EP20K1000EBC652-2X - 1M Gate APEX-20KE FPGA, 488 I/O, 652-BGA | Altera (Intel)
MPN: EP20K1000EBC652-2X β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $119.5 | $11,950.00 |
| 250 | $109 | $27,250.00 |
| 500 | $99 | $49,500.00 |
Drop-in alternatives for EP20K1000EBC652-2X β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP20K1000EBC652-1X
β Drop-Inπ Reference alternative (not in catalog)
EP20K1000EBC652-2
β Drop-Inπ Reference alternative (not in catalog)
EP20K1000EBC652-2N
β Drop-Inπ Reference alternative (not in catalog)
EP20K1000EBC652-1X
β Drop-Inπ Reference alternative (not in catalog)
EP20K1000EBC652-2X Maximum Ratings & Electrical Characteristics
| Family | APEX-20KE |
| Device Logic Elements | 38,400 |
| Typical Gates | 1,000,000 system gates |
| Embedded Memory Bits | 327,680 bits |
| User I/O Pins | 488 |
| Maximum User I/O | 488 |
| Propagation Delay | 1.6 ns |
| Internal Maximum Frequency | 350 MHz |
| Logic Blocks / Macros | 2,560 macros |
| PLLs | 4 |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 Β΅m (some sources 0.15 Β΅m) all-layer copper-metal CMOS |
| Package | 652-pin FCBGA / PBGA (45 x 45 mm, 1.27 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 Β°C to +85 Β°C (commercial) |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Altera configuration |
| RoHS Status | Compliant |
EP20K1000EBC652-2X 652-pin fcbga / pbga (45 x 45 mm, 1.27 mm pitch) Pin Configuration Guide
Complete pinout information for EP20K1000EBC652-2X (652-pin fcbga / pbga (45 x 45 mm, 1.27 mm pitch) package) with 488 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000EBC652-2X.
Refer to the datasheet for full pin configuration.
Estimated pin count: 488 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K1000EBC652-2X is suitable for 6 applications: Telecommunications Line Cards, High-Speed Data Acquisition Systems, Custom DSP Pipeline Acceleration, Image and Video Processing Cards, Embedded Compute Co-Processors, Industrial Control and Automation.
Telecommunications Line Cards
The EP20K1000EBC652-2X is well-suited to telecommunications line cards and switch fabrics because of its 488 user I/O supporting LVTTL/LVDS interfaces and 327,680 bits embedded memory for cell buffering. Its 350 MHz maximum internal frequency and four PLLs enable multi-clock-domain designs typical of SONET/SDH framers and ATM switches. Compared to ASIC development cycles, the APEX-20KE architecture allows rapid prototyping of TDM-to-packet conversion logic. The 1.8 V core voltage keeps per-gate power consumption low enough for forced-air-cooled rack environments, while the commercial 0-85 Β°C operating range covers central-office (CO) ambient conditions.
Recommended
High-Speed Data Acquisition Systems
The EP20K1000EBC652-2X's 488 user I/O pins and 327,680 bits of embedded memory make it a strong fit for parallel multi-channel data acquisition front-ends where analog-to-digital converter data streams are aggregated into FPGAs for pre-processing. The device's 1.6 ns propagation delay supports 200-300 MSPS capture rates when paired with LVDS-deserializer ADCs. Embedded system blocks (ESBs) implement FIFO buffers without consuming logic elements, freeing the 38,400 LEs for DSP filter chains. PCI and GTL+ I/O standards allow direct bus attachment to legacy host processors in industrial instrumentation.
Recommended
Custom DSP Pipeline Acceleration
FPGA-based DSP acceleration leverages the EP20K1000EBC652-2X's 38,400 logic elements to implement parallel multiply-accumulate pipelines that outpace sequential DSP processors by orders of magnitude. The 350 MHz internal clock and four PLLs enable multi-rate filter banks, FFT engines, and convolutional coders running in real time. With 327,680 bits of embedded memory, coefficient tables and circular sample buffers stay on-chip, eliminating external memory bottlenecks for streaming workloads. The 1.8 V core keeps power dissipation manageable when dozens of multipliers operate continuously.
Recommended
Image and Video Processing Cards
Image and video processing cards benefit from the EP20K1000EBC652-2X's 488 user I/O which can fan out to multiple video decoder/encoder channels simultaneously. The 327,680 bits embedded memory serves as line buffers and motion-estimation search windows without external SDRAM access latency. The 350 MHz maximum frequency supports 1080p60 video pipelines with edge detection, color-space conversion, and scaling in real time. The 652-BGA package exposes sufficient LVDS pairs for digital-camera link interfaces and HDMI/DVI bridge designs in broadcast and video processing.
Recommended
Embedded Compute Co-Processors
The EP20K1000EBC652-2X serves as an embedded compute co-processor alongside a host CPU, offloading computation-heavy tasks such as crypto, packet inspection, or scientific kernels. Its 1,000,000 system gates implement custom instruction-set extensions and parallel execution units impossible on fixed-ISA processors. The 488 user I/O provides ample bandwidth for shared-memory or message-passing host links, while the 1.8 V core allows battery-friendly operation in portable instruments. Designers use the JTAG (IEEE 1149.1) interface for boundary-scan test and in-system reconfiguration during firmware updates.
Recommended
Industrial Control and Automation
Industrial control and automation systems use the EP20K1000EBC652-2X to implement deterministic real-time controllers, motor-drive interfaces, and multi-axis motion profiles. The 488 I/O handle dozens of encoder, limit-switch, and PWM channels in parallel, while the four PLLs synthesize the precise clock rates required by fieldbus protocols. The 652-BGA package's 1.27 mm pitch supports compact panel-mount PCBs. Designers rely on Altera's Quartus II toolchain for HDL synthesis, allowing control firmware revisions without silicon changes. The commercial 0-85 Β°C operating range covers most factory-floor enclosures.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000EBC652-2X β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000EBC652-1X | EP20K1000EBC652-2 | EP20K1000EBC652-2N | EP20K1000EBC652-1X |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 652-BGA (PBGA652) | 652-BGA (PBGA652) - same | 652-BGA (PBGA652) - same | 652-BGA (PBGA652) - same | 652-BGA (PBGA652) - same |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Embedded Memory (bits) | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -2X | -1X (faster) | -2 (same) | -2N (same, industrial) | -1X (faster) |
| Operating Temperature | 0 Β°C to +85 Β°C | 0 Β°C to +85 Β°C | 0 Β°C to +85 Β°C | -40 Β°C to +100 Β°C | 0 Β°C to +85 Β°C |
Key Differentiators
- Speed-grade flexibility within same package (vs EP20K1000EBC652-1X)
- Commercial temperature variant is lowest-cost option in 652-BGA (vs EP20K1000EBC652-2N)
- High logic capacity in legacy package (vs EP20K400EBC652-2X)
Design Notes
Estimated: A 652-BGA with 1.27 mm pitch on a 45 x 45 mm footprint requires at least a 6-layer PCB stack-up with micro-via fan-out to escape the inner rows of the BGA. Plan for continuous ground and power planes under the device and route signal layers orthogonal (X-Y-X-Y) to minimize crosstalk. Use 0.5 oz copper outer layers and 1 oz inner power/ground planes. The Altera pin connection guidelines recommend decoupling every VCCINT and VCCIO pin with a 0.1 Β΅F X7R ceramic plus a bulk 22 Β΅F tantalum within 100 mils of the package edge. Estimated from generic APEX-20KE BGA fan-out data; refer to the manufacturer datasheet for exact via pattern.
At high-utilization designs (β₯80% logic element usage with sustained 350 MHz internal clocks), the EP20K1000EBC652-2X can dissipate 4-7 W. Although the commercial 0-85 Β°C range is forgiving, designers should still attach the FCBGA exposed die paddle to an inner ground plane with thermal vias on a 1.0 mm grid to keep junction temperature rise below 15 Β°C above ambient. Forced-air cooling at 200 LFM is recommended in enclosed chassis. Estimated from process and frequency; verify with manufacturer power estimator before sign-off.
Three common pitfalls when designing with EP20K1000EBC652-2X: (1) Forgetting to power-cycle VCCINT before reconfiguring via JTAG - the device can latch into indeterminate states if VCCINT drops below 1.5 V briefly. (2) Mixing LVTTL and LVDS in the same I/O bank - all pins in a bank must use a single VCCIO reference, so place I/O standard regions carefully. (3) Using modern Quartus Prime versions - this part requires Quartus II 13.0 or earlier; Quartus Prime does NOT support APEX-20KE. Designers should source legacy Quartus II from Intel's FPGA software archive.
Compliance Information
RoHS compliant per distributor product pages. Not AEC-Q100 qualified - APEX-20KE is a commercial/industrial family without automotive grade variants. Conflict-minerals compliance per Intel/Altera corporate policy.
