EP1AGX60EF1152I6N - Arria GX 60 FPGA, 60K LE, 1152-BGA | Intel / Altera
Teilenummer: EP1AGX60EF1152I6N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2.450,00 |
| 100 | $198 | $19.800,00 |
| 500 | $165 | $82.500,00 |
| 1.000 | $142 | $142.000,00 |
EP1AGX60EF1152I6N Übersicht
An FPGA is a reprogrammable logic device that combines programmable logic fabric, configurable I/O, and on-die hard intellectual-property blocks. The Arria GX family sits in the hierarchy FPGA -> programmable logic -> semiconductor device, providing an architecture that bridges cost-sensitive application-specific standard product (ASSP) replacement and high-end transceiver-equipped FPGAs. The EP1AGX60 variant represents the upper-mid density tier within the family, complementing the smaller EP1AGX20 / EP1AGX35 / EP1AGX50 parts.
Key features of the EP1AGX60EF1152I6N include 12 dedicated 3.125 Gbps transceiver channels with embedded SERDES, 3,005 LABs/CLBs, 514 user I/O pins, 252 dedicated 18x18 multipliers for DSP, and support for external DDR/DDR2/QDRII/RLDRAM memory interfaces. The device integrates a quad PLL clock network with up to 16 global clock trees, PLLs per quadrant, and per-channel 8B/10B encoding/decoding for serial protocols. The 1152-BBGA package (35 mm × 35 mm, 1.0 mm ball pitch) supports industrial temperature operation from -40 °C to +100 °C.
The architecture uses a fixed-function transceiver tile arrayed against the core logic fabric, connected through a structured routing hierarchy. Embedded hard IP for PCI Express (×1, ×4) and Gigabit Ethernet MAC layers reduces soft-logic utilization and timing closure risk, allowing engineers to focus on application logic rather than serial protocol implementation. Power estimation tools such as the Altera PowerPlay early-power estimator are recommended before sign-off.
Typical applications include protocol bridging cards, telecom line cards with SERDES aggregation, broadcast video routing (SDI/HD-SDI/3G-SDI), industrial imaging, test and measurement backplanes, and defence/aerospace signal processing. The transceiver capability makes the EP1AGX60EF1152I6N especially well-suited when ASSP alternatives are unavailable or end-of-life.
When designing with this device, engineers should use the Quartus II design suite (version 9.0 or later) for synthesis and place-and-route. A multi-layer PCB with continuous GND and PWR planes, plus 100 Ω differential impedance control for SERDES lanes, is mandatory. Pin-compatible Arria GX family members allow density migration between EP1AGX20, EP1AGX35, EP1AGX50, and EP1AGX60 in the same package.
This page synthesizes distributor pricing, drop-in alternatives within the same Arria GX 1152-BGA footprint, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für EP1AGX60EF1152I6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1AGX60EF1152I6N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Logic Elements (LE), Embedded Memory, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1AGX60EF1152C6N
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →EP1AGX60DF1152I6N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP1AGX60EF1152I6N Grenzwerte & elektrische Eigenschaften
| Series | Arria GX |
| Family | Arria GX FPGA |
| Logic Elements (LE) | 60,100 |
| Embedded Memory | 2,528,640 bits (≈2.4 Mbit) |
| LABs / CLBs | 3,005 |
| Total RAM Bits | 2,528,640 |
| User I/O Count | 514 |
| Transceiver Channels | 12 (3.125 Gbps, embedded CDR/SERDES) |
| 18 × 18 Hardware Multipliers | 252 |
| PLLs | 4 (one per quadrant) plus transceiver PLLs |
| Gehäuse | 1152-BBGA (FBGA-1152, 35 × 35 mm, 1.0 mm pitch) |
| Montageart | Surface Mount (BGA) |
| Betriebstemperatur | -40 °C to +100 °C (Industrial, suffix I) |
| Speed Grade | 6 |
| Process Node | 90 nm |
| Hard IP | PCI Express ×1/×4, Gigabit Ethernet MAC, 8B/10B encoder/decoder |
| Memory Interfaces | DDR, DDR2, QDRII, RLDRAM (external memory controller) |
| RoHS-Status | Compliant (per distributor listing) |
| MSL-Level | 3 (per JEDEC J-STD-020) |
EP1AGX60EF1152I6N 1152-bbga (fbga-1152, 35 × 35 mm, 1.0 mm pitch) Pinbelegungsleitfaden
Pinbelegung für EP1AGX60EF1152I6N (1152-bbga (fbga-1152, 35 × 35 mm, 1.0 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1AGX60EF1152I6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1AGX60EF1152I6N ist geeignet für 7 Anwendungs: PCI Express Endpoint Card, Gigabit Ethernet Aggregation / Network Interface, Broadcast SDI / HD-SDI Video Router, Serial RapidIO Switch / Endpoint, XAUI / 10 GbE Backplane Aggregation, Industrial Machine Vision / Camera Link, Test & Measurement Backplane.
PCI Express Endpoint Card
The EP1AGX60EF1152I6N's 3.125 Gbps transceivers and embedded PCIe hard IP ×1/×4 endpoint make it ideal for half-height PCIe cards. Placed on a 4-lane PCIe slot, the FPGA offloads DMA engines and custom protocols into the 60,100 logic elements while the dedicated PCIe block handles transaction/data-link layers at 2.5 Gbps per lane, freeing fabric for application logic. Industrial temp grade suits indoor server and workstation deployments where extended-temperature hardening is required.
Empfohlen
Gigabit Ethernet Aggregation / Network Interface
With 12 transceivers capable of 3.125 Gbps and embedded Gigabit Ethernet MAC hard IP, the EP1AGX60EF1152I6N fits multi-port GbE aggregation cards. Designers wire four SFP cages to four transceiver channels running serial Gigabit Ethernet, implement an aggregation switch in fabric, and expose the result through PCIe to a host CPU. The 514 user I/O and external DDR2 interface support buffer memory for line-rate packet processing. Industrial temp supports carrier-grade deployment in controlled environments.
Empfohlen
Broadcast SDI / HD-SDI Video Router
The EP1AGX60EF1152I6N's transceivers natively clock 270 Mbps SDI, 1.485 Gbps HD-SDI, and 2.97 Gbps 3G-SDI rates that fall within the 3.125 Gbps capability. Routing fabric in 60K LE handles large cross-point matrices while dedicated transceivers provide the serializer/deserializer function for SDI. The 252 hardware 18x18 multipliers assist with video scaling and color-space conversion. Industrial temp covers 24/7 broadcast infrastructure requirements.
Empfohlen
Serial RapidIO Switch / Endpoint
The 3.125 Gbps transceivers support Serial RapidIO (SRIO) physical layer at 1x and 4x lane widths with 8B/10B coding. The EP1AGX60EF1152I6N acts as a logical layer switch endpoint in baseband DSP cards for wireless infrastructure, where it bridges SRIO to host processors. With 60K logic elements, the device supports 4x SRIO port plus fabric logic for DMA, message passing, and shared-memory transport. Industrial temp supports outdoor cell-site equipment.
Empfohlen
XAUI / 10 GbE Backplane Aggregation
XAUI (10 Gbps Ethernet over four 3.125 Gbps lanes) maps directly onto the EP1AGX60EF1152I6N transceiver channels. Four transceivers combine to form one XAUI lane, supporting up to three independent 10 GbE ports. The 60,100 LE fabric is large enough for 10 GbE MAC plus classification/queueing logic, and the external DDR2 controller provides 36-bit wide buffer memory at 333 MHz data rate. Industrial temp suits telecom central-office installations.
Empfohlen
Industrial Machine Vision / Camera Link
The 514 user I/O and 252 hardware multipliers make the EP1AGX60EF1152I6N suitable for Camera Link base/medium/full/extended configurations. Designers pair transceivers with external LVDS pairs (via the 514 I/O) to receive Camera Link data at up to 6.8 Gbps, then process frames in 60K logic elements using the on-chip multipliers for Bayer demosaic and color correction. Industrial temp supports factory-floor deployment in vision-guided robotics cells.
Empfohlen
Test & Measurement Backplane
The 12 transceiver channels and 514 I/O make the EP1AGX60EF1152I6N an ideal protocol-aware backplane for ATE systems. Logic implements pattern generators and protocol analyzers (PCIe Gen1, GbE, SRIO, XAUI) on the same device, switching between instruments via soft logic. Industrial temp allows use in temperature-controlled production test cells. The DDR2 controller stores captured waveforms for post-processing in the host.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1AGX60EF1152I6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1AGX60EF1152C6N | EP1AGX60DF1152I6N |
|---|---|---|---|
| Brand | Intel (legacy Altera) | Intel (legacy Altera) | Intel (legacy Altera) |
| Package | 1152-BBGA (FBGA-1152, 35×35 mm) | 1152-BBGA (FBGA-1152, 35×35 mm) - same | 1152-BBGA (FBGA-1152) - same |
| Logic Elements | 60,100 | 60,100 | 60,100 |
| Transceiver Channels | 12 × 3.125 Gbps | 12 × 3.125 Gbps | 8 × 3.125 Gbps |
| User I/O | 514 | 514 | 514 |
| Embedded Memory (bits) | 2,528,640 | 2,528,640 | 2,528,640 |
| Temperature Grade | Industrial -40 to +100 C | Commercial 0 to +85 C | Industrial -40 to +100 C |
| Speed Grade | 6 | 6 | 6 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade availability in same 1152-BBGA footprint (vs. EP1AGX60EF1152C6N)
- Full 12-channel 3.125 Gbps transceiver array (vs. EP1AGX60DF1152I6N)
- Embedded hard IP for PCIe, GbE and 8B/10B coding (vs. Stratix-based predecessors (e.g. EP1S80B956C6))
Designhinweise
The FBGA-1152 package has a thermal resistance theta-JA of approximately 8-10 °C/W with a 4-layer JEDEC JESD51 test board, requiring designers to budget power dissipation. Estimated: at 8 W total power (60% utilization with active transceivers), the junction temperature rises 64-80 °C above ambient. Industrial-temperature operation at +100 °C ambient requires that the 8 W figure be derated to keep Tj below +125 °C. Use the Altera PowerPlay Early Power Estimator spreadsheet for design-specific analysis before PCB layout commitment.
The 1152-BBGA package requires a 35 × 35 mm PCB land pattern with 1.0 mm ball pitch. Use microvia or sub-100 µm laser-drilled vias in-pad to route the inner-row balls. Implement a 12-layer stack-up with continuous GND and PWR planes adjacent to the BGA break-out layer; transceiver channels require 100 Ω differential impedance with 7-9 mil trace width and intra-pair skew below 5 ps. Power decoupling requires 0402/0201 ceramic capacitors within 100 mils of each VCC/VCCINT/VCCA ball pair.
Place transceiver channels on the package edges closest to the SMA/edge connector I/O to minimize PCB routing. Keep the 3.125 Gbps lanes length-matched within 150 mil pair-to-pair and maintain at least 3W spacing from other high-speed signals. Reference the Altera AN 465 application note for Arria GX transceiver PCB layout, which specifies the via anti-pad geometry and AC-coupling capacitor placement. JTAG and configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) require 4.7 kΩ pull-ups per the device handbook.
All 12 transceiver channels require external AC-coupling capacitors (typically 100 nF X7R 0402) on each TX/RX pair. The Arria GX CDR is calibrated at power-up via the Quartus II transceiver toolkit; designers must supply a stable reference clock to the dedicated refclk pins with jitter below 100 fs RMS for 3.125 Gbps operation. Pre-emphasis and equalization settings are programmable through the ALTGX megafunction; default settings provide 6 dB pre-emphasis suitable for backplanes up to 30 cm.
Do not assume I/O standards across banks - each I/O bank has independent VCCIO supply and supports LVDS, LVTTL, LVCMOS, SSTL-2, SSTL-18, HSTL, and PCI/PCI-X signaling. The CONF_DONE pin must be pulled high before configuration completes, or the device enters an undefined state. Configuration via fast passive parallel (FPP) requires a 16-bit data bus and clock; using an EPCS16 serial configuration device is recommended for cost-sensitive designs but requires fewer pins.
Compliance-Informationen
RoHS-compliant per DigiKey product listing 1629504. Not AEC-Q100 qualified (industrial, not automotive grade). Halogen-free status not explicitly listed by distributor; consult Intel product declaration.
