EP20K1000EBC652-2X - 1M Gate APEX-20KE FPGA, 488 I/O, 652-BGA | Altera (Intel)
Teilenummer: EP20K1000EBC652-2X ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132 | $1.320,00 |
| 100 | $119.5 | $11.950,00 |
| 250 | $109 | $27.250,00 |
| 500 | $99 | $49.500,00 |
EP20K1000EBC652-2X Übersicht
What is an FPGA? A Field-Programmable Gate Array is a semiconductor IC containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells that the designer can configure after manufacture. FPGAs sit between general-purpose microcontrollers (fixed instruction set) and full-custom ASICs (fixed silicon), offering hardware-level parallelism with rapid design iteration. APEX-20KE is Altera's second-generation multi-core architecture (MultiCore) combining look-up table logic with embedded memory (ESBs) and a high-bandwidth bus network for on-chip data movement.
Key features of the EP20K1000EBC652-2X include 488 user I/O pins supporting multiple single-ended and differential I/O standards (LVTTL, LVCMOS, PCI, GTL+, LVDS), four Phase-Locked Loops (PLLs) for clock synthesis and skew management, embedded system blocks (ESBs) for FIFO and dual-port RAM, and a 1.8 V core supply. The device supports in-system programmability via passive serial, JTAG (IEEE 1149.1), and Altera-style configuration modes.
Typical applications for this FPGA include telecommunications infrastructure (ATM switches, SONET/SDH framers, line cards), high-speed data acquisition systems, custom DSP pipelines, image and video processing cards, and embedded compute co-processors. The wide I/O count (488) and generous memory bandwidth make the EP20K1000EBC652-2X well suited to multi-channel interfaces and bus-bridging designs.
When designing with the EP20K1000EBC652-2X, engineers should plan for multi-layer PCB stack-ups to route the 652-ball BGA fan-out, provide decoupling at the core and I/O banks per the Altera pin connection guidelines, and validate signal integrity on high-speed LVDS or GTL+ channels. Legacy Quartus II (Altera) design software is required for synthesis and place-and-route.
This page synthesizes distributor inventory, drop-in same-package alternatives (same 652-BGA footprint, same APEX-20KE logic capacity), and practical design notes for legacy replacement scenarios not found in the manufacturer datasheet alone.
Drop-in-Alternativen für EP20K1000EBC652-2X – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP20K1000EBC652-2X (gleiche Bauform und Footprint) – abweichend in Process Technology, Package, Operating Temperature, Speed Grade, Logic Elements / Cells.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP20K1000EBC652-1X
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP20K1000EBC652-2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP20K1000EBC652-2N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP20K1000EBC652-1X
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP20K1000EBC652-2X Grenzwerte & elektrische Eigenschaften
| Family | APEX-20KE |
| Device Logic Elements | 38,400 |
| Typical Gates | 1,000,000 system gates |
| Embedded Memory Bits | 327,680 bits |
| User I/O Pins | 488 |
| Maximum User I/O | 488 |
| Propagation Delay | 1.6 ns |
| Internal Maximum Frequency | 350 MHz |
| Logic Blocks / Macros | 2,560 macros |
| PLLs | 4 |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 µm (some sources 0.15 µm) all-layer copper-metal CMOS |
| Gehäuse | 652-pin FCBGA / PBGA (45 x 45 mm, 1.27 mm pitch) |
| Montageart | Surface Mount |
| Betriebstemperatur | 0 °C to +85 °C (commercial) |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Altera configuration |
| RoHS-Status | Compliant |
EP20K1000EBC652-2X 652-pin fcbga / pbga (45 x 45 mm, 1.27 mm pitch) Pinbelegungsleitfaden
Pinbelegung für EP20K1000EBC652-2X (652-pin fcbga / pbga (45 x 45 mm, 1.27 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP20K1000EBC652-2X.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP20K1000EBC652-2X ist geeignet für 6 Anwendungs: Telecommunications Line Cards, High-Speed Data Acquisition Systems, Custom DSP Pipeline Acceleration, Image and Video Processing Cards, Embedded Compute Co-Processors, Industrial Control and Automation.
Telecommunications Line Cards
The EP20K1000EBC652-2X is well-suited to telecommunications line cards and switch fabrics because of its 488 user I/O supporting LVTTL/LVDS interfaces and 327,680 bits embedded memory for cell buffering. Its 350 MHz maximum internal frequency and four PLLs enable multi-clock-domain designs typical of SONET/SDH framers and ATM switches. Compared to ASIC development cycles, the APEX-20KE architecture allows rapid prototyping of TDM-to-packet conversion logic. The 1.8 V core voltage keeps per-gate power consumption low enough for forced-air-cooled rack environments, while the commercial 0-85 °C operating range covers central-office (CO) ambient conditions.
Empfohlen
High-Speed Data Acquisition Systems
The EP20K1000EBC652-2X's 488 user I/O pins and 327,680 bits of embedded memory make it a strong fit for parallel multi-channel data acquisition front-ends where analog-to-digital converter data streams are aggregated into FPGAs for pre-processing. The device's 1.6 ns propagation delay supports 200-300 MSPS capture rates when paired with LVDS-deserializer ADCs. Embedded system blocks (ESBs) implement FIFO buffers without consuming logic elements, freeing the 38,400 LEs for DSP filter chains. PCI and GTL+ I/O standards allow direct bus attachment to legacy host processors in industrial instrumentation.
Empfohlen
Custom DSP Pipeline Acceleration
FPGA-based DSP acceleration leverages the EP20K1000EBC652-2X's 38,400 logic elements to implement parallel multiply-accumulate pipelines that outpace sequential DSP processors by orders of magnitude. The 350 MHz internal clock and four PLLs enable multi-rate filter banks, FFT engines, and convolutional coders running in real time. With 327,680 bits of embedded memory, coefficient tables and circular sample buffers stay on-chip, eliminating external memory bottlenecks for streaming workloads. The 1.8 V core keeps power dissipation manageable when dozens of multipliers operate continuously.
Empfohlen
Image and Video Processing Cards
Image and video processing cards benefit from the EP20K1000EBC652-2X's 488 user I/O which can fan out to multiple video decoder/encoder channels simultaneously. The 327,680 bits embedded memory serves as line buffers and motion-estimation search windows without external SDRAM access latency. The 350 MHz maximum frequency supports 1080p60 video pipelines with edge detection, color-space conversion, and scaling in real time. The 652-BGA package exposes sufficient LVDS pairs for digital-camera link interfaces and HDMI/DVI bridge designs in broadcast and video processing.
Empfohlen
Embedded Compute Co-Processors
The EP20K1000EBC652-2X serves as an embedded compute co-processor alongside a host CPU, offloading computation-heavy tasks such as crypto, packet inspection, or scientific kernels. Its 1,000,000 system gates implement custom instruction-set extensions and parallel execution units impossible on fixed-ISA processors. The 488 user I/O provides ample bandwidth for shared-memory or message-passing host links, while the 1.8 V core allows battery-friendly operation in portable instruments. Designers use the JTAG (IEEE 1149.1) interface for boundary-scan test and in-system reconfiguration during firmware updates.
Empfohlen
Industrial Control and Automation
Industrial control and automation systems use the EP20K1000EBC652-2X to implement deterministic real-time controllers, motor-drive interfaces, and multi-axis motion profiles. The 488 I/O handle dozens of encoder, limit-switch, and PWM channels in parallel, while the four PLLs synthesize the precise clock rates required by fieldbus protocols. The 652-BGA package's 1.27 mm pitch supports compact panel-mount PCBs. Designers rely on Altera's Quartus II toolchain for HDL synthesis, allowing control firmware revisions without silicon changes. The commercial 0-85 °C operating range covers most factory-floor enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP20K1000EBC652-2X – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP20K1000EBC652-1X | EP20K1000EBC652-2 | EP20K1000EBC652-2N | EP20K1000EBC652-1X |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 652-BGA (PBGA652) | 652-BGA (PBGA652) - same | 652-BGA (PBGA652) - same | 652-BGA (PBGA652) - same | 652-BGA (PBGA652) - same |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Embedded Memory (bits) | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -2X | -1X (faster) | -2 (same) | -2N (same, industrial) | -1X (faster) |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C | 0 °C to +85 °C |
Wichtigste Unterscheidungsmerkmale
- Speed-grade flexibility within same package (vs. EP20K1000EBC652-1X)
- Commercial temperature variant is lowest-cost option in 652-BGA (vs. EP20K1000EBC652-2N)
- High logic capacity in legacy package (vs. EP20K400EBC652-2X)
Designhinweise
Estimated: A 652-BGA with 1.27 mm pitch on a 45 x 45 mm footprint requires at least a 6-layer PCB stack-up with micro-via fan-out to escape the inner rows of the BGA. Plan for continuous ground and power planes under the device and route signal layers orthogonal (X-Y-X-Y) to minimize crosstalk. Use 0.5 oz copper outer layers and 1 oz inner power/ground planes. The Altera pin connection guidelines recommend decoupling every VCCINT and VCCIO pin with a 0.1 µF X7R ceramic plus a bulk 22 µF tantalum within 100 mils of the package edge. Estimated from generic APEX-20KE BGA fan-out data; refer to the manufacturer datasheet for exact via pattern.
At high-utilization designs (≥80% logic element usage with sustained 350 MHz internal clocks), the EP20K1000EBC652-2X can dissipate 4-7 W. Although the commercial 0-85 °C range is forgiving, designers should still attach the FCBGA exposed die paddle to an inner ground plane with thermal vias on a 1.0 mm grid to keep junction temperature rise below 15 °C above ambient. Forced-air cooling at 200 LFM is recommended in enclosed chassis. Estimated from process and frequency; verify with manufacturer power estimator before sign-off.
Three common pitfalls when designing with EP20K1000EBC652-2X: (1) Forgetting to power-cycle VCCINT before reconfiguring via JTAG - the device can latch into indeterminate states if VCCINT drops below 1.5 V briefly. (2) Mixing LVTTL and LVDS in the same I/O bank - all pins in a bank must use a single VCCIO reference, so place I/O standard regions carefully. (3) Using modern Quartus Prime versions - this part requires Quartus II 13.0 or earlier; Quartus Prime does NOT support APEX-20KE. Designers should source legacy Quartus II from Intel's FPGA software archive.
Compliance-Informationen
RoHS compliant per distributor product pages. Not AEC-Q100 qualified - APEX-20KE is a commercial/industrial family without automotive grade variants. Conflict-minerals compliance per Intel/Altera corporate policy.
