Altera

EP20K400EFI672-2N - APEX-20K FPGA 16640 LEs 488 I/O FBGA-672 | Altera / Intel

Teilenummer: EP20K400EFI672-2N ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
1.71 V to 1.89 V Vdss 672-BBGA, FCBGA Package
Ab $105 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-07
Mengenpreise
Menge Stückpreis Gesamt
1 $185 $185,00
10 $165 $1.650,00
100 $140 $14.000,00
500 $120 $60.000,00
1.000 $105 $105.000,00
ℹ️ Alle Preise sind in USD

EP20K400EFI672-2N Übersicht

The Altera (now Intel) EP20K400EFI672-2N is a member of the APEX-20K® family of CMOS Field-Programmable Gate Arrays (FPGAs), delivering 16,640 logic elements, 212,992 bits of embedded RAM, and 488 user I/O pins in a 672-ball Fine-pitch BGA (FCBGA) package measuring 27 mm x 27 mm. It targets high-density, high-performance glue-logic and co-processing applications in telecom, networking, and DSP acceleration. Operating from a 1.71 V to 1.89 V core supply (VCCINT) and supporting up to 1,052,000 equivalent gates of logic capacity, the EP20K400 integrates 1,664 Logic Array Blocks (LABs) and 488 maximum user I/O pins arranged across multiple I/O banks.

An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose digital logic function is defined after manufacture, allowing designers to program arbitrary combinational and sequential logic using hardware description languages (HDL) such as Verilog or VHDL. FPGAs occupy a position in the digital design hierarchy between fixed-function ASICs (which are cheaper in volume but cannot be modified) and microcontrollers (which run software but offer lower throughput). The APEX-20K family specifically introduced MultiCore™ architecture combining lookup tables (LUTs), embedded memory, and dedicated carry/ cascade chains for arithmetic-intensive designs.

Key features of the EP20K400EFI672-2N include the integrated 212,992-bit embedded SRAM distributed across the logic array, four phase-locked loops (PLLs) for clock management, and support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS via configurable I/O banks. The device supports in-system programmability via IEEE 1149.1 (JTAG) and Altera's passive serial/active serial configuration schemes. The industrial-grade operating range of -40 °C to +100 °C junction temperature makes it suitable for harsh-environment embedded systems.

Architecturally, the EPEX-20K family combines fine-grained logic elements with embedded memory blocks, allowing true dual-port RAM implementations and FIFOs without consuming logic resources. The device supports multi-voltage I/O operation, allowing 3.3 V, 2.5 V, and 1.8 V interfaces simultaneously across separate I/O banks with level-shifting handled internally. This makes the EP20K400 particularly well-suited for bridging legacy 5 V-tolerant peripherals with modern low-voltage processors on the same board.

Typical applications include high-speed data-path bridging, telecommunications line-card glue logic, DSP co-processing front-ends, ATM/SONET framer interfaces, and PCI-to-PCI bridge implementations. The 488 user I/Os make it useful for parallel bus aggregation in legacy industrial control systems and as a pre-processing stage for image or video pipelines.

When designing with the EP20K400EFI672-2N, engineers must provide a stable 1.8 V core supply with adequate decoupling and respect the in-rush current profile during configuration. The FCBGA-672 package requires careful PCB stack-up design to route signals out of the dense 1.0 mm pitch ball grid without compromising signal integrity.

This page synthesizes distributor pricing, lifecycle status, drop-in alternatives drawn from the Altera APEX-20K family, and practical design notes not aggregated on any single manufacturer or distributor page.

Drop-in-Alternativen für EP20K400EFI672-2N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit EP20K400EFI672-2N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Process Technology, Family, Speed Grade.

Intel
Operating Temperature: 0 °C to 85 °C (industrial)
Package: 672-ball FC-FBGA
Process Technology: 0.22 µm CMOS
Vergleichen mit EP20K400EFI672-2N →
Intel
Package: 672-BBGA (FC-FBGA, FineLine BGA)
Process Technology: 0.18 µm CMOS
Family: APEX 20K
Vergleichen mit EP20K400EFI672-2N →
Intel
Operating Temperature: 0 C to 85 C
Process Technology: 0.22 um
Family: APEX 20KE
Vergleichen mit EP20K400EFI672-2N →
Intel
Operating Temperature: 0 C to +85 C (commercial)
Package: 672-ball FC-FBGA
Process Technology: 0.22 um CMOS
Vergleichen mit EP20K400EFI672-2N →
Intel
Operating Temperature: 0 C to 85 C (TJ)
Process Technology: 0.22 um / 0.18 um CMOS
Family: APEX-20KE
Vergleichen mit EP20K400EFI672-2N →
Intel
Operating Temperature: 0 °C to +85 °C (commercial)
Package: 672-BBGA (FC-FBGA)
Family: APEX 20KE
Vergleichen mit EP20K400EFI672-2N →
Altera
Operating Temperature: 0C to +85C (commercial)
Package: 672-ball FineLine BGA (FG672)
Process Technology: 0.18 micron CMOS
Vergleichen mit EP20K400EFI672-2N →
Intel
Operating Temperature: Industrial (per 'I' suffix)
Package: 672-ball PBGA (FineLine BGA, 1.0 mm pitch)
Speed Grade: -1
Vergleichen mit EP20K400EFI672-2N →
Intel
Package: 672-BGA (FineLine BGA, 27 x 27 mm)
Family: APEX 20K
Speed Grade: -1X
Vergleichen mit EP20K400EFI672-2N →
Intel
Operating Temperature: -40 C to +85 C (industrial)
Package: 672-ball FineLine BGA (FI672)
Process Technology: 0.18 micrometer CMOS
Vergleichen mit EP20K400EFI672-2N →
Altera
Package: 672-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Process Technology: 0.22 µm CMOS
Family: APEX 20K
Vergleichen mit EP20K400EFI672-2N →
Intel
Operating Temperature: 0 °C to +85 °C
Package: 672-BBGA, FCBGA
Process Technology: 0.22 µm CMOS
Vergleichen mit EP20K400EFI672-2N →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

EP20K400EFC672-2N

✅ Drop-In
Intel
📦 672-FBGA (27x27)
APEX 20KE · 16,640 · 400,000 (1,052,032 max) · 488 · 672-ball FC-FBGA · 0.22 um CMOS · 1.8 V · 2.5 V

✓ Auf Lager

$171 / Stück

Datenblatt ansehen →

EP20K400EFC672-2

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 672-FBGA (27x27)
APEX 20KE · 16640 · 212992 · 488 · 400000 · 1.8 V · 2.5 ns · 0 C to 85 C

✓ Auf Lager

$92.75 / Stück

Datenblatt ansehen →

EP20K400EFC672-2X

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 672-FBGA (27x27)
APEX-20KE · APEX-20KE · Intel (formerly Altera) · 16,640 · 1,664 · 212,992 · 488 · 1,052,000

✓ Auf Lager

$118.9 / Stück

Datenblatt ansehen →

EP20K400EFC672-3N

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 672-FBGA (27x27)
APEX 20KE · APEX 20K · FPGA - Field Programmable Gate Array · 1,052,000 · 16,640 · 1,664 macros · 212,992 bits · 488

✓ Auf Lager

$171 / Stück

Datenblatt ansehen →

EP20K400EFC672-1N

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 672-FBGA (27x27)
APEX 20KE · 16,640 · 400,000 · 502 (488 per Mouser listing) · 672-ball FC-FBGA · 0.22 µm CMOS · 1.8 V · 2.5 V

✓ Auf Lager

$175 / Stück

Datenblatt ansehen →

EP20K400EFC672-1XN

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 672-FBGA (27x27)
APEX-20KE · APEX 20K · 16,640 · 1,664 · 400,000 · 212,992 · 488

✓ Auf Lager

$215 / Stück

Datenblatt ansehen →

EP20K400EFI672-2N Grenzwerte & elektrische Eigenschaften

Series APEX-20K®
Family APEX-20K E
Manufacturer Altera (now Intel Programmable Solutions Group)
Logic Elements / Cells 16,640
Number of LABs / CLBs 1,664
Total RAM Bits 212,992
Number of Gates (equivalent) 1,052,000
Number of I/O 488
Voltage - Supply (Core VCCINT) 1.71 V to 1.89 V
Betriebstemperatur -40 °C to +100 °C (TJ)
Montageart Surface Mount
Gehäuse / Bauform 672-BBGA, FCBGA
Supplier Device Package 672-FBGA (27 x 27 mm)
Feuchtigkeitsempfindlichkeitsgrad (MSL) 3
Process Technology CMOS
Configuration Method Passive Serial / Active Serial / JTAG

EP20K400EFI672-2N 672-fbga (27 x 27 mm) Pinbelegungsleitfaden

Pinbelegung für EP20K400EFI672-2N (672-fbga (27 x 27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für EP20K400EFI672-2N im 672-fbga (27 x 27 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für EP20K400EFI672-2N.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

EP20K400EFI672-2N ist geeignet für 7 Anwendungs: Telecom Line-Card Glue Logic, DSP Co-Processing Front-End, PCI Bus Bridge and Aggregation, Industrial Motor Control Backplane, Legacy Avionics Display Processing, ATM/SONET Framer Interface, Image Acquisition and Pre-Processing.

🌐

Telecom Line-Card Glue Logic

The EP20K400EFI672-2N's 16,640 logic elements and 488 I/Os make it well-suited for telecom line-card glue logic aggregating multiple serial backplane lanes. Its 212,992 bits of embedded dual-port RAM buffer cell payloads without consuming LUTs, while the four PLLs provide per-port clock synthesis for TDM/SONET/SDH framing. Industrial -40C to +100C rating supports outdoor cabinet deployment. The APEX-20K MultiCore architecture handles parallel bus conversion between legacy 5 V peripherals and modern 1.8 V processors in central-office equipment, with JTAG-based in-system reconfiguration enabling field firmware updates.

🏭

DSP Co-Processing Front-End

The 1,664 LABs and embedded carry chains in the EP20K400EFI672-2N enable it to offload FFT, FIR, and CRC computation from a host DSP or GPP, freeing the host CPU for higher-level protocol work. The 488 user I/Os permit wide parallel data paths to multiple ADC/DAC channels simultaneously, while the 212,992 bits of dual-port RAM hold coefficient tables and overlap buffers. Operating from 1.8 V core, the device dissipates roughly 1.5 to 3 W depending on utilization, manageable with a moderate copper pour. JTAG debug allows logic-analyzer-free verification during algorithm development.

🖥️

PCI Bus Bridge and Aggregation

The EP20K400EFI672-2N was widely deployed as a PCI-to-PCI bridge and as a multi-bus aggregator combining PCI, PMC, and legacy ISA/PCI-X devices onto a single backplane. Its 488 I/Os are sufficient for two 32-bit/66 MHz PCI interfaces plus sideband control signals, and the embedded RAM serves as a posted-write buffer between segments. The 1.8 V core with 3.3 V PCI-compliant I/O banks allows direct bus attachment without external transceivers. Industrial temperature grade supports factory-floor controllers and outdoor telecom equipment where commercial parts fail.

🏭

Industrial Motor Control Backplane

Industrial servo and stepper drive backplanes use the EP20K400EFI672-2N for PWM generation, quadrature encoder decoding, and safety-logic interlocks. The device's industrial -40C to +100C operating range tolerates drive-cabinet ambient temperatures up to 70C with margin. The 488 I/Os aggregate multiple encoder inputs, Hall-sensor feedback, and SPI/I2C peripherals, while embedded dual-port RAM buffers trajectory tables shared between the FPGA and the host MCU. JTAG-based reconfiguration enables field firmware updates for different motor profiles without removing boards.

✈️

Legacy Avionics Display Processing

The EP20K400EFI672-2N served as the video timing controller and overlay compositor in legacy military and commercial avionics Multi-Function Displays (MFDs). Its 488 I/Os drive ARINC 429, MIL-STD-1553, and discrete avionics buses simultaneously, while embedded RAM double-buffers framebuffer contents for flicker-free overlay. The industrial temperature grade and CMOS process technology provide the radiation-tolerance margin required at commercial-avionics altitudes. The FCBGA-672 27x27 mm package fits within the constrained board area of 6.4-inch cockpit displays.

🌐

ATM/SONET Framer Interface

The 16,640 logic elements and 488 I/Os of the EP20K400EFI672-2N were commonly deployed as an ATM/SONET framer interface between line-interface units and a switch fabric ASIC. The device maps 16 to 64 serial STS-1/STM-1 streams into a UTOPIA/SPI-3 parallel bus using its embedded RAM as cell-buffer memory. Its four PLLs synthesize independent per-port clocks at 8 kHz frame rate, and the industrial temperature rating supports outdoor DSLAM/OLT cabinets. Configuration via passive-serial EPC devices keeps BOM cost low for carrier-grade deployments.

🎥

Image Acquisition and Pre-Processing

Machine-vision and medical-imaging front-end boards used the EP20K400EFI672-2N as a Camera Link or LVDS image aggregator that performs real-time preprocessing such as Bayer demosaicing, gamma correction, and histogram equalization before DMA into host memory. The 488 I/Os accommodate four Camera Link channels plus auxiliary control, and the 212,992-bit embedded RAM holds 8 to 16 line buffers at typical 2K resolutions. The industrial temperature grade supports factory-floor machine-vision cameras and clinical-cart imaging systems with strict reliability requirements.

Zusammenfassung der empfohlenen Produkte

EP20K400EFC672-2N Intel Verwendet in: Telecom Line-Card Glue Logic, Legacy Avionics Display Processing, Image Acquisition and Pre-Processing EP20K400EFC672-1N Intel Verwendet in: Telecom Line-Card Glue Logic, Industrial Motor Control Backplane EPC16 Altera serial configuration device Verwendet in: Telecom Line-Card Glue Logic, ATM/SONET Framer Interface EP20K400EFC672-2X Intel Verwendet in: DSP Co-Processing Front-End, ATM/SONET Framer Interface EPC8 Compact configuration PROM Verwendet in: DSP Co-Processing Front-End EP20K400EFC672-3N Intel Verwendet in: PCI Bus Bridge and Aggregation EPC2 Standard PCI-board configuration device Verwendet in: PCI Bus Bridge and Aggregation EPC4 Compact in-system programmable configuration device Verwendet in: Industrial Motor Control Backplane
What is the EP20K400EFI672-2N?
The EP20K400EFI672-2N is an obsolete APEX-20K family FPGA from Altera (now Intel) with 16,640 logic elements, 212,992 bits of embedded RAM, 488 user I/Os, and a 1.71 V to 1.89 V core supply. It is housed in a 672-ball FCBGA (27 x 27 mm) package and is now supplied as new-old-stock by Rochester Electronics and authorized franchised distributors.
Where can I buy the EP20K400EFI672-2N today?
The EP20K400EFI672-2N is obsolete at the manufacturer but is currently listed in stock by Rochester Electronics, Lisleapex, ETEI, Nantian, and Sierra IC, as of the verified web data from 2026-09-08. Stock is limited and pricing reflects the obsolete lifecycle; expect to request a formal quote rather than order off-the-shelf.
What is the price of the EP20K400EFI672-2N in 2026?
Distributor pricing as of 2026-09-08 places the EP20K400EFI672-2N at approximately USD 185 in single-piece quantities, scaling down to USD 105 at 1,000-piece volumes based on franchised broker listings. The price reflects obsolete-part scarcity; Rochester Electronics and authorized distributors typically offer the most consistent quotes.
What is the lead time for the EP20K400EFI672-2N?
Lead time for the EP20K400EFI672-2N is quote-dependent and varies by distributor as of 2026-09-08. Rochester Electronics typically holds bonded inventory with 4 to 8 week lead times; smaller brokers may offer immediate shipment from on-hand stock but at premium pricing. Plan for a minimum 6-week procurement horizon.
Is the EP20K400EFI672-2N obsolete or still active?
The EP20K400EFI672-2N is officially obsolete at the manufacturer (Altera / Intel) per the verified distributor cross-reference data from 2026-09-08. Long-term supply is supported exclusively by Rochester Electronics as a licensed continuation source, with no new silicon production planned.
Where can I download the EP20K400EFI672-2N datasheet PDF?
The Altera APEX-20K datasheet (apex20k.pdf) is the authoritative document covering the EP20K400EFI672-2N and is hosted at https://www.altera.com/literature/ds/apex20k.pdf as referenced in the verified web data. Note that Intel has retired many legacy Altera documentation pages since the 2015 acquisition, so archived copies on distributor sites may be needed.
What is the difference between EP20K400EFI672-2N and EP20K400EFC672-2N?
Both parts share the same 16,640-logic-element APEX-20K die and 672-ball FCBGA package; the difference is in I/O pinout and bank assignments due to the package suffix (FI = industrial temperature BGA, FC = commercial temperature BGA). They are NOT pin-to-pin drop-in equivalents and PCB layout work is required to switch between them.
Can the EP20K400EFI672-2N be replaced by a Cyclone or Stratix device?
No — the EP20K400EFI672-2N cannot be replaced by a Cyclone or Stratix device on the same PCB footprint because those newer families use different package pin maps, different I/O bank voltages, and different configuration schemes. A Cyclone IV EP4CE115 or Cyclone V 5CEFA7 may match the logic capacity but require a complete PCB redesign.
What is the best drop-in replacement for EP20K400EFI672-2N?
The closest true drop-in replacement is the EP20K400EFC672-2N from the same APEX-20K family, though it is a commercial-temperature-grade device and not industrial. Other speed-grade and temperature variants in the same 672-FBGA package (EP20K400EFI672-2X, -1N, -3N) are listed as same-package drop-in alternatives in the Site MPN list.
What is the supply voltage of EP20K400EFI672-2N?
The EP20K400EFI672-2N requires a 1.71 V to 1.89 V core supply (VCCINT) for the logic array and embedded memory, plus separate VCCIO rails per I/O bank (typically 3.3 V, 2.5 V, or 1.8 V) per the APEX-20K datasheet. Auxiliary PLL analog supplies (VCCA_PLL) require filtered 1.8 V derived from the core rail.
What is the operating temperature of EP20K400EFI672-2N?
The EP20K400EFI672-2N operates over an industrial temperature range of -40 °C to +100 °C junction temperature, per the verified microchipusa.com product listing dated 2026-09-08. This makes it suitable for outdoor telecom and industrial control cabinets where commercial-grade parts would fail.
What are the key specifications of EP20K400EFI672-2N that engineers should know?
Key engineer-facing specs: 16,640 logic elements, 1,664 LABs, 212,992 bits of embedded RAM, 488 user I/Os, 1.71 V to 1.89 V core, industrial -40 °C to +100 °C, 672-ball FCBGA at 27 x 27 mm, MSL-3, 1.0 mm ball pitch. The EP20K400E suffix denotes the E-family APEX-20K and the FI denotes industrial-temperature BGA packaging.
What is the best Intel equivalent for EP20K400EFI672-2N?
Intel's closest modern equivalent in the Cyclone family is the EP4CE115F29C7N (Cyclone IV E), with 114,480 logic elements, 388 I/Os, and a 780-ball FBGA. However, it is NOT a drop-in replacement: the package, pinout, I/O bank voltages, and configuration flash interface all differ. PCB redesign and Quartus re-targeting are required.
Does the EP20K400EFI672-2N support JTAG configuration?
Yes — the EP20K400EFI672-2N supports IEEE 1149.1 JTAG boundary-scan and JTAG-based configuration per the APEX-20K family datasheet. JTAG is typically used during development and in-system reconfiguration, while production boards use passive serial configuration from a low-cost EPC serial configuration device such as EPC2 or EPC16.

Technische Referenzdaten für EP20K400EFI672-2N – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the EP20K400EFI672-2N when you need a proven, production-deployed APEX-20K FPGA in industrial temperature grade and have existing Quartus II design flows targeting this exact speed bin. For new designs, prefer the EP20K400EFC672-2N commercial-temperature variant to reduce qualification cost unless the application demands -40C operation. Avoid the -3 speed bin (EP20K400EFC672-3N) unless timing closure is easy — the -2 grade gives ~15% headroom at no cost premium. For modern designs, consider migrating to Cyclone IV EP4CE115F29 or Cyclone V 5CEFA7, both of which offer higher logic density but require full PCB redesign.

Vergleich mit Alternativen

Parameter Dieses Produkt EP20K400EFC672-2N EP20K400EFC672-2 EP20K400EFC672-2X EP20K400EFC672-3N EP20K400EFC672-1N EP20K400EFC672-1XN
Brand Altera Altera Altera Altera Altera Altera Altera
Package 672-FBGA (27x27) 672-FBGA (27x27) 672-FBGA (27x27) 672-FBGA (27x27) 672-FBGA (27x27) 672-FBGA (27x27) 672-FBGA (27x27)
Logic Elements 16,640 16,640 16,640 16,640 16,640 16,640 16,640
Total RAM Bits 212,992 212,992 212,992 212,992 212,992 212,992 212,992
User I/O Count 488 488 488 488 488 488 488
Core Voltage (VCCINT) 1.71 V to 1.89 V 1.71 V to 1.89 V 1.71 V to 1.89 V 1.71 V to 1.89 V 1.71 V to 1.89 V 1.71 V to 1.89 V 1.71 V to 1.89 V
Operating Temperature -40C to +100C (Industrial) 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial)
Speed Grade -2 -2 -2 -2X (extended) -3 (slower) -1 (faster) -1X (extended, faster)

Wichtigste Unterscheidungsmerkmale

  • Industrial temperature grade over commercial-only APEX-20K variants (vs. EP20K400EFC672-2N)
  • Balanced -2 speed grade for moderate-Fmax general-purpose designs (vs. EP20K400EFC672-3N)
  • 512 KB equivalent embedded dual-port RAM in logic fabric (vs. EP20K200FC484-3)

Designhinweise

The EP20K400EFI672-2N requires a 1.71 V to 1.89 V core supply (VCCINT) capable of delivering up to approximately 2.5 A during full logic utilization at 100 MHz, plus separate VCCIO rails per I/O bank. Estimated: total core current scales roughly linearly with switching activity, so a switching-frequency-aware power budget is essential. Use at least 22 µF of bulk ceramic capacitance plus 0.1 µF high-frequency bypass per VCCINT pin, with the same density on each VCCIO bank. PLL analog supplies (VCCA_PLL) must be derived from a filtered ferrite-bead-isolated 1.8 V rail.

The 672-ball FCBGA at 27 x 27 mm uses a 1.0 mm ball pitch, requiring a multilayer PCB (8 or more layers recommended) with laser-drilled microvias to fan out the inner-row balls. Maintain continuous ground and power planes adjacent to the BGA, and use 50 Ω controlled-impedance routing for all LVDS and clock traces. Decoupling capacitors must be placed on the BGA-side of the package within 100 mils of each supply ball to minimize inductive loop area.

Do not assume EP20K400EFI672-2N is interchangeable with newer Altera/Intel devices on the same footprint — the APEX-20K configuration scheme, I/O bank voltages, and JTAG ID differ from Cyclone III/IV/V, Stratix, and Arria families. Attempting to program an APEX-20K bitstream into a Cyclone device will fail and may lock out JTAG access. Always verify configuration PROM contents and target device ID before production programming. The MSL-3 rating requires JEDEC J-STD-033 floor-life management for any board-level rework.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

Compliance data not present in the verified web search results for EP20K400EFI672-2N. APEX-20K family predates the most recent RoHS recasts; original parts were often SnPb-finished. Contact Rochester Electronics for current compliance documentation on bonded inventory.

Daten verifiziert am: 2026-09-08 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Altera Intel EP20K400EFI672-2N EP20K400 APEX-20K FPGA Field-Programmable Gate Array FCBGA 672-FBGA BBGA CMOS logic element logic array block LAB embedded RAM JTAG IEEE 1149.1 Quartus II Rochester Electronics MSL-3 PCI LVDS PLL
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