EP1AGX50DF1152C6N - Arria GX FPGA 50K LE, 1152-FBGA | Intel
Teilenummer: EP1AGX50DF1152C6N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $385 | $385,00 |
| 10 | $360 | $3.600,00 |
| 100 | $320 | $32.000,00 |
| 250 | $295 | $73.750,00 |
| 500 | $270 | $135.000,00 |
EP1AGX50DF1152C6N Übersicht
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, embedded memory, DSP blocks, and high-speed transceivers connected by a programmable interconnect fabric. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs (Complex Programmable Logic Devices) and SPLDs (Simple PLDs). The Arria GX family is positioned in Intel's mid-range FPGA portfolio between the lower-cost Cyclone series and the high-end Stratix series, targeting applications requiring integrated multi-gigabit transceivers without the cost of the largest devices.
Key features of the EP1AGX50DF1152C6N include up to 3.125 Gbps serial transceivers, dedicated DSP blocks for high-performance fixed- and floating-point math, embedded TriMatrix memory (MRAM, M144K, M9K blocks), and a high-performance parallel I/O structure supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device also includes a hard PCI Express (PCIe) hard IP block, external memory interfaces for DDR/DDR2/QDRII/RLDRAM, and a comprehensive Quartus II design tool chain for synthesis, place-and-route, and timing closure.
Typical applications include high-speed serial protocol bridging (XAUI, PCI Express, Serial RapidIO, Fibre Channel), telecom backplane aggregation, video broadcast and pro-AV processing, medical imaging pipelines, test and measurement instrumentation, and defense signal-processing systems. The 1152-BGA package enables dense PCB routing for the high I/O count required in parallel data acquisition and protocol bridge designs.
When designing with this device, pay close attention to power-rail sequencing, decoupling strategy, and PCB stack-up: the 90 nm core draws substantial transient current and the FC-FBGA package demands matched-impedance escape routing. Use the Altera/Intel Arria GX device handbook and the Quartus II PowerPlay early power estimator to budget thermal performance before PCB commitment.
Drop-in-Alternativen für EP1AGX50DF1152C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1AGX50DF1152C6N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Logic Elements (LE), Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1AGX50DF1152C5N
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →EP1AGX50DF1152C4N
✅ Drop-In✓ Auf Lager
$156.8 / Stück
Datenblatt ansehen →EP1AGX50DF1152
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →EP1AGX50CF484I6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$504.158 / Stück
Datenblatt ansehen →EP1AGX35DF780I6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP1AGX50DF1152C6N Grenzwerte & elektrische Eigenschaften
| Family | Arria GX |
| Logic Elements | 50,160 |
| Logic Cells | 50,160 |
| Number of LABs/CLBs | 2508 |
| Total RAM Bits | 2,475,072 |
| Number of I/O | 350 (typical) |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Maximum Operating Frequency | 640 MHz |
| Gehäuse | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch |
| Montageart | Surface Mount |
| Betriebstemperatur | 0 C to +85 C (Commercial) |
| Speed Grade | 6 |
| Serial Transceivers | Up to 3.125 Gbps |
| Lead Free / RoHS | Lead free, RoHS compliant |
| Configuration Method | SRAM-based, JTAG, Passive Serial, Fast Passive Parallel |
EP1AGX50DF1152C6N 1152-bbga (fc-fbga) 35 x 35 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP1AGX50DF1152C6N (1152-bbga (fc-fbga) 35 x 35 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1AGX50DF1152C6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1AGX50DF1152C6N ist geeignet für 7 Anwendungs: High-Speed Serial Protocol Bridge (XAUI / PCIe Gen1), Telecom Backplane Aggregation / Line Card, Broadcast Video Processing / Pro-AV Switcher, Medical Imaging Pipeline / Ultrasound / CT Front-End, Test and Measurement Instrumentation / Logic Analyzer, Defense Signal-Processing / Software Defined Radio, Industrial Protocol Bridge / Motor Control Aggregation.
High-Speed Serial Protocol Bridge (XAUI / PCIe Gen1)
The EP1AGX50DF1152C6N's integrated 3.125 Gbps multi-gigabit transceivers make it ideal for bridging high-speed serial protocols such as XAUI (10 Gbps Ethernet across four 3.125 Gbps lanes) and PCI Express Gen1 (2.5 Gbps per lane). The 1152-BGA package exposes the full transceiver channel count, supporting up to 12 channels. Designers implement PHY PCS layer in soft logic while leveraging the hard PCIe Gen1 hard IP block. Compared to an ASSP bridge chip, the FPGA allows flexible protocol customization and future-proof field upgrades via bitstream reload.
Empfohlen
Telecom Backplane Aggregation / Line Card
The 50,160 logic elements and 2.4 Mbit embedded memory support complex packet-processing and traffic-management logic for telecom line cards aggregating multiple lower-rate links onto a 10G XAUI uplink. The Arria GX device hard memory controller IP enables connection to DDR2/QDRII/RLDRAM external memory, providing the deep packet buffering required for QoS queues. The 350 user I/Os handle multiple SGMII and SPI ports simultaneously. Designers benefit from the Quartus II SOPC Builder flow which accelerates CPU subsystem integration for control-plane processing.
Empfohlen
Broadcast Video Processing / Pro-AV Switcher
Broadcast video studios and pro-AV installations require real-time pixel processing, format conversion, and multi-screen compositing at resolutions up to 1080p and beyond. The EP1AGX50DF1152C6N's 50K logic elements and 2.4 Mbit memory accommodate color-space converters, scalers, alpha-blend engines, and SDI/HDMI bridge IP cores. The 3.125 Gbps transceivers support serial digital interface (SDI) and HDMI 1.3 PHY connections. Compared to GPU-based solutions, the FPGA delivers deterministic latency critical for live broadcast workflows and hardware-triggered genlock.
Empfohlen
Medical Imaging Pipeline / Ultrasound / CT Front-End
Ultrasound and CT imaging front-ends digitize analog transducer signals at high rates (40-80 MSPS per channel) and apply beamforming, filtering, and envelope detection in real time. The EP1AGX50DF1152C6N's dedicated DSP blocks deliver up to 2.4 GMACS performance, supporting 32-channel phased-array beamforming at clinical frame rates. The 1152-BGA package provides the parallel LVDS pairs required to receive high-speed ADC data. IEC 60601-1 compliant medical devices benefit from deterministic hardware processing versus software-based image reconstruction.
Empfohlen
Test and Measurement Instrumentation / Logic Analyzer
High-end logic analyzers, protocol analyzers, and bit-error-rate testers demand multi-channel parallel acquisition at hundreds of MHz with deep trace memory. The EP1AGX50DF1152C6N's 350 user I/Os and 2.4 Mbit embedded memory support capture of 144 channels at 200 MHz with state-mode triggering. The FPGA's JTAG boundary-scan support simplifies board-level interconnect testing during manufacturing. The 3.125 Gbps transceivers enable 10G Ethernet trace export without burdening the host CPU, allowing real-time streaming of compressed acquisition data to disk.
Empfohlen
Defense Signal-Processing / Software Defined Radio
Military and aerospace software-defined radio (SDR) platforms require programmable DSP resources and high-speed ADC interfaces to handle wideband RF capture. The EP1AGX50DF1152C6N's 50K logic elements and DSP blocks support multi-channel DDC (digital down-conversion) and FFT engines for electronic-warfare and SIGINT applications. The commercial-grade temperature range (0 to +85 C) is suitable for ground-station and shipboard environments but not for unpressurized airborne. For ruggedized military applications, the Arria II GX or Kintex-7 with industrial temperature grades are recommended.
Empfohlen
Industrial Protocol Bridge / Motor Control Aggregation
Industrial automation gateways aggregate multiple fieldbus protocols (EtherCAT, PROFINET, EtherNet/IP, Modbus TCP) onto higher-speed Ethernet uplinks. The EP1AGX50DF1152C6N's serial transceivers and abundant logic resources support industrial Ethernet MAC IP cores plus deterministic latency forwarding. The 350 user I/Os accommodate multiple digital isolators and RS-485 transceivers for legacy fieldbus connectivity. Industrial-grade operating temperature (industrial variant) is recommended for factory-floor deployment; the commercial EP1AGX50DF1152C6N is suitable only for protected control cabinet environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1AGX50DF1152C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1AGX50DF1152C5N | EP1AGX50DF1152C4N | EP1AGX50CF484I6N | EP1AGX35DF780I6N |
|---|---|---|---|---|---|
| Package | 1152-BBGA (FC-FBGA) 35x35 mm | 1152-BBGA (FC-FBGA) 35x35 mm - same | 1152-BBGA (FC-FBGA) 35x35 mm - same | 484-BBGA (FC-FBGA) - different | 780-BBGA (FC-FBGA) - different |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 33,820 |
| Speed Grade | 6 | 5 | 4 | 6 | 6 |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Transceiver Data Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
Wichtigste Unterscheidungsmerkmale
- Highest transceiver channel count in Arria GX 1152-BGA package (vs. EP1AGX50DF780C6N)
- Speed grade 6 delivers highest Fmax performance (vs. EP1AGX50DF1152C5N)
- Commercial temperature grade optimized for protected environments (vs. EP1AGX50CF484I6N)
- Direct Intel FPGA legacy support with full Quartus II tool chain (vs. Xilinx Spartan-6 LX150T)
Designhinweise
Estimated: a fully utilized 50K-LE Arria GX design at 250 MHz with 50% toggle activity typically draws between 5 W and 8 W from the 1.2 V core rail, plus an additional 2-3 W for the 3.125 Gbps transceivers and I/O banks. Use the Altera PowerPlay Early Power Estimator spreadsheet (from Quartus II 13.1 install) for accurate budgeting before PCB commitment. Design 1.2 V core supply with bulk ceramic capacitance of at least 220 uF (multiple 22 uF X7R capacitors) plus 0.1 uF and 0.01 uF high-frequency decoupling placed within 5 mm of every VCC pin pair. Per the Arria GX Device Handbook, the VCCPD (pre-driver) and VCCIO supplies must be sequenced relative to VCCINT using a power-supply supervisor or external sequencer.
The 1152-ball FC-FBGA package has a 1.0 mm ball pitch, requiring a 6-8 layer PCB stack-up with microvia (HDI) technology on the top layer for signal escape routing. Use a minimum 8-mil via-in-pad with 12-mil pad, and route the inner layers with 4-mil trace / 4-mil space on 0.2 mm dielectric. According to the Arria GX Board Design Guidelines, all high-speed transceiver differential pairs require 100-ohm differential impedance with matched length (within 5 mil). Place DC blocking capacitors on the transmit side of every serial link within 200 mil of the FPGA ball to maintain AC coupling. Maintain at least 2 oz copper on the top and bottom layers for thermal dissipation, especially under the die shadow region.
Estimated: at maximum operating conditions with 7 W total dissipation, junction-to-ambient thermal resistance for the 1152-BGA FC-FBGA is approximately 12 C/W (with typical 2 oz copper 6-layer PCB), resulting in a 84 C junction temperature rise above ambient. This places the junction near the 125 C limit at 40 C ambient. Designers deploying in commercial temperature range (0 to +85 C ambient) must ensure at least 5-6 C/W PCB thermal performance via copper pour, thermal vias, and optionally an integrated heat spreader. Refer to the Altera Arria GX Packaging Thermal Resistance document for junction-to-case and junction-to-ambient data.
Three common design pitfalls when working with the EP1AGX50DF1152C6N: (1) Forgetting to instantiate the JTAG IDCODE instruction - if the device is removed or replaced, the JTAG chain will silently fail; always verify the JTAG chain in Quartus II programmer before final PCB assembly. (2) Confusing the I/O bank voltage (VCCIO) with the pre-driver voltage (VCCPD) - both must be present but VCCPD is fixed at 2.5 V or 3.0 V depending on the configuration scheme. (3) Omitting the configuration flash memory - the FPGA is SRAM-based and requires an external EPCS or EPCQ serial flash plus proper MSEL pin strapping for configuration mode. Refer to the Arria GX Configuration Handbook Chapter 4 for detailed schematics.
Transceiver signal integrity is critical for the 3.125 Gbps serial links. Maintain 100-ohm differential impedance with no more than 1 impedance discontinuity per TX-RX path, and use a continuous reference ground plane under all transceiver traces. AC coupling capacitors must be 0402 size with C0G/NP0 dielectric to minimize parasitic inductance. Keep serial traces away from switching power supply nodes and noisy digital buses; route only over continuous GND plane. For SGMII and PCIe interfaces, perform pre-layout simulation with IBIS-AMI models from the Arria GX model library to validate channel loss and crosstalk budgets.
Compliance-Informationen
RoHS compliant per Intel product suffix 'N' designation. Lead-free FC-FBGA finish. REACH compliance per Intel product declaration. Halogen-free status not explicitly stated in available data; refer to Intel Product Content Information System (PCIS) for full material disclosure. Not AEC-Q100 qualified - this is a commercial-grade IC. Conflict minerals compliance per Intel CMRT declarations.
