EP1AGX50DF1152C5N - 50K LE Arria GX FPGA with 3.125 Gbps Transceivers | Intel
Teilenummer: EP1AGX50DF1152C5N ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $269.5 | $2.695,00 |
| 100 | $248 | $24.800,00 |
| 500 | $222.5 | $111.250,00 |
| 1.000 | $195 | $195.000,00 |
EP1AGX50DF1152C5N Übersicht
What is an FPGA? A Field-Programmable Gate Array is a class of programmable logic device built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, DSP blocks, and memory controllers. FPGAs sit in the broader semiconductor hierarchy between standard-cell ASICs (high NRE, low unit cost) and discrete microcontrollers (fixed instruction set, lower performance per watt). Arria GX FPGAs target mid-range applications that need multi-gigabit serial I/O but do not justify a high-end Stratix-grade device, offering a balance of logic density, transceiver count, power, and cost.
Key features of the EP1AGX50DF1152C5N include 50,160 logic elements (LEs), 2,475,072 bits of M4K/RAM block memory, 244 embedded 18x18 multipliers (DSP blocks), 8 full-duplex 3.125 Gbps transceiver channels, and 4 phase-locked loops (PLLs). Per-transceiver channel support covers PCIe Gen1 x1/x4, GIGE, Serial RapidIO, and CEI-6G SR, allowing designers to implement bridging, baseband, and protocol-conversion functions without external PHY chips.
The architecture pairs a LUT-based fabric with dedicated hardware multipliers, true dual-port RAM blocks, and 4 PLLs that generate multiple clock domains. The 1152-ball FineLine BGA offers high pin density for the 8 transceiver channels and 281 user I/O pins while keeping PCB escape routing manageable for 1.0 mm pitch designs. The -5 speed grade is the slowest commercial grade and is intended for cost-optimized applications; -6 and -7 speed grades are available for higher Fmax requirements.
Typical applications include telecom line-card bridging (Serial RapidIO to Parallel RapidIO), PCI Express Gen1 endpoint cards, industrial machine-vision frame grabbers, software-defined radio front-end preprocessing, and broadcast video format converters. The combination of embedded transceivers and DSP blocks is particularly valuable for any design that needs to ingest multi-gigabit serial data and immediately perform signal conditioning.
When designing with this device, prioritize proper power-rail sequencing: 1.2 V core, 2.5 V/3.3 V analog PLL/auxiliary, and 1.2 V/2.5 V transceiver PLLs each require controlled ramp rates. Transceiver channels need 100 ohm differential routing with controlled 50 ohm single-ended impedance and DC-blocking capacitors; AC-coupling capacitors are mandatory for all serial protocols in this family. Use the Quartus II design software (Cyclone/Arria device support) to verify pin assignments, transceiver settings, and timing closure.
This page synthesizes distributor pricing, drop-in alternatives from the same Altera/Intel Arria GX family, and practical design notes that go beyond the manufacturer datasheet.
Drop-in-Alternativen für EP1AGX50DF1152C5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1AGX50DF1152C5N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Configuration Method, Transceivers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1AGX50DF1152C6N
✅ Drop-In✓ Auf Lager
$270 / Stück
Datenblatt ansehen →EP1AGX50DF1152C4N
✅ Drop-In✓ Auf Lager
$156.8 / Stück
Datenblatt ansehen →EP1AGX50DF1152
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →EP1AGX35DF780C6N
✅ Drop-In✓ Auf Lager
$199.5 / Stück
Datenblatt ansehen →EP1AGX50DF1152C5N Grenzwerte & elektrische Eigenschaften
| Family | Arria GX |
| Logic Elements (LE) | 50,160 |
| Embedded Memory Bits | 2,475,072 bits |
| Embedded Multipliers (18x18) | 244 |
| Transceiver Channels | 8 full-duplex (up to 3.125 Gbps) |
| Maximum Transceiver Data Rate | 3.125 Gbps per channel |
| PLLs | 4 |
| Maximum User I/O Pins | 281 |
| Gehäuse | 1152-ball FineLine BGA (FBGA-1152) |
| Speed Grade | -5 (commercial, slowest grade) |
| Process Technology | 90 nm CMOS, 1.2 V core |
| Operating Temperature (Commercial) | 0 C to +85 C (TJ) |
| Supply Voltage (Core) | 1.2 V |
| Supply Voltage (Auxiliary/PLL) | 2.5 V / 3.3 V |
| RoHS-Status | Compliant (Pb-free) |
| Configuration Scheme | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Supported Serial Protocols | PCIe Gen1 x1/x4, Gigabit Ethernet, Serial RapidIO, CEI-6G SR |
EP1AGX50DF1152C5N 1152-ball fineline bga (fbga-1152) Pinbelegungsleitfaden
Pinbelegung für EP1AGX50DF1152C5N (1152-ball fineline bga (fbga-1152)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1AGX50DF1152C5N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1AGX50DF1152C5N ist geeignet für 6 Anwendungs: Telecom Line-Card Bridging (Serial RapidIO to Parallel RapidIO), PCI Express Gen1 Endpoint Cards, Industrial Machine-Vision Frame Grabbers, Software-Defined Radio Front-End Preprocessing, Broadcast Video Format Converters, Protocol Bridging and Network Aggregation.
Telecom Line-Card Bridging (Serial RapidIO to Parallel RapidIO)
The EP1AGX50DF1152C5N's 8 transceiver channels at 3.125 Gbps and 50K logic elements make it ideal for Serial RapidIO (SRIO) line-card bridging functions in 3G/4G base-station baseband units. The transceiver macro can directly interface SRIO x1/x4 lanes without an external PHY, while 244 18x18 multipliers and 2.475 Mbits of block RAM handle packet buffering and header parsing. The 1152-ball FBGA footprint allows up to 281 user I/O pins for glueless connection to DSP, TDM, and backplane SERDES interfaces. Designers typically use a single transceiver channel pair for SRIO link and the remaining channels for SPI-4.2 or CPRI uplink to a base-station antenna card.
Empfohlen
PCI Express Gen1 Endpoint Cards
The EP1AGX50DF1152C5N's hardened PCIe Gen1 PCS/PMA block enables x1/x4 PCI Express endpoint implementations without external PHY silicon, reducing BOM cost by 15-25 percent on host-bus adapter cards. The 8 transceiver channels allow simultaneous PCIe x4 plus two SRIO or GIGE links, while 244 hardware multipliers accelerate DMA engine cryptography. Designers use Quartus II IP Compiler to instantiate the PCIe MegaCore, which pre-validates compliance with the PCIe Gen1 electrical spec. For designs that need more PCIe lanes or Gen2 support, the migration path is the Arria II GX EP2AGX45 family with 8 lanes at 5 Gbps.
Empfohlen
Industrial Machine-Vision Frame Grabbers
The EP1AGX50DF1152C5N is well suited to industrial Camera-Link HS or CoaXPress frame-grabber cards where 8 transceiver channels at 3.125 Gbps can ingest multi-lane sensor data and the 244 hardware multipliers run real-time image processing (white balance, gamma, edge detection). 2.475 Mbits of embedded memory buffer full-HD frames line-by-line without external SRAM. The 1152-ball FBGA supports 281 user I/Os for GPIO, trigger inputs, and strobe outputs. Industrial vision systems benefit from the device's 0 C to +85 C commercial temperature range and RoHS-compliant construction for global factory deployments.
Empfohlen
Software-Defined Radio Front-End Preprocessing
The 244 18x18 hardware multipliers in the EP1AGX50DF1152C5N support 122 complex 16x16 multiply-accumulate operations per cycle, ideal for SDR front-end channelization (DDC/DUC), pulse shaping, and FFT pre-processing at baseband sample rates up to 250 MHz. The 8 transceiver channels accept ADC data at up to 3.125 Gbps per lane from popular RF front-end converters. Designers pair this FPGA with a TI ADS62P4X ADC and use the transceiver macro to deserialize the LVDS bitstream directly into the FPGA fabric, eliminating an external deserializer. Quartus II DSP Builder generates optimized FIR/CIC cores from MATLAB Simulink.
Empfohlen
Broadcast Video Format Converters
The EP1AGX50DF1152C5N's 50K logic elements handle SD/HD/3G-SDI cross-conversion, frame-rate conversion, and color-space transcoding for broadcast studio infrastructure. Embedded 2.475 Mbits of block RAM buffer full-HD frames, while 281 user I/Os connect to HDMI, DisplayPort, and SDI serializer/deserializer chips. The 8 transceiver channels at 3.125 Gbps accept 3G-SDI SMPTE 424M streams directly without external deserializer hardware. Commercial-grade temperature (0 to +85 C) suits studio-controlled environments, and the 1152-ball FBGA provides escape routing for high-speed parallel output buses to HDMI 1.4 transmitters.
Empfohlen
Protocol Bridging and Network Aggregation
Multi-protocol aggregation (PCIe to GIGE to Serial RapidIO) leverages the EP1AGX50DF1152C5N's 8 transceiver channels running different protocols simultaneously on independent channels. The hardened PCS blocks for GIGE (1000BASE-X), PCIe Gen1, SRIO, and CEI-6G SR mean designers can instantiate any combination of protocols using Quartus II IP Compiler. 50K logic elements implement stateful packet inspection, QoS prioritization, and timestamp insertion for IEEE 1588 PTP. The 4 PLLs generate independent clock domains for each protocol's reference clock, simplifying board-level clock-tree design.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1AGX50DF1152C5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1AGX50DF1152C6N | EP1AGX50DF1152C4N | EP1AGX50DF1152 | EP1AGX35DF780C6N |
|---|---|---|---|---|---|
| Package | 1152-ball FineLine BGA | 1152-ball FineLine BGA - same | 1152-ball FineLine BGA - same | 1152-ball FineLine BGA - same | 780-ball FBGA (different footprint) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 35,160 |
| Speed Grade | -5 (commercial) | -6 (commercial) | -4 (commercial) | Assignable | -6 (commercial) |
| Transceiver Channels | 8 at 3.125 Gbps | 8 at 3.125 Gbps | 8 at 3.125 Gbps | 8 at 3.125 Gbps | 4 at 3.125 Gbps |
| Embedded Memory (bits) | 2,475,072 | 2,475,072 | 2,475,072 | 2,475,072 | 1,723,648 |
| Embedded 18x18 Multipliers | 244 | 244 | 244 | 244 | 161 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Wichtigste Unterscheidungsmerkmale
- Lower-cost speed grade for cost-sensitive designs (vs. EP1AGX50DF1152C6N)
- Highest-density Arria GX variant in 1152-ball BGA (vs. EP1AGX35DF780C6N)
- Site MPN list candidates enable internal linking (vs. EP1AGX50DF1152)
Designhinweise
The EP1AGX50DF1152C5N requires four independent power rails: 1.2 V core (VCCINT), 2.5 V analog PLL (VCCA_PLL), 3.3 V configuration/aux (VCCIO/VCCPD), and 2.5 V transceiver analog (VCCR/VCTT). Per the Arria GX handbook, each rail must ramp monotonically within 0.5 ms to 100 ms to avoid JTAG configuration failures. Estimated: a typical design running at 60 percent utilization with all 8 transceivers active at 3.125 Gbps draws about 4.5 W from VCCINT and 1.8 W from the transceiver supply, for a total of ~6.3 W device power. Decoupling: 470 uF bulk + 100 uF medium + 0.1 uF per power pin is the minimum; place 0.1 uF within 50 mil of every VCCINT pin.
Transceiver channel traces must be 100 ohm differential with intra-pair length matching of less than 5 mil per inch and pair-to-pair skew under 50 mil. Use a reference ground plane on layer 2 with no splits under the transceiver lanes; layer stack-up should target 0.5 to 0.7 dB/inch insertion loss at 1.5 GHz. AC-coupling capacitors of 100 nF are mandatory on both TX and RX pairs and should be placed as close to the device ball as the breakout allows. Use Micron or Murata 0402 capacitors with X7R or C0G dielectric - avoid Y5V because of voltage-coefficient loss.
The 1152-ball FineLine BGA has a theta_JA of about 12 C/W with 25 CFM airflow, rising to 19 C/W without airflow. Estimated: at 6.3 W total dissipation, junction-to-ambient rise is 75 C without airflow (TJ = TA + 119 C, exceeding commercial 85 C). Add a heatsink rated 4-6 C/W or design a thermal via array of 25 0.3 mm vias per cm2 directly under the package thermal pad. Avoid placing the FPGA on the bottom of the board or in low-airflow pockets of an enclosure.
Three recurring design errors in EP1AGX50DF1152C5N designs: (1) sharing one PLL between the transceiver PCS and the fabric clocks, which causes jitter coupling above 1 MHz - assign separate PLLs to transceiver and fabric clock domains; (2) leaving the nCONFIG pin floating or pulled to the wrong rail, which blocks active-serial configuration - tie nCONFIG through 10 kohm to VCCPD; (3) omitting the JTAG TCK pull-down resistor (1 kohm to GND) which makes boundary-scan unstable. Always enable CRC error checking in the Quartus II programming file generator for last-time-buy designs where field failures are irreversible.
Compliance-Informationen
RoHS compliant per manufacturer datasheet; AEC-Q100 not applicable for FPGA commercial-grade product; halogen-free status not confirmed in available data
