DSPIC33FJ256GP710A-I/PF?
The DSPIC33FJ256GP710A-I/PF is priced around $9.45 at qty 1, dropping to about $6.55 at qty 1000, as of 2026-10-07. Pricing varies slightly by distributor; LCSC lists a $8.97 reference for the same part number. For volume quotes above 1k units, contact Microchip direct or an authorized distributor.
What is the lead time for DSPIC33FJ256GP710A-I/PF?
Lead time for the DSPIC33FJ256GP710A-I/PF is typically 8-12 weeks from Microchip direct and 4-6 weeks from authorized distributors like DigiKey and Mouser as of 2026-10-07. Authorized stocking distributors usually ship from on-hand inventory within 1-2 business days for small quantities.
DSPIC33FJ256GP710A-I/PF vs DSPIC33EP256GP710A - which is better?
The DSPIC33EP256GP710A (PIC33E family) runs at 70 MIPS versus 40 MIPS for the dsPIC33FJ256GP710A-I/PF (dsPIC33F family). However, the 'EP' version requires 3.0-3.6 V operation similar to the 'FJ' part, and features enhanced PWM and ADC peripherals. The 'EP' variant may not be a direct drop-in for the 'FJ' part on legacy boards.
What is the difference between DSPIC33FJ256GP710A-I/PF and DSPIC33FJ256GP710A-I/PT?
The DSPIC33FJ256GP710A-I/PF is in a 100-pin TQFP 14x14 mm (PF) package, while the DSPIC33FJ256GP710A-I/PT uses a 100-pin TQFP 12x12 mm (PT) package. Both share the same silicon and pinout (PT-to-PF is pin-compatible within the dsPIC33FJ family) but the 'PF' footprint is slightly larger for easier hand-soldering.
When should I choose DSPIC33FJ256GP710A-I/PF over the 'A' automotive variant?
Choose the DSPIC33FJ256GP710A-I/PF (industrial -40C to +85C) for commercial and industrial products. Choose DSPIC33FJ256GP710A-H/PF (AEC-Q100 qualified, -40C to +150C) for automotive under-hood or engine bay applications. The -H/PF grade is pin-compatible and shares the same die.
What is the best drop-in replacement for DSPIC33FJ256GP710A-I/PF?
The best drop-in replacements for the DSPIC33FJ256GP710A-I/PF are the DSPIC33FJ256GP710A-I/PT (12x12 PT package) and DSPIC33FJ256GP710AT-I/PF (tape-and-reel). Both share the same die, pinout, and -40C to +85C rating. For migration within the dsPIC33F family, the DSPIC33FJ128GP710A-I/PF reduces Flash to 128 KB in the same PF footprint.
Where can I download the DSPIC33FJ256GP710A-I/PF datasheet PDF?
The official DSPIC33FJ256GP710A-I/PF datasheet (DS70292, PDF) is hosted by Microchip at https://ww1.microchip.com/downloads/en/DeviceDoc/70292D.pdf. It contains the full electrical specifications, peripheral descriptions, instruction set reference, and packaging information for the dsPIC33FJ256GP710A family.
Where do I find the DSPIC33FJ256GP710A-I/PF pinout diagram?
The DSPIC33FJ256GP710A-I/PF pinout for the 100-pin TQFP package is shown on pages of the dsPIC33FJ256GP710A family datasheet (DS70292). Key signals include VDD/VSS pairs, OSC1/OSC2 crystal pins, TMS/TCK/TDI/TDO for JTAG, and the dual programming/debug pins PGECx/PGEDx. The XAIPART page also renders a package SVG diagram.
What is the best Microchip equivalent for DSPIC33FJ256GP710A-I/PF?
The best Microchip same-family equivalents are DSPIC33FJ256GP710A-I/PT (same die, 12x12 TQFP) and DSPIC33FJ256GP710A-E/PT (extended -40C to +125C, PT 12x12 footprint). Both are drop-in replacements on compatible PCB footprints within the dsPIC33FJ256GP710A family.
What is the AEC-Q100 grade of DSPIC33FJ256GP710A-I/PF?
The DSPIC33FJ256GP710A-I/PF (industrial 'I' grade) is NOT AEC-Q100 qualified. The DSPIC33FJ256GP710A-H/PF variant is AEC-Q100 qualified for automotive applications per Microchip product page. For non-automotive industrial/consumer use the I/PF is fully sufficient and is the more cost-effective choice.
What are the key specifications of DSPIC33FJ256GP710A-I/PF that engineers should know?
The DSPIC33FJ256GP710A-I/PF features a 40 MIPS 16-bit dsPIC33F core, 256 KB Flash, 30 KB SRAM, 85 I/O, 32-channel 10-bit 1.1 Msps ADC, dual CAN/UART/SPI/I2C, 8-channel DMA, DCI codec I/F, 3.0-3.6 V supply, and -40C to +85C industrial range in a 100-pin TQFP. It is the largest-Flash variant of the dsPIC33FJ256GP710A family.

Technische Referenzdaten für DSPIC33FJ256GP710A-I/PF – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the DSPIC33FJ256GP710A-I/PF when you need the largest Flash (256 KB) and SRAM (30 KB) variant of the dsPIC33FJ GP710 family in a 100-pin TQFP 14x14 mm package, with industrial -40C to +85C temperature range for commercial and industrial products. Choose DSPIC33FJ256GP710A-H/PF for automotive under-hood applications requiring AEC-Q100 qualification and -40C to +150C operation. Choose DSPIC33FJ256GP710A-E/PT (PT 12x12 mm) when you need extended -40C to +125C temperature in a smaller footprint. Choose DSPIC33FJ256GP710AT-I/PF for tape-and-reel packaging on the same 14x14 PF footprint. Choose DSPIC33FJ128GP710A-I/PF when 128 KB Flash is sufficient (saves ~$1.60 per unit) on the same PF 14x14 footprint. The I/PT variant (12x12 mm) is also drop-in compatible for slightly more compact layouts.

Vergleich mit Alternativen

Parameter Dieses Produkt DSPIC33FJ256GP710A-I/PT DSPIC33FJ256GP710AT-I/PF DSPIC33FJ256GP710A-E/PT DSPIC33FJ256GP710A-H/PF DSPIC33FJ128GP710A-I/PF DSPIC33FJ256GP510A-I/PF
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package TQFP-100 (PF) 14x14 mm TQFP-100 (PT) 12x12 mm TQFP-100 (PF) 14x14 mm - same TQFP-100 (PT) 12x12 mm TQFP-100 (PF) 14x14 mm - same TQFP-100 (PF) 14x14 mm - same TQFP-100 (PF) 14x14 mm - same
Program Flash 256 KB 256 KB 256 KB 256 KB 256 KB 128 KB 256 KB
SRAM 30 KB 30 KB 30 KB 30 KB 30 KB 16 KB 30 KB
Maximum MIPS 40 MIPS 40 MIPS 40 MIPS 40 MIPS 40 MIPS 40 MIPS 40 MIPS
Operating Temperature -40C to +85C (Industrial) -40C to +85C -40C to +85C -40C to +125C (Extended) -40C to +150C (Automotive) -40C to +85C -40C to +85C
AEC-Q100 Qualified No No No No Yes No No
Qty-1 Unit Price (USD) 9.45 9.45 9.45 10.50 12.10 7.85 9.20

Wichtigste Unterscheidungsmerkmale

  • Same silicon with automotive AEC-Q100 grade option (vs. DSPIC33FJ256GP710A-I/PF vs DSPIC33FJ256GP710A-H/PF)
  • 256 KB Flash - largest memory variant of the GP710 family (vs. DSPIC33FJ256GP710A-I/PF vs DSPIC33FJ128GP710A-I/PF)
  • Industrial -40C to +85C vs Extended grade price advantage (vs. DSPIC33FJ256GP710A-I/PF vs DSPIC33FJ256GP710A-E/PT)

Designhinweise

Estimated: at 40 MIPS and 3.3 V VDD, the DSPIC33FJ256GP710A-I/PF draws about 60 mA typical (75 mA peak with all peripherals active). Place one 100 nF decoupling capacitor on each of the 5 VDD/VSS pairs plus a single 10 uF tantalum or ceramic bulk capacitor at the package. Keep capacitor loop area under 5 mm^2 to minimize switching transients on the digital supply.

Estimated: at full 40 MIPS with peripherals active in TQFP-100, the junction-to-ambient thermal resistance theta_JA is ~50 C/W on a 4-layer JEDEC PCB. Power dissipation is ~250 mW, yielding a ~12.5 C temperature rise. At industrial -40C to +85C ambient, junction stays under +97.5 C well below the +150 C max - no heatsink needed. For PF vs PT packages the difference is negligible.

Per Microchip dsPIC33F Hardware Reference, place the 100-pin TQFP on top layer with continuous ground plane on layer 2; route all VDD/VSS pairs to a star topology at the regulator output. The OSC1/OSC2 crystal traces must be less than 5 mm and guarded by a ground ring. ICSP pins PGECx/PGEDx must be brought to test points; do not place series resistors above 100 ohm on these pins or in-circuit debugging will fail.

The 'A' revision silicon requires configuration bits to be set for JTAG or ICSPCx ICD pins; an unconfigured JTAG-enabled pin can cause the dsPIC33FJ256GP710A-I/PF to fail to enter debug mode. Always use the latest MPLAB X IDE and XC16 compiler for proper A-revision errata handling. Also note that the analog AVdd and digital Vdd share the same 3.0-3.6 V rail but should be filtered separately.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS and REACH compliant per Microchip product page. The I/PF grade is industrial (-40C to +85C) and is NOT AEC-Q100 qualified - choose -H/PF for AEC-Q100 automotive use. Lead-free and halogen-free per Microchip material declaration.

Daten verifiziert am: 2026-10-07 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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