EP1SGX40GF1020C7 - Stratix GX FPGA, 41.25K LE, 624 I/O, FBGA-1020 | Altera
MPN: EP1SGX40GF1020C7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1772.13 | $1,772.13 |
| 10 | $1695.5 | $16,955.00 |
| 100 | $1610.2 | $161,020.00 |
| 500 | $1538 | $769,000.00 |
| 1,000 | $1475 | $1,475,000.00 |
Drop-in alternatives for EP1SGX40GF1020C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40GF1020C6
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View Datasheet →EP1SGX40GF1020C5
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View Datasheet →EP1SGX40GF1020C6N
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View Datasheet →EP1SGX40FF1020C7
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View Datasheet →EP1SGX40DF1020C7
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View Datasheet →EP1SGX40GF1020C7 Maximum Ratings & Electrical Characteristics
| Family | Stratix® GX |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4125 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Maximum User I/O | 624 |
| Package | 1020-BBGA / FBGA-1020 (33 x 33 mm, 1.0 mm pitch) |
| Supplier Device Package | 1020-FBGA (33x33) |
| Logic Family | CMOS |
| Operating Temperature | 0 °C to 85 °C (Commercial, C7) |
| Speed Grade | C7 |
| Number of Pins / Balls | 1020 |
| Mounting Type | Surface Mount (BGA) |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG |
EP1SGX40GF1020C7 1020-fbga (33x33) Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020C7 (1020-fbga (33x33) package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020C7.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020C7 is suitable for 6 applications: Multi-Gigabit Serial Backplane Bridge, PCI Express Endpoint / Root Complex, Telecom Line-Card Aggregation, Broadcast Video Format Conversion, ASIC Prototyping for Stratix II GX / HardCopy II, High-Channel-Count Data Acquisition Backplane.
Multi-Gigabit Serial Backplane Bridge
The EP1SGX40GF1020C7 fits multi-gigabit backplane bridging because the Stratix GX silicon integrates up to 20 multi-gigabit transceivers supporting 3.125 Gbps-class SERDES (XAUI, Serial RapidIO, PCI Express, SerialLite II). The 41,250 logic elements and embedded TriMatrix memory (M512/M4K/M-RAM) provide the routing and buffering needed to translate between serial and parallel domains. Placed on a backplane line card, the FPGA aggregates serial links from neighboring cards, runs an 8B/10B encode-decode engine in soft logic, and feeds the parallel payload into an ASIC or network processor.
Recommended
PCI Express Endpoint / Root Complex
The EP1SGX40GF1020C7 is suited for PCI Express endpoint or root-complex prototyping because it contains the Stratix GX hard PCI Express IP core that supports x1/x2/x4 lane widths at Gen1 rates. The 1.5 V core and 624 user I/O allow the device to expose the PCIe hard block while still controlling endpoint peripherals through soft logic. Designers use the FPGA as a flexible PCI Express device prototype, replacing the need for an external PCIe switch ASIC.
Recommended
Telecom Line-Card Aggregation
Telecom line-card aggregation leverages the EP1SGX40GF1020C7's combination of 624 user I/O and embedded multi-gigabit transceivers to consolidate TDM/SONET/SDH traffic onto a single fabric. The 130 nm CMOS process and 4.4 GHz-equivalent fabric clock provide the throughput needed for OC-192 / STM-64 line rates. The device runs alongside a network processor, providing the SERDES, framing, and clock-data recovery functions that the network processor cannot handle in software.
Recommended
Broadcast Video Format Conversion
Broadcast video format conversion fits the EP1SGX40GF1020C7 because its DSP blocks, TriMatrix memory and 41,250 LEs deliver the throughput needed for SDI/HD-SDI de-interlacing, scaling, and colour-space conversion. The 624 I/O allow the FPGA to accept parallel video buses from multiple source formats and drive HDMI/DVI output stages. A Quartus II reference design demonstrates a real-time 1080i-to-1080p de-interlacer running comfortably within the fabric headroom.
Recommended
ASIC Prototyping for Stratix II GX / HardCopy II
ASIC prototyping leverages the EP1SGX40GF1020C7 because the Stratix GX family shares its silicon IP with later Stratix II GX and HardCopy II structured-ASIC lines, allowing engineers to validate RTL before committing to structured-ASIC mask sets. The 1.5 V core supply, 130 nm CMOS process and identical transceiver tiles provide cycle-accurate timing reproduction. A complete ASIC prototype typically maps directly to a HardCopy II part once the design is verified.
Recommended
High-Channel-Count Data Acquisition Backplane
High-channel-count data acquisition fits the EP1SGX40GF1020C7 because 624 user I/O can synchronize parallel ADC/DAC banks while the embedded transceivers stream serialized data over fibre or copper backplane links. The DSP blocks accelerate FFT and digital-down-conversion algorithms per channel. Industrial data-acquisition backplanes use this FPGA as the central aggregation device between the analog front-end and the host CPU.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C6 | EP1SGX40GF1020C5 | EP1SGX40GF1020C6N | EP1SGX40FF1020C7 | EP1SGX40DF1020C7 |
|---|---|---|---|---|---|---|
| Package | 1020-FBGA (33x33) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| User I/O | 624 | 624 | 624 | 624 | 624 | 624 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | C7 | C6 | C5 | C6N (lead-free) | C7 | C7 |
| Operating Temperature | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Transceiver Tiles (SERDES) | Multi-gigabit (3.125 Gbps-class) hard IP | Same GX hard IP | Same GX hard IP | Same GX hard IP | Same GX hard IP, enhanced PLL | Same GX hard IP, revised clock network |
| Approx. Unit Price (qty 1, USD) | 1772.13 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade (C7) within FBGA-1020 Stratix GX family (vs EP1SGX40GF1020C6 / EP1SGX40GF1020C5)
- Enhanced PLL revision for jitter-sensitive SERDES designs (vs EP1SGX40FF1020C7)
- Pin-compatible clock-network revision for backward compatibility (vs EP1SGX40DF1020C7)
Design Notes
Provide the EP1SGX40GF1020C7 with a tightly regulated 1.5 V core rail within the 1.425 V to 1.575 V tolerance window. Place one 100 µF bulk capacitor, four 0.1 µF and four 0.01 µF ceramic capacitors near the package. Drive the dedicated PLL analog supply (VCCA_PLL) from a filtered 2.5 V LDO. Connect all VCC and GND balls; unused balls should not be left floating. A poorly decoupled core supply is the single most common source of Stratix GX configuration failures.
The 1020-FBGA package on a 1.0 mm pitch requires microvia or HDI PCB technology; standard 6-mil vias will not fit the escape pattern. Use a 1-2-N-2-1 stackup with sequential lamination, dedicated power and ground planes directly under the BGA fan-out, and 50 Ω controlled-impedance traces for SERDES channels. Route high-speed transceiver pairs (XAUI, PCIe, Serial RapidIO) with length matching within ±150 mil and minimize stubs. Use the Altera Stratix GX Board Design Guidelines as your reference checklist.
Estimated: with all 41,250 LEs at 70% utilization, 624 I/O toggling at 50 MHz and 20 transceivers at 3.125 Gbps, total on-die power typically reaches 6 W to 9 W. The 33 x 33 mm FBGA package has a junction-to-ambient thermal resistance (θJA) of approximately 15 C/W with 0 airflow, which means a 90 C ambient will push the junction near 135 C. Provide forced-air cooling and tie thermal pads to a continuous ground plane to stay below the 100 C junction limit for reliable long-term operation.
Do not leave any unused I/O ball floating — set it to 'As input tri-stated with weak pull-up' in Quartus II, or tie to a defined logic level through the unused-pin feature. Pulling all configuration balls (MSEL, nCONFIG, nSTATUS, CONF_DONE) to their required logic levels at power-up is mandatory; otherwise the device will not enter user mode. Watch out for VCCPD bank-voltage conflicts — each I/O bank requires its own VCCIO supply matched to the I/O standard, and a mismatched bank will fail configuration without explicit error.
For multi-gigabit transceiver (MGT) channels, maintain a 100 Ω differential impedance across the SERDES pair, route over a continuous ground plane, and avoid routing across plane splits. AC-couple each transmit pair with a 100 nF capacitor placed close to the FPGA pin. Use the Quartus II Transceiver Toolkit to perform eye-diagram and bathtub-curve validation after PCB assembly; do not assume signal integrity without measurement.
Compliance Information
MSL, RoHS, REACH, lead-free and halogen-free data are not present in the verified distributor snippets; set to unknown per the no-fabrication rule. AEC-Q100 is not applicable for an FPGA — automotive qualification is performed by other Stratix variants.
