EP2A70F1508C8N - APEX II FPGA, 3M Gates, 1508-FBGA | Altera
부품 번호: EP2A70F1508C8N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $215 | $10,750.00 |
| 100 | $195 | $19,500.00 |
| 500 | $175 | $87,500.00 |
EP2A70F1508C8N 개요
An FPGA (Field Programmable Gate Array) is a type of Programmable Logic Device (PLD) that combines the programmable interconnect fabric of a PLD with the register-rich architecture of a gate array. APEX II devices sit in the hierarchy of programmable logic as follows: PLD -> CPLD/FPGA -> SRAM-based FPGA -> APEX II series. They are used to implement arbitrary digital logic, on-chip memory, DSP blocks, and high-speed serial interfaces, and are generally preferred over ASICs when time-to-market, in-system reconfigurability, or low-to-medium production volume matters.
Key features of the EP2A70F1508C8N include 1,146,880 bits of embedded RAM distributed across multiple embedded array blocks (EABs), 1,060 user I/O pins supporting multiple I/O standards including LVDS, PCI, GTL+, SSTL-2/3, and HSTL, dedicated clock management circuitry with up to 8 phase-4 PLL blocks, and a 1.5V core supply. The 1508-ball FC-FBGA package uses a 1.00 mm ball pitch with a seated height of 3.5 mm, making it suitable for high-density PCB designs where signal integrity and controlled-impedance routing are critical.
The APEX II architecture combines a MultiCore architecture with embedded system blocks, allowing designers to allocate logic, memory, and DSP resources on demand. The high I/O count (1,060) and rich memory enable large system-on-chip integrations, while 1-Gbps LVDS capability positions the device for high-speed parallel and serial interconnects in networking, telecom, video processing, and high-performance computing.
Typical applications include high-speed serial interface bridging, telecom baseband processing, ASIC prototyping, DSP co-processing, and parallel multi-channel data acquisition. The combination of 281 MHz core frequency, 1-Gbps LVDS I/O, and 1,060 I/O lines makes this part particularly suited to designs that need both massive parallel I/O and tight clock-domain control.
When designing with this device, ensure the PCB has matched-impedance routing for LVDS pairs, sufficient decoupling (100 uF bulk plus 0.1 uF per power pin), and a robust thermal strategy; FC-FBGA packages require X-ray inspection and typically ENIG or OSP surface finishes on the PCB pads.
This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not consolidated in any single Altera datasheet or distributor listing, with cross-reference guidance across speed grades, temperature grades, and package variants in the EP2A family.
드롭인 대체품: EP2A70F1508C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A70F1508C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Core Voltage, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A70F1508C8
✅ 드롭인✓ 재고 있음
$1495 / 개
데이터시트 보기 →EP2A70F1508C7N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2A70F1508C7
✅ 드롭인✓ 재고 있음
$645 / 개
데이터시트 보기 →EP2A70F1508C7ES
✅ 드롭인✓ 재고 있음
$250 / 개
데이터시트 보기 →EP2A70F1508C8ES
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2A70F1508C8N 최대 정격 & 전기적 특성
| Family | APEX II (EP2A70) |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 3,000,000 |
| Logic Elements / Cells | 67,200 |
| Embedded Memory (Bits) | 1,146,880 |
| Maximum User I/O | 1,060 |
| Core Voltage | 1.5 V |
| Process Technology | 0.15 micron, all-layer copper (up to 8 metal layers) |
| Maximum Internal Frequency | 281 MHz |
| Speed Grade | C8 |
| Temperature Grade | Commercial (N suffix) |
| 패키지 | 1508-ball FC-FBGA (PBGA1508) |
| Ball Pitch | 1.00 mm |
| Seated Height (max) | 3.5 mm |
| High-Speed I/O Support | 1-Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| 실장 유형 | Surface Mount (BGA) |
EP2A70F1508C8N 1508-ball fc-fbga (pbga1508) 핀 구성 가이드
EP2A70F1508C8N(1508-ball fc-fbga (pbga1508) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A70F1508C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A70F1508C8N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Telecom Baseband Processing, High-Speed Data Acquisition, Video and Image Processing Pipeline, Industrial Parallel Bridge and Protocol Conversion, Legacy Sustaining and Long-Life Production Systems.
ASIC Prototyping and Emulation
The EP2A70F1508C8N is widely used as an ASIC prototyping vehicle, where the 3M system gates and 67,200 logic elements let design teams partition a multi-million-gate ASIC into a small FPGA array. The 1,060 user I/O and 1.5V core supply make the part flexible for mapping DDR-like interfaces and processor bus signals. Compared with smaller FPGAs, the EP2A70F1508C8N reduces the number of FPGAs needed to emulate a target ASIC, simplifying PCB routing and shortening bring-up cycles. Designers should expect Quartus II support for the APEX II family and verify JTAG chain integrity before each emulation run.
추천
Telecom Baseband Processing
In telecom baseband designs, the EP2A70F1508C8N delivers the parallel logic density needed for channel coding, scrambling, and interleaving across multiple carriers. The 1-Gbps True-LVDS capability allows direct connection to high-speed analog front ends without external serializers, and the 281 MHz internal frequency supports symbol-rate processing for common wireless standards. The 1,146,880 bits of embedded RAM are sufficient for sample buffering at baseband. Designers typically pair the FPGA with an external clock synthesizer and TI/Lattice PHY devices; expect careful attention to LVDS AC-coupling and board-stackup planning.
추천
High-Speed Data Acquisition
Multi-channel data acquisition cards use the EP2A70F1508C8N to aggregate parallel ADC inputs, perform real-time DSP pre-processing, and forward packets over high-speed LVDS links. The 1,060 I/O pins let designers connect directly to banks of 16-bit ADCs operating at 100+ MSPS without external bus multiplexers, while the embedded RAM is large enough to buffer full ADC frames. The 1508-ball FC-FBGA package is appropriate for PCI/PCI-X or custom backplane cards with controlled-impedance layers. For new designs, expect to validate signal-integrity on the LVDS pairs with an oscilloscope and TDR.
추천
Video and Image Processing Pipeline
The EP2A70F1508C8N supports real-time video processing pipelines such as scaling, de-interlacing, and color-space conversion at SD, HD, and partial 1080p60 resolutions. With 3M gates and ~1.14 Mbit of embedded memory, designers can implement multi-stage line buffers and pixel-rate DSP without external SRAM. The 281 MHz Fmax is sufficient for 148.5 MHz pixel clocks typical of HD-SDI interfaces, and the 1-Gbps LVDS option supports direct HD-SDI deserializer connection. For color-accurate pipelines, prefer the C7 speed grade if inventory permits; C8 remains acceptable with timing closure discipline.
추천
Industrial Parallel Bridge and Protocol Conversion
Industrial systems use the EP2A70F1508C8N to bridge legacy parallel buses (e.g., VME, custom 32-bit/64-bit parallel) to modern LVDS or serializer links. The combination of 1,060 I/O, embedded RAM, and 281 MHz logic is well suited to protocol conversion logic with deep state machines and small FIFOs. The commercial 0-85 C grade (N suffix) is appropriate for factory-floor enclosures with controlled airflow. For harsh industrial environments, designers should derate switching activity to manage junction temperature inside the FC-FBGA; consider lower-density Cyclone alternatives only when cost dominates over logic capacity.
추천
Legacy Sustaining and Long-Life Production Systems
Defense, aerospace, medical, and industrial OEMs with field-deployed APEX II designs use the EP2A70F1508C8N as a sustaining part over multi-decade production lifecycles. Rochester Electronics holds long-term APEX II inventory specifically for this scenario, and the EP2A70F1508C8N's pinout-stable package allows the same PCB to accept C8, C7, or ES variants without layout changes. Engineers should plan for obsolescence management, including annual inventory audits and second-source qualification of like-for-like drop-in parts. This is the most common modern use case for the part, given that Intel PSG no longer manufactures APEX II silicon.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A70F1508C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A70F1508C8 | EP2A70F1508C7N | EP2A70F1508C7 | EP2A70F1508C7ES | EP2A70F1508C8ES |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Speed Grade | C8 | C8 - same | C7 (faster) | C7 (faster) | C7 ES | C8 ES - same |
| Temperature Grade | Commercial (N suffix) | Commercial | Commercial (N suffix) | Commercial | Commercial (ES) | Commercial (ES) |
| Logic Elements / Cells | 67,200 | 67,200 - same | 67,200 - same | 67,200 - same | 67,200 - same | 67,200 - same |
| System Gates | 3,000,000 | 3,000,000 - same | 3,000,000 - same | 3,000,000 - same | 3,000,000 - same | 3,000,000 - same |
| Maximum User I/O | 1,060 | 1,060 - same | 1,060 - same | 1,060 - same | 1,060 - same | 1,060 - same |
| Embedded Memory (bits) | 1,146,880 | 1,146,880 - same | 1,146,880 - same | 1,146,880 - same | 1,146,880 - same | 1,146,880 - same |
| Core Voltage | 1.5 V | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Pin-for-pin identical silicon with the C8 trailing-N suffix (vs EP2A70F1508C8)
- Faster Fmax in the same package as a drop-in upgrade (vs EP2A70F1508C7N)
- Largest package variant in the EP2A70 family maximizes I/O (vs EP2A70F1020C9)
설계 노트
Estimated: at 281 MHz operation with 80% I/O toggle and 1.5V core draw, the EP2A70F1508C8N may dissipate on the order of 4-7 W depending on switching activity. The 1508-ball FC-FBGA package has a theta_JA in the 8-12 C/W range with 4-layer PCB design and minimal thermal vias. In an enclosed chassis with low airflow, attach a small heatsink or use a copper spreader to keep junction below 100 C. Derate I/O activity or reduce the Fmax if the device runs hot; the C7 speed grade does not change thermal behavior.
Use a high-layer-count PCB (>= 8 layers recommended) with dedicated power and ground planes for the EP2A70F1508C8N. The 1.00 mm ball pitch requires either laser-drilled microvias or 0.4 mm via-in-pad with ENIG or OSP surface finish; avoid HASL. Match LVDS pairs to 100 ohm differential impedance with length-matching within 150 ps. Place a 100 uF bulk + 10 uF + 0.1 uF decoupling network per VCC pin and adopt a star-ground topology under the device. Inspect solder joints with X-ray after assembly because BGA voids cannot be seen visually.
Three pitfalls recur in EP2A70F1508C8N designs: (1) confusing speed grades - C8 is the slowest commercial grade; do not substitute a C8 for a C7 if the design depends on tight Fmax; (2) misreading the 'N' suffix as industrial temperature - 'N' is the commercial grade (0 to 85 C), and the industrial 'I' grade is a separate variant; (3) ignoring configuration memory sizing - the bitstream for 3M gates requires an EPC16-class flash, and using an undersized EPC2 will fail at boot. Always check the Quartus II pin-out file before PCB layout.
The 1-Gbps True-LVDS performance requires strict board-level signal integrity. Use series AC-coupling capacitors at the LVDS link boundary only if the receiver side has internal DC bias, otherwise omit them. Keep the LVDS pair skew below 1 ps per mm of mismatch, and route them on a single signal layer with continuous reference plane. The 281 MHz Fmax applies to internal logic - actual IO performance depends on output slew rate and load capacitance, so validate with an eye-diagram test on first prototypes.
규정 준수 정보
RoHS, REACH, lead-free, and halogen-free status are not explicitly stated in the verified web data for the EP2A70F1508C8N; marked as 'unknown'. Because the APEX II family predates many modern compliance directives, designers for new products should treat compliance as 'not confirmed' and verify with the supplier.
