EP2AGZ300FH29C3G vs EP2AGZ300FH29I4G Vergleich
Detaillierter Direktvergleich von EP2AGZ300FH29C3G von Intel und EP2AGZ300FH29I4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FH29C3G | EP2AGZ300FH29I4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.545,00 | $1.350,00 |
| Series | Arria II GZ | — |
| Manufacturer | Intel (Altera) | — |
| Logic Elements | 300,000 | — |
| Number of I/O | 281 | 281 |
| Gehäuse | 780-BGA (HBGA, 29 mm) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +85C (commercial, speed grade 3) | — |
| Speed Grade | 3 | I4 |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | 0.9 V (typical) |
| Process Node | 40 nm | 40 nm TSMC |
| Embedded Memory | M9K / M144K block RAM | — |
| DSP Blocks | Yes (variable-precision DSP) | Yes (variable-precision, per family) |
| Transceivers | Yes (multi-gigabit) | Embedded multi-gigabit transceivers (per family) |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020, where stated) | [DATA_NEEDED: MSL rating] |
| Family | — | Arria II GZ (AGZ) |
| Logic Elements (LE) | — | 300,000 (approx., per family member) |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| Betriebstemperaturbereich | — | -40C to +100C (industrial, I-grade) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| Block RAM | — | Embedded M9K / M144K blocks |
| Lead-Free | — | Yes (per RoHS) |