EP20K200RC240-1 - APEX 20K FPGA 200K Gates 8320 Cells | Intel
Teilenummer: EP20K200RC240-1 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $79.2 | $7.920,00 |
| 500 | $71.4 | $35.700,00 |
| 1.000 | $65 | $65.000,00 |
EP20K200RC240-1 Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be redefined by the designer after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), bridging the gap between fixed-function ASICs and software-defined processors. The APEX 20K family extends this further by combining LUT logic, product-term logic, and embedded memory on a single MultiCore architecture, eliminating the need for external companion chips in many designs.
Key features of the EP20K200RC240-1 include its MultiCore architecture combining look-up table (LUT) logic, product-term logic, and embedded memory blocks, LVDS-capable I/O support, in-system programmability via SRAM configuration cells, and dedicated interfaces such as the FastTrack interconnect and a PLL-rich clock network. The exposed thermal pad on the 240-BFQFP package improves heat spreading for sustained high-utilization designs.
Technically, the device is implemented on a 0.22 µm CMOS process, supports a 2.5 V core supply, and provides 8320 logic elements (LEs) and 106,496 RAM bits across four embedded array blocks (EABs). The LVDS I/O option (-1 suffix indicates the speed grade) supports low-voltage differential signaling, which is critical for reducing EMI in high-speed parallel buses between FPGAs and external memory or backplane transceivers.
Typical applications include telecommunications infrastructure (SONET/SDH framer interfaces, ATM switching), high-speed data acquisition and DSP pre-processing, ASIC prototyping, and embedded control systems in industrial and military designs. The wide gate count makes it suitable for multi-channel signal conditioning pipelines.
When designing with the EP20K200RC240-1, ensure the Quartus II toolchain (or MAX+PLUS II for legacy designs) is used for synthesis, place-and-route, and timing closure. Decoupling capacitors must be placed adjacent to every VCCINT/VCCIO pin pair, and the exposed pad must be soldered to a continuous ground plane for thermal performance and signal return paths.
This page synthesizes distributor pricing for the EP20K200RC240-1, a curated list of same-package drop-in alternatives within the APEX 20K family, and practical PCB layout notes not consolidated in the original datasheet.
Drop-in-Alternativen für EP20K200RC240-1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP20K200RC240-1 (gleiche Bauform und Footprint) – abweichend in Package, Family, Speed Grade, Process Technology, Maximum Internal Frequency.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP20K200RC240-1N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP20K200RC240-1X
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP20K200BC356-3
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$162 / Stück
Datenblatt ansehen →EP20K200CB356C7ES
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$108.5 / Stück
Datenblatt ansehen →EP20K200RC240-1 Grenzwerte & elektrische Eigenschaften
| Family | APEX 20K |
| Device Family Subseries | 20KE (1.8V, LVDS capable) |
| Logic Elements / Cells | 8320 |
| Total Gates | 200,000 |
| Embedded Memory Bits | 106,496 |
| Maximum User I/O | 174 |
| Maximum Internal Frequency | 250 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Voltage | 2.5 V |
| Speed Grade | -1 |
| Gehäuse | 240-BFQFP Exposed Pad (RQFP) |
| Pin-Anzahl | 240 |
| Montageart | Surface Mount |
| LVDS I/O Support | Yes (per APEX 20KE subseries) |
EP20K200RC240-1 240-bfqfp exposed pad (rqfp) Pinbelegungsleitfaden
Pinbelegung für EP20K200RC240-1 (240-bfqfp exposed pad (rqfp)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP20K200RC240-1.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP20K200RC240-1 ist geeignet für 6 Anwendungs: Telecommunications Infrastructure (SONET/SDH Framing), High-Speed Data Acquisition and DSP Pre-Processing, ASIC Prototyping and Emulation, Embedded Industrial Control Systems, Military and Aerospace Avionics (Legacy Programs), Networking Switch and Router Line Cards.
Telecommunications Infrastructure (SONET/SDH Framing)
The EP20K200RC240-1 fits telecommunications infrastructure applications because its 200,000-gate capacity and 8,320 logic elements can implement multi-channel SONET/SDH framer and mapper functions in a single device. With a 250 MHz internal frequency and LVDS-capable I/O on the APEX 20KE subseries, the FPGA handles high-speed serial backplane interfaces between line cards and cross-connect fabrics, while the 106,496 bits of embedded memory provide per-channel elastic stores and pointer-processing buffers. Placed on the line card between the optical transceiver and the network processor, the device consumes roughly 1.5–2 W at typical utilisation. Compared to discrete TTL framer implementations, this integrated approach reduces board area and BOM while supporting in-field firmware upgrades via SRAM configuration.
Empfohlen
High-Speed Data Acquisition and DSP Pre-Processing
The EP20K200RC240-1 is suitable for high-speed data acquisition front-ends and DSP pre-processing pipelines because its 106,496 bits of embedded memory serve as dual-ported sample buffers between ADC FIFOs and downstream DSP processors. With 174 user I/O pins, the FPGA can interface directly to parallel ADCs (e.g., 14-bit @ 65 MSPS) and provide gain/offset calibration, decimation filtering, and trigger logic. The 250 MHz internal frequency supports multiply-accumulate operations at rates suitable for radar, sonar, and instrumentation front-ends. Power dissipation is approximately 1–2 W at typical 60% utilisation. Unlike discrete DSP chips, the EP20K200 allows algorithm updates without board respin, and its LVDS I/O simplifies connection to modern high-speed converters.
Empfohlen
ASIC Prototyping and Emulation
The EP20K200RC240-1 is well suited for ASIC prototyping and hardware emulation because its 200,000-gate capacity can host mid-complexity ASIC designs (up to ~150K ASIC gates equivalent) with full timing-accurate behaviour. The SRAM-based configuration allows unlimited design iterations via JTAG, and the embedded memory blocks serve as register-file and FIFO models. Multiple EP20K200 devices can be cascaded via the FastTrack interconnect to prototype larger ASICs. Compared to ASIC NRE, the EP20K200-based prototype reduces development cost by 80–90% for designs in the 50K–150K gate range, with the trade-off of higher per-unit cost in volume production.
Empfohlen
Embedded Industrial Control Systems
The EP20K200RC240-1 fits embedded industrial control applications because its MultiCore architecture combining LUT logic, product-term logic, and embedded memory matches the mixed requirements of state-machine controllers with table lookups. With 174 user I/O pins, the FPGA can directly drive numerous sensors, actuators, and motor-control PWM channels without external bus-expanders. The exposed thermal pad on the 240-BFQFP package supports sustained operation in enclosed industrial enclosures. Power dissipation is typically 1.5 W at 70% utilisation, manageable without active cooling. Unlike microcontroller-based solutions, the FPGA provides deterministic sub-microsecond response times essential for safety-critical industrial interlocks.
Empfohlen
Military and Aerospace Avionics (Legacy Programs)
The EP20K200RC240-1 remains in service in legacy military and aerospace avionics programs because the APEX 20K family was qualified to MIL-STD-883 and supported in long-lifecycle defence contracts. With its 200K-gate logic capacity and LVDS I/O, the device implements redundant flight-control signal conditioning, mission-computer interface glue logic, and radar pre-processor interfaces. The -1 speed grade and X-suffix ruggedised variants support extended-temperature mission profiles. Bridge-supply channels through defence distributors sustain these programs. New defence designs should target the Microsemi RTG4 or Xilinx Defense-Grade Kintex UltraScale families, but the EP20K200RC240-1 continues to fill in legacy systems with established DO-254 certification artefacts.
Empfohlen
Networking Switch and Router Line Cards
The EP20K200RC240-1 fits networking switch and router line-card applications because its 200K gates and 174 I/O pins implement packet-classification lookup tables, queue managers, and switch-fabric interfaces in a single device. With 106,496 bits of embedded memory, the FPGA provides per-port statistics counters and CAM-like TCAM emulation via distributed RAM. The LVDS I/O of the 20KE subseries enables direct connection to high-speed SerDes and switch-fabric ASICs without external transceivers. Typical line-card power at 60% utilisation is around 1.8 W. Compared to network-processor-only designs, the EP20K200 offloads lookup-intensive tasks at deterministic latency, improving overall switch throughput by 15–30%.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP20K200RC240-1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP20K200RC240-1N | EP20K200RC240-1X | EP20K200BC356-3 | EP20K200CB356C7ES |
|---|---|---|---|---|---|
| Package | 240-BFQFP Exposed Pad (RQFP) | 240-BFQFP Exposed Pad | 240-BFQFP Exposed Pad | BGA-356 (different footprint) | BGA-356 (different footprint) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Total Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Embedded Memory (bits) | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| Speed Grade | -1 (fastest) | -1N | -1X | -3 (slower) | -7 (slowest) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.8 V (20KE subseries) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Same-package drop-in compatibility with N and X variants (vs. EP20K200RC240-1N)
- Highest speed grade in the APEX 20K 200K-gate family (vs. EP20K200CB356C7ES)
- LVDS-capable I/O via 20KE subseries (vs. EP20K200FC484-1 (APEX 20K, non-KE))
Designhinweise
The 240-BFQFP exposed-pad package requires the central thermal pad to be soldered to a continuous ground plane on the PCB top layer with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) connecting to inner ground layers. Per APEX 20K datasheet layout guidelines, missing this thermal connection can raise junction temperature by 20–30 °C under typical 1.5 W dissipation, compromising long-term reliability. Maintain 0.8 mm trace clearance between adjacent to the BFQFP pads to satisfy IPC-7351 nominal land pattern tolerances.
The EP20K200RC240-1 requires separate VCCINT (2.5 V core) and VCCIO (3.3 V or 2.5 V I/O) rails, each decoupled with 0.1 µF ceramic capacitors adjacent to every supply pin pair plus a bulk 47 µF tantalum capacitor per rail. Per the APEX 20K datasheet, VCCINT ramp time must be monotonic within 50 ms; an inrush-limiting soft-start circuit or LDO with controlled rise-time is required to prevent configuration SRAM corruption. Estimated power dissipation at 60% utilisation with 100 MHz toggle: ~1.5 W core + 0.3 W I/O = 1.8 W total.
Modern Quartus Prime versions (20.x and later) do NOT support the APEX 20K device family. According to Intel/Altera tool support matrices, you must retain Quartus II version 9.0 (final release with APEX 20K support) or MAX+PLUS II version 10.x for synthesis, place-and-route, and bitstream generation. Do not assume Quartus Prime Web Edition will load .qpf APEX 20K projects - the device library was removed after Intel's 2015 transition to Cyclone/Stratix naming.
When using the LVDS I/O capability of the APEX 20KE subseries, route LVDS pairs as length-matched 100 Ω differential traces with 0.2 mm spacing within the pair and 0.4 mm spacing to adjacent signals, per APEX 20K datasheet signal-integrity guidelines. The exposed ground pad provides the clean return path required for >500 Mbps LVDS signalling. Place 100 Ω termination resistors within 5 mm of the receiver pins; failing to terminate causes 200–400 mV common-mode oscillations that corrupt data.
Compliance-Informationen
The APEX 20K family was launched in the late 1990s before RoHS compliance was widely enforced. RoHS/REACH compliance status is not verified in the available web data; customers should request a compliance certificate from the distributor before placing RoHS-restricted orders. The -1X variant may carry MIL-STD-883 screening per Altera/Intel legacy military part numbers.
