EP2A70F1508C8N - APEX II FPGA, 3M Gates, 1508-FBGA | Altera
Teilenummer: EP2A70F1508C8N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2.450,00 |
| 50 | $215 | $10.750,00 |
| 100 | $195 | $19.500,00 |
| 500 | $175 | $87.500,00 |
EP2A70F1508C8N Übersicht
An FPGA (Field Programmable Gate Array) is a type of Programmable Logic Device (PLD) that combines the programmable interconnect fabric of a PLD with the register-rich architecture of a gate array. APEX II devices sit in the hierarchy of programmable logic as follows: PLD -> CPLD/FPGA -> SRAM-based FPGA -> APEX II series. They are used to implement arbitrary digital logic, on-chip memory, DSP blocks, and high-speed serial interfaces, and are generally preferred over ASICs when time-to-market, in-system reconfigurability, or low-to-medium production volume matters.
Key features of the EP2A70F1508C8N include 1,146,880 bits of embedded RAM distributed across multiple embedded array blocks (EABs), 1,060 user I/O pins supporting multiple I/O standards including LVDS, PCI, GTL+, SSTL-2/3, and HSTL, dedicated clock management circuitry with up to 8 phase-4 PLL blocks, and a 1.5V core supply. The 1508-ball FC-FBGA package uses a 1.00 mm ball pitch with a seated height of 3.5 mm, making it suitable for high-density PCB designs where signal integrity and controlled-impedance routing are critical.
The APEX II architecture combines a MultiCore architecture with embedded system blocks, allowing designers to allocate logic, memory, and DSP resources on demand. The high I/O count (1,060) and rich memory enable large system-on-chip integrations, while 1-Gbps LVDS capability positions the device for high-speed parallel and serial interconnects in networking, telecom, video processing, and high-performance computing.
Typical applications include high-speed serial interface bridging, telecom baseband processing, ASIC prototyping, DSP co-processing, and parallel multi-channel data acquisition. The combination of 281 MHz core frequency, 1-Gbps LVDS I/O, and 1,060 I/O lines makes this part particularly suited to designs that need both massive parallel I/O and tight clock-domain control.
When designing with this device, ensure the PCB has matched-impedance routing for LVDS pairs, sufficient decoupling (100 uF bulk plus 0.1 uF per power pin), and a robust thermal strategy; FC-FBGA packages require X-ray inspection and typically ENIG or OSP surface finishes on the PCB pads.
This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not consolidated in any single Altera datasheet or distributor listing, with cross-reference guidance across speed grades, temperature grades, and package variants in the EP2A family.
Drop-in-Alternativen für EP2A70F1508C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2A70F1508C8N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Speed Grade, Core Voltage, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2A70F1508C8
✅ Drop-In✓ Auf Lager
$1495 / Stück
Datenblatt ansehen →EP2A70F1508C7N
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP2A70F1508C7
✅ Drop-In✓ Auf Lager
$645 / Stück
Datenblatt ansehen →EP2A70F1508C7ES
✅ Drop-In✓ Auf Lager
$250 / Stück
Datenblatt ansehen →EP2A70F1508C8ES
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP2A70F1508C8N Grenzwerte & elektrische Eigenschaften
| Family | APEX II (EP2A70) |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 3,000,000 |
| Logic Elements / Cells | 67,200 |
| Embedded Memory (Bits) | 1,146,880 |
| Maximum User I/O | 1,060 |
| Core Voltage | 1.5 V |
| Process Technology | 0.15 micron, all-layer copper (up to 8 metal layers) |
| Maximum Internal Frequency | 281 MHz |
| Speed Grade | C8 |
| Temperature Grade | Commercial (N suffix) |
| Gehäuse | 1508-ball FC-FBGA (PBGA1508) |
| Ball Pitch | 1.00 mm |
| Seated Height (max) | 3.5 mm |
| High-Speed I/O Support | 1-Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| Montageart | Surface Mount (BGA) |
EP2A70F1508C8N 1508-ball fc-fbga (pbga1508) Pinbelegungsleitfaden
Pinbelegung für EP2A70F1508C8N (1508-ball fc-fbga (pbga1508)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2A70F1508C8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2A70F1508C8N ist geeignet für 6 Anwendungs: ASIC Prototyping and Emulation, Telecom Baseband Processing, High-Speed Data Acquisition, Video and Image Processing Pipeline, Industrial Parallel Bridge and Protocol Conversion, Legacy Sustaining and Long-Life Production Systems.
ASIC Prototyping and Emulation
The EP2A70F1508C8N is widely used as an ASIC prototyping vehicle, where the 3M system gates and 67,200 logic elements let design teams partition a multi-million-gate ASIC into a small FPGA array. The 1,060 user I/O and 1.5V core supply make the part flexible for mapping DDR-like interfaces and processor bus signals. Compared with smaller FPGAs, the EP2A70F1508C8N reduces the number of FPGAs needed to emulate a target ASIC, simplifying PCB routing and shortening bring-up cycles. Designers should expect Quartus II support for the APEX II family and verify JTAG chain integrity before each emulation run.
Empfohlen
Telecom Baseband Processing
In telecom baseband designs, the EP2A70F1508C8N delivers the parallel logic density needed for channel coding, scrambling, and interleaving across multiple carriers. The 1-Gbps True-LVDS capability allows direct connection to high-speed analog front ends without external serializers, and the 281 MHz internal frequency supports symbol-rate processing for common wireless standards. The 1,146,880 bits of embedded RAM are sufficient for sample buffering at baseband. Designers typically pair the FPGA with an external clock synthesizer and TI/Lattice PHY devices; expect careful attention to LVDS AC-coupling and board-stackup planning.
Empfohlen
High-Speed Data Acquisition
Multi-channel data acquisition cards use the EP2A70F1508C8N to aggregate parallel ADC inputs, perform real-time DSP pre-processing, and forward packets over high-speed LVDS links. The 1,060 I/O pins let designers connect directly to banks of 16-bit ADCs operating at 100+ MSPS without external bus multiplexers, while the embedded RAM is large enough to buffer full ADC frames. The 1508-ball FC-FBGA package is appropriate for PCI/PCI-X or custom backplane cards with controlled-impedance layers. For new designs, expect to validate signal-integrity on the LVDS pairs with an oscilloscope and TDR.
Empfohlen
Video and Image Processing Pipeline
The EP2A70F1508C8N supports real-time video processing pipelines such as scaling, de-interlacing, and color-space conversion at SD, HD, and partial 1080p60 resolutions. With 3M gates and ~1.14 Mbit of embedded memory, designers can implement multi-stage line buffers and pixel-rate DSP without external SRAM. The 281 MHz Fmax is sufficient for 148.5 MHz pixel clocks typical of HD-SDI interfaces, and the 1-Gbps LVDS option supports direct HD-SDI deserializer connection. For color-accurate pipelines, prefer the C7 speed grade if inventory permits; C8 remains acceptable with timing closure discipline.
Empfohlen
Industrial Parallel Bridge and Protocol Conversion
Industrial systems use the EP2A70F1508C8N to bridge legacy parallel buses (e.g., VME, custom 32-bit/64-bit parallel) to modern LVDS or serializer links. The combination of 1,060 I/O, embedded RAM, and 281 MHz logic is well suited to protocol conversion logic with deep state machines and small FIFOs. The commercial 0-85 C grade (N suffix) is appropriate for factory-floor enclosures with controlled airflow. For harsh industrial environments, designers should derate switching activity to manage junction temperature inside the FC-FBGA; consider lower-density Cyclone alternatives only when cost dominates over logic capacity.
Empfohlen
Legacy Sustaining and Long-Life Production Systems
Defense, aerospace, medical, and industrial OEMs with field-deployed APEX II designs use the EP2A70F1508C8N as a sustaining part over multi-decade production lifecycles. Rochester Electronics holds long-term APEX II inventory specifically for this scenario, and the EP2A70F1508C8N's pinout-stable package allows the same PCB to accept C8, C7, or ES variants without layout changes. Engineers should plan for obsolescence management, including annual inventory audits and second-source qualification of like-for-like drop-in parts. This is the most common modern use case for the part, given that Intel PSG no longer manufactures APEX II silicon.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2A70F1508C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2A70F1508C8 | EP2A70F1508C7N | EP2A70F1508C7 | EP2A70F1508C7ES | EP2A70F1508C8ES |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Speed Grade | C8 | C8 - same | C7 (faster) | C7 (faster) | C7 ES | C8 ES - same |
| Temperature Grade | Commercial (N suffix) | Commercial | Commercial (N suffix) | Commercial | Commercial (ES) | Commercial (ES) |
| Logic Elements / Cells | 67,200 | 67,200 - same | 67,200 - same | 67,200 - same | 67,200 - same | 67,200 - same |
| System Gates | 3,000,000 | 3,000,000 - same | 3,000,000 - same | 3,000,000 - same | 3,000,000 - same | 3,000,000 - same |
| Maximum User I/O | 1,060 | 1,060 - same | 1,060 - same | 1,060 - same | 1,060 - same | 1,060 - same |
| Embedded Memory (bits) | 1,146,880 | 1,146,880 - same | 1,146,880 - same | 1,146,880 - same | 1,146,880 - same | 1,146,880 - same |
| Core Voltage | 1.5 V | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Pin-for-pin identical silicon with the C8 trailing-N suffix (vs. EP2A70F1508C8)
- Faster Fmax in the same package as a drop-in upgrade (vs. EP2A70F1508C7N)
- Largest package variant in the EP2A70 family maximizes I/O (vs. EP2A70F1020C9)
Designhinweise
Estimated: at 281 MHz operation with 80% I/O toggle and 1.5V core draw, the EP2A70F1508C8N may dissipate on the order of 4-7 W depending on switching activity. The 1508-ball FC-FBGA package has a theta_JA in the 8-12 C/W range with 4-layer PCB design and minimal thermal vias. In an enclosed chassis with low airflow, attach a small heatsink or use a copper spreader to keep junction below 100 C. Derate I/O activity or reduce the Fmax if the device runs hot; the C7 speed grade does not change thermal behavior.
Use a high-layer-count PCB (>= 8 layers recommended) with dedicated power and ground planes for the EP2A70F1508C8N. The 1.00 mm ball pitch requires either laser-drilled microvias or 0.4 mm via-in-pad with ENIG or OSP surface finish; avoid HASL. Match LVDS pairs to 100 ohm differential impedance with length-matching within 150 ps. Place a 100 uF bulk + 10 uF + 0.1 uF decoupling network per VCC pin and adopt a star-ground topology under the device. Inspect solder joints with X-ray after assembly because BGA voids cannot be seen visually.
Three pitfalls recur in EP2A70F1508C8N designs: (1) confusing speed grades - C8 is the slowest commercial grade; do not substitute a C8 for a C7 if the design depends on tight Fmax; (2) misreading the 'N' suffix as industrial temperature - 'N' is the commercial grade (0 to 85 C), and the industrial 'I' grade is a separate variant; (3) ignoring configuration memory sizing - the bitstream for 3M gates requires an EPC16-class flash, and using an undersized EPC2 will fail at boot. Always check the Quartus II pin-out file before PCB layout.
The 1-Gbps True-LVDS performance requires strict board-level signal integrity. Use series AC-coupling capacitors at the LVDS link boundary only if the receiver side has internal DC bias, otherwise omit them. Keep the LVDS pair skew below 1 ps per mm of mismatch, and route them on a single signal layer with continuous reference plane. The 281 MHz Fmax applies to internal logic - actual IO performance depends on output slew rate and load capacitance, so validate with an eye-diagram test on first prototypes.
Compliance-Informationen
RoHS, REACH, lead-free, and halogen-free status are not explicitly stated in the verified web data for the EP2A70F1508C8N; marked as 'unknown'. Because the APEX II family predates many modern compliance directives, designers for new products should treat compliance as 'not confirmed' and verify with the supplier.
