EP1SGX25CF672C5 - 25,660-LE Stratix GX FPGA, 672-FBGA | Altera (Intel)
Teilenummer: EP1SGX25CF672C5 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1359.36 | $1.359,36 |
| 10 | $1345.77 | $13.457,70 |
| 100 | $1332.17 | $133.217,00 |
| 500 | $1318.58 | $659.290,00 |
| 1.000 | $1304.99 | $1.304.990,00 |
EP1SGX25CF672C5 Übersicht
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (such as transceivers, block RAM, and DSP slices) on a single die. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design hierarchy, offering parallel processing, hardware-level determinism, and post-production flexibility. The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications, while the parent Stratix I family provides the logic fabric and DSP blocks. This places the EP1SGX25CF672C5 in the broader category of programmable logic devices (PLDs) within the semiconductor hierarchy.
Key features of the EP1SGX25CF672C5 include 2,566 LABs (Logic Array Blocks), 12 transceiver channels capable of multi-gigabit serial operation, 14 embedded 18x18 multipliers, and four PLLs for clock synthesis and management. The 672-FBGA package exposes 455 user I/O and supports both 1.5 V and 1.8 V I/O standards, with LVDS, LVTTL, LVCMOS, SSTL, and HSTL support. The device also integrates 6 embedded TriMatrix memory blocks for high-bandwidth on-chip storage.
The Stratix GX architecture combines a fine-grained logic fabric with embedded transceiver physical coding sublayers, enabling line-rate processing of protocols such as PCI Express, Serial RapidIO, Fibre Channel, and 10 Gbps Ethernet. The hard multiplier array accelerates DSP operations including FFTs, FIR filters, and baseband signal processing. The device is supported by the Altera Quartus II design suite, including SOPC Builder for system-level integration and SignalTap II for on-chip logic analysis.
Typical applications include line-card interface bridges for telecom equipment, serial backplane aggregation in storage and switching systems, software-defined radio front-ends, and DSP co-processing in medical imaging and defense electronics. The high logic density also makes the device attractive for ASIC prototyping and hardware emulation. The combination of 25,660 logic elements and 12 multi-gigabit transceivers allows designers to implement both glue logic and physical-layer functions on a single die.
When designing with the EP1SGX25CF672C5, ensure the 1.5 V core supply is decoupled with bulk ceramic and electrolytic capacitors per the Quartus II power distribution network guidelines. The 672-FBGA package requires a multi-layer PCB with microvia or via-in-pad technology; signal integrity analysis is recommended for all 12 serial links. The part operates over the commercial 0°C to +85°C temperature range and ships in tray packaging, which is standard for high-density FPGAs of this generation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single, decision-ready reference for sourcing and integrating the EP1SGX25CF672C5.
Drop-in-Alternativen für EP1SGX25CF672C5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25CF672C5 (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, RoHS Status, Logic Elements, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25CF672I6
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP1SGX10CF672C7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$182.1 / Stück
Datenblatt ansehen →EP1SGX25CF672C5 Grenzwerte & elektrische Eigenschaften
| Series | Stratix® GX |
| Family | Stratix I GX |
| Number of Logic Elements | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of I/O | 455 |
| Number of Transceivers | 12 |
| Number of Embedded Multipliers | 14 (18x18) |
| Number of PLLs | 4 |
| Core Voltage | 1.425 V to 1.575 V |
| Betriebstemperatur | 0°C to +85°C (Commercial) |
| Gehäuse / Bauform | 672-BBGA, FCBGA |
| Supplier Device Package | 672-FBGA (27x27 mm) |
| Montageart | Surface Mount |
| Process Technology | 0.13 µm CMOS |
EP1SGX25CF672C5 672-fbga (27x27 mm) Pinbelegungsleitfaden
Pinbelegung für EP1SGX25CF672C5 (672-fbga (27x27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX25CF672C5.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX25CF672C5 ist geeignet für 7 Anwendungs: Telecom Line-Card Interface Bridge, Serial Backplane Aggregation, Software-Defined Radio Front-End, DSP Co-Processor for Medical Imaging, ASIC Prototyping and Emulation, Defense Electronics Signal Processing, Industrial Test and Measurement Equipment.
Telecom Line-Card Interface Bridge
The EP1SGX25CF672C5 serves as a high-density protocol bridge between line-card SERDES and backplane fabric in telecom equipment. Its 12 multi-gigabit transceiver channels support protocols such as OC-48, Gigabit Ethernet, and Serial RapidIO simultaneously, while the 25,660 logic elements implement channel aggregation, framing, and clock-data recovery. The 1,944,576-bit embedded RAM provides packet buffering for line-rate processing, and the 672-FBGA package exposes enough user I/O for parallel side-band signaling. Designers typically pair this FPGA with a backplane ASIC or network processor, using the Stratix GX as a flexible adaptation layer.
Empfohlen
Serial Backplane Aggregation
In switching and storage systems, the EP1SGX25CF672C5 functions as a backplane aggregation device, multiplexing multiple lower-speed serial lanes into higher-speed uplinks. The 12 transceivers handle line rates up to 3.125 Gbps per channel, while the 14 embedded 18x18 multipliers accelerate CRC and scrambling operations. The 672-FBGA package supports up to 455 user I/O for backplane management and side-band signals, and the 4 PLLs enable independent clock domains for each aggregation channel. This design pattern is common in enterprise switches, SAN directors, and military ruggedized storage systems.
Empfohlen
Software-Defined Radio Front-End
The EP1SGX25CF672C5 implements digital down-conversion, channelization, and baseband processing in software-defined radio (SDR) systems. The 14 hardware multipliers and 25,660 logic elements enable real-time FFTs, FIR filtering, and modulation/demodulation across multiple channels. The transceiver channels accept digitized IF signals up to 3.125 Gbps, while the abundant block RAM (1,944,576 bits) holds FFT windows and tap coefficients. SDR platforms in defense, public-safety, and cellular base-station applications benefit from the deterministic latency of the hard transceiver IP and the DSP density of the Stratix GX fabric.
Empfohlen
DSP Co-Processor for Medical Imaging
Medical imaging systems such as ultrasound, CT, and MRI scanners leverage the EP1SGX25CF672C5 as a beamforming and image-reconstruction co-processor. The 14 embedded 18x18 multipliers execute the multiply-accumulate operations central to beamforming and inverse FFT reconstruction in real time. The 25,660 logic elements implement the control plane, while 1,944,576 bits of block RAM hold beam coefficients and intermediate image data. The 672-FBGA package supports integration into dense medical cart and OEM system form factors, and the 12 transceivers move raw RF data from the front-end to the processing fabric at line rate.
Empfohlen
ASIC Prototyping and Emulation
ASIC design teams use the EP1SGX25CF672C5 as a prototyping platform for next-generation ASICs targeting high-speed serial I/O. The 25,660 logic elements map to several million gates of equivalent ASIC, while the 12 transceivers emulate multi-gigabit SERDES. The 672-FBGA package exposes a large number of I/O for connecting to external memory, test equipment, and co-emulation logic. Quartus II provides the design environment for synthesis, partitioning, and incremental compile, allowing ASIC RTL to be mapped to one or more Stratix GX FPGAs for hardware verification before tape-out.
Empfohlen
Defense Electronics Signal Processing
Defense and aerospace systems employ the EP1SGX25CF672C5 in radar, electronic warfare (EW), and secure communications platforms. The 12 multi-gigabit transceivers handle high-speed data links between antennas, signal processors, and recording systems, while the embedded multipliers and logic elements implement pulse compression, MTI filtering, and digital beamforming. The 1,944,576-bit block RAM provides fast access to look-up tables and pulse descriptors. The 672-FBGA package, combined with the device's commercial temperature rating, suits ground-based and shipboard installations; airframe and space applications would use the industrial-grade EP1SGX25CF672I6 variant.
Empfohlen
Industrial Test and Measurement Equipment
Test and measurement instruments use the EP1SGX25CF672C5 as a flexible signal-processing engine for protocol analyzers, bit-error-rate testers, and arbitrary waveform generators. The 12 transceivers capture and generate multi-gigabit serial data streams, the 14 embedded multipliers accelerate real-time DSP for jitter analysis and equalization, and the 455 user I/O interface to ADCs, DACs, and front-panel connectors. Quartus II SOPC Builder allows system-on-chip integration of a Nios II soft-core processor for instrument control. The 672-FBGA package is well-suited to high-channel-count benchtop and rack-mount instruments requiring dense PCB layouts.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25CF672C5 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25CF672I6 | EP1SGX10CF672C7N |
|---|---|---|---|
| Package | 672-FBGA (27x27 mm) | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 25,660 | 25,660 | 10,570 (-59%) |
| Number of Transceivers | 12 | 12 | 8 (-33%) |
| Total RAM Bits | 1,944,576 | 1,944,576 | 920,448 (-53%) |
| Embedded Multipliers (18x18) | 14 | 14 | 8 (-43%) |
| Number of PLLs | 4 | 4 | 4 |
| User I/O | 455 | 455 | 455 |
| Core Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Operating Temperature | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Highest-density Stratix GX device in the 672-FBGA family (vs. EP1SGX10CF672C7N)
- Commercial temperature drop-in compatibility with industrial variant (vs. EP1SGX25CF672I6)
- Integrated multi-gigabit transceiver fabric (vs. EP1S25F672C7N)
Designhinweise
The 672-FBGA package uses 1.0 mm ball pitch, which requires a multi-layer PCB with microvia or via-in-pad technology for reliable assembly. According to Altera's package design guidelines, use 1 oz copper on outer layers and matched 50-ohm microstrip routing for all 12 transceiver differential pairs. Place decoupling capacitors (0.1 µF, 0.01 µF, 10 µF) on the bottom side of the BGA within 100 mil of each power pin group to minimize supply noise on the 1.5 V core rail.
All 12 multi-gigabit transceiver channels require 100-ohm differential routing with length matching to within 5 mils of the receiver. The Stratix GX datasheet specifies that the AC-coupling capacitors on each serial link must be placed near the receiver pins and that the reference clock routing must be isolated from high-speed signals. Use the Quartus II IBIS-AMI models for pre-layout channel simulation and verify the final eye mask compliance at production tolerances.
The 27x27 mm FCBGA package has a theta_JA of approximately 11.6 C/W with a standard 4-layer JEDEC test board, which can be reduced to under 6 C/W with a thermal via array under the exposed die pad and adequate airflow. Estimated: at 1.5 V core, 25,660 logic elements, 12 active transceivers at 3.125 Gbps, the part dissipates approximately 8-12 W. Design the thermal solution for at least 10 W worst case to ensure the junction temperature stays below 100°C under commercial temperature conditions.
Do not confuse the EP1SGX25CF672C5 (Stratix GX with transceivers) with the EP1S25F672C7 (Stratix I without transceivers); both share the 672-FBGA package but require completely different pin-out and bitstream files. According to the JAK Electronics comparison reference, replacing a GX part with a non-GX Stratix I removes all multi-gigabit serial functionality. Also note the 'C5' speed grade suffix - moving to C6 or C7 within the same family improves Fmax by approximately 15% per grade but does not change the pin-out or bitstream structure beyond timing constraints.
Compliance-Informationen
RoHS and REACH compliance status for the EP1SGX25CF672C5 was not provided in the verified web data. The 'C5' speed grade suffix and the Altera (Intel) legacy Stratix GX family suggest lead-free and RoHS-compliant assembly per Altera's pre-2010 product transition guidelines, but this must be verified from the official Altera datasheet before use in RoHS-restricted applications. AEC-Q100 is not applicable for a high-density FPGA of this class.