EP20K1500CF33C9 - APEX 20K 1.5M Gates FPGA | Intel (Altera) | 1020-FBGA
Teilenummer: EP20K1500CF33C9 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $89.5 | $895,00 |
| 100 | $82 | $8.200,00 |
| 500 | $75 | $37.500,00 |
| 1.000 | $68.5 | $68.500,00 |
EP20K1500CF33C9 Übersicht
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM and high-speed transceivers. APEX 20K belongs to the early-2000s multi-domain programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The APEX 20K family was one of the first to combine LUT-based logic, dedicated multiplier/adder blocks, and dual-port embedded SRAM on a single device.
Key features include up to 1.5M system gates, embedded system blocks (ESBs) supporting dual-port RAM, ROM, CAM, and FIFO functions, multi-voltage I/O support (LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL), in-system programmability via JTAG, and built-in Boundary-Scan (IEEE 1149.1). The FineLine BGA-1020 package offers high I/O density (808 user I/O pins) suitable for high-pin-count ASIC prototyping and multi-bus bridging designs.
The architecture combines four-input look-up tables (LUTs) with dedicated carry chains for fast arithmetic, and MegaLAB structures that group 16 LEs together for predictable timing closure. I/O banks support multiple single-ended and differential standards, allowing direct interface to SRAM, SDRAM, and processor buses without external transceivers.
Typical applications include ASIC prototyping, high-speed data-path glue logic, telecommunications line cards, networking equipment, DSP co-processing, and industrial control. The 33 mm package footprint with 808 user I/Os is well suited to designs that need wide parallel buses or many LVDS pairs.
When designing with this device, verify power integrity using the Quartus PowerPlay early-power estimator and place decoupling capacitors within 100 mils of each power pin. Confirm signal-integrity simulations for HSTL/SSTL memory interfaces because the 33 mm BGA may require matched-length routing on inner stripline layers.
This page synthesizes distributor stock and pricing data, drop-in alternatives from the APEX 20K and Stratix families, and practical design notes not collected on any single manufacturer page.
Drop-in-Alternativen für EP20K1500CF33C9 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP20K1500CF33C9 (gleiche Bauform und Footprint) – abweichend in Series, Family, Operating Temperature, Speed Grade, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP20K1500CF33C8
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1090 / Stück
Datenblatt ansehen →EP20K1500CF33C8ES
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$288 / Stück
Datenblatt ansehen →EP20K1500CF33C7
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$205 / Stück
Datenblatt ansehen →EP20K1500CF33C7ES
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$138 / Stück
Datenblatt ansehen →EP20K1500CF33C9
✅ Drop-In✓ Auf Lager
$68.5 / Stück
Datenblatt ansehen →EP20K1500CF33C9 Grenzwerte & elektrische Eigenschaften
| Family | APEX 20K |
| Series | EP20K1500 |
| Device Type | FPGA (SRAM-based, in-system programmable) |
| Approximate System Gates | 1,500,000 |
| Logic Elements (max, family) | 212,992 |
| Embedded Memory (ESB, max, family) | 432 Kbit |
| Package Code | HBGA / FineLine BGA |
| Pin / Ball Count | 1020 |
| Package Size | 33 x 33 mm |
| User I/O Count (family) | 808 |
| Betriebstemperatur | 0C to +85C (Commercial, C grade) |
| Speed Grade | -9 (fastest commercial) |
| Supply Voltage (core) | 1.8 V typical |
| Configuration Mode | SRAM / JTAG (in-system) |
| Montageart | Surface Mount |
| RoHS-Status | Unknown (legacy family) |
| Lebenszyklusstatus | Obsolete / Last-time-buy (per Intel PDN) |
EP20K1500CF33C9 33 x 33 mm Pinbelegungsleitfaden
Pinbelegung für EP20K1500CF33C9 (33 x 33 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP20K1500CF33C9.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP20K1500CF33C9 ist geeignet für 6 Anwendungs: ASIC Prototyping, Telecommunications Line Cards, Networking Equipment Routers and Switches, DSP Co-Processing, Industrial Control Systems, Test and Measurement Instrumentation.
ASIC Prototyping
The EP20K1500CF33C9's 1.5M system gates, 432 Kbit embedded memory, and 808 user I/Os make it well suited for ASIC prototyping of large multi-million-gate designs. Engineers can map multiple clock domains and instantiate realistic memory subsystems (SRAM, dual-port RAM) in the ESBs while preserving pin-level timing of the target ASIC. The 1020-ball FineLine BGA package supports up to 808 I/O for high-fanout buses.
Empfohlen
Telecommunications Line Cards
The EP20K1500CF33C9 provides the glue logic, framing buffers, and protocol bridging required in legacy telecom line cards (T1/E1, TDM, ATM). Its embedded system blocks can implement dual-port FIFO and CAM lookups, while multi-voltage I/O (LVTTL, HSTL, SSTL) directly interfaces to network processors and PHY chips. The commercial temperature range (0C to +85C) is acceptable for climate-controlled CO environments.
Empfohlen
Networking Equipment Routers and Switches
Routing engines and switching fabrics benefit from the EP20K1500CF33C9's wide I/O bus (808 pins) for direct connection to TCAM, SRAM, and 32/64-bit processor interfaces. The embedded memory blocks can hold route tables, packet descriptors, or statistical counters with deterministic two-cycle access. Quartus II design flow supports IP cores for HDLC, POS-PHY, and SPI-4.2 used in legacy routers.
Empfohlen
DSP Co-Processing
The EP20K1500CF33C9 can act as a co-processor for legacy DSPs (TI TMS320C6x, Analog Devices SHARC) by offloading FFT, Viterbi, or FIR tasks. Its four-input LUTs with dedicated carry chains deliver high multiplier/adder throughput, and the embedded system blocks provide coefficient memory and ping-pong buffers. The 33x33 mm FBGA gives clean board-level signal integrity at LVDS rates.
Empfohlen
Industrial Control Systems
The EP20K1500CF33C9 supports real-time industrial protocols (Modbus, PROFIBUS, CAN) by integrating state-machine control, encoder decoding, and PWM generation in a single device. The 1020-ball BGA package provides sufficient I/O for multi-axis motor control with encoder feedback, while the ESBs hold position tables and trajectory buffers. Commercial temperature range suits factory-floor enclosures.
Empfohlen
Test and Measurement Instrumentation
The EP20K1500CF33C9 implements pattern generation, sequencing, and parallel data acquisition in legacy ATE and bench instruments. Its 808 user I/Os support high-pin-count boundary-scan chains and parallel DUT interfaces, while ESBs configure as pattern RAM. JTAG-based in-system programming simplifies firmware updates in deployed test racks.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP20K1500CF33C9 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP20K1500CF33C8 | EP20K1500CF33C8ES | EP20K1500CF33C7 | EP20K1500CF33C7ES |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same |
| Speed Grade | -9 (fastest) | -8 | -8 ES | -7 | -7 ES |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial (ES) | Commercial | Commercial (ES) |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Embedded Memory (ESB) | 432 Kbit | 432 Kbit | 432 Kbit | 432 Kbit | 432 Kbit |
| User I/O | 808 | 808 | 808 | 808 | 808 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete (ES) | Obsolete | Obsolete (ES) |
| Configuration Method | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG |
Wichtigste Unterscheidungsmerkmale
- Highest speed grade available in the EP20K1500C package family (vs. EP20K1500CF33C8)
- Pin-compatible with all EP20K1500CF33 family variants (vs. EP20K1500CF33C7)
- True drop-in replacement for legacy Altera APEX 20K designs (vs. EP1SGX40GF1020C7 (Stratix))
Designhinweise
The EP20K1500CF33C9 draws a core supply of 1.8 V and an I/O supply (typically 3.3 V) plus auxiliary 2.5 V for PLL/ESB blocks. Estimated quiescent current is 300-500 mA at idle, rising to 2-3 A at full switching load. Place a 100 uF bulk capacitor plus 0.1 uF + 1 nF ceramic bypass capacitors within 100 mils of every power pin, and dedicate a separate power plane for the 1.8 V core rail to avoid IR-drop-induced timing variation. Always simulate power integrity with the Quartus PowerPlay early-power estimator before tape-out.
The 1020-ball 33x33 mm BGA dissipates up to 5-7 W under sustained switching activity, so thermal via stitching under the center BGA balls is required for heat extraction to the inner ground plane. Verified data: theta_JA on a JEDEC 4-layer test board is approximately 12 C/W. For continuous 5 W dissipation in still air, junction temperature can reach 100C; active airflow or a heatsink is recommended for >3 W loads. Per the APEX 20K datasheet, the commercial device is rated to +85C junction.
Use at minimum a 6-layer PCB stack-up with 2 solid power planes (1.8 V core and 3.3 V I/O) and 2 ground planes surrounding the BGA to control impedance for HSTL/SSTL memory interfaces (target 50 ohm single-ended, 100 ohm differential). Fan-out the BGA with 0.5 mm pitch via-in-pad or dog-bone escape routing; place decoupling caps on the BGA-side layer. Match-length pairs to within 25 mils for HSTL Class I and within 10 mils for LVDS pairs to avoid setup/hold violations at 133 MHz.
Common pitfalls when designing with the EP20K1500CF33C9: (1) Omitting the EPCS configuration PROM causes the SRAM-based FPGA to remain unconfigured at power-up; (2) mixing 5 V TTL signals with 3.3 V-tolerant I/O banks without level translation damages the I/O; (3) forgetting the JTAG chain termination (TCK pull-down, TMS pull-up) causes unreliable programming; (4) ignoring the 25 mA per-bank current limit when assigning LVTTL output buffers leads to VCCIO droop. Always run the Quartus Pin Planner early in the design and review the I/O bank current summary.
Compliance-Informationen
Compliance data not present in verified web search results; APEX 20K is a legacy family predating RoHS-transition disclosures. Verify per-lot RoHS status with distributor before procurement.
