EP2C35F672C8N - Cyclone II FPGA, 33K LEs, 672-BGA | Altera
Teilenummer: EP2C35F672C8N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $128.57 | $128,57 |
| 10 | $115.71 | $1.157,10 |
| 100 | $102.86 | $10.286,00 |
| 500 | $90 | $45.000,00 |
| 1.000 | $77.14 | $77.140,00 |
EP2C35F672C8N Übersicht
A Field Programmable Gate Array (FPGA) is a programmable logic device built from an array of configurable logic blocks (LUTs), programmable routing, and dedicated hard-IP blocks such as block RAM, multipliers, and I/O serializers. FPGAs sit in the broader hierarchy of programmable logic -> programmable logic devices -> digital semiconductor ICs, and are typically used when design flexibility, parallelism, and time-to-market outweigh the unit cost of an ASIC. The Cyclone II family specifically targets the low-cost FPGA segment and is the successor to the original Cyclone series, extending density up to 68,416 LEs and offering up to 1.1 Mbits of embedded memory across the family.
The EP2C35F672C8N features 35 embedded 18x18 multipliers for DSP-style operations, four phase-locked loops (PLLs) for clock generation and conditioning, and 33216 logic elements backed by approximately 0.5 Mbit of on-chip RAM. It supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS, making it broadly compatible with both legacy parallel buses and high-speed differential interfaces common in industrial and consumer designs. The device operates at a core voltage of 1.2 V with I/O supply rails configurable from 1.5 V to 3.3 V depending on the standard.
Architecturally, the EP2C35F672C8N combines a four-input look-up table (LUT) logic fabric with dedicated M4K memory blocks, multiplier blocks, and a row/column interconnect optimized for the 90 nm node. The 672-ball FineLine BGA package exposes 475 usable I/O pins while leaving the remaining balls for power, ground, and configuration. The die is the same silicon used across speed grades, with the speed/grade suffix (C8N) defining timing closure limits rather than functional capability. This means the C7, C8, and C6 variants are typically drop-in alternatives differing only in maximum operating frequency.
Typical applications include industrial motor and motion control, video processing pipelines, software-defined radio (SDR) baseband, low-cost ASIC prototyping, and embedded vision front-ends. The large user-I/O count (475) and generous memory bandwidth make it a popular choice for bridging parallel image sensors to processors, glue logic replacement, and education platforms that need to expose many pins for student projects. The wide distribution of the device across octopart-listed suppliers also makes it a familiar reference design for FPGA training boards.
When designing with this device, observe the I/O bank grouping rules - each bank shares VCCIO and reference voltage constraints, so split-bus interfaces (e.g., 3.3 V and 1.8 V on the same bus) require careful bank planning. For high-toggle-rate outputs, derate the simultaneous-switching output (SSO) budget per the datasheet I/O chapter to keep ground bounce within spec, and use the Quartus II PowerPlay analyzer to estimate dynamic current before committing to a particular decoupling network.
This page synthesizes distributor pricing (as of 2026-09-08), pin-compatible Cyclone II speed-grade and package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für EP2C35F672C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2C35F672C8N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2C35F672C8
✅ Drop-In✓ Auf Lager
$71.85 / Stück
Datenblatt ansehen →EP2C35F672C7N
✅ Drop-In✓ Auf Lager
$98 / Stück
Datenblatt ansehen →EP2C35F672C6N
✅ Drop-In✓ Auf Lager
$122.5 / Stück
Datenblatt ansehen →EP2C35F672C8ES
✅ Drop-In✓ Auf Lager
$118 / Stück
Datenblatt ansehen →EP2C35F672I8N
✅ Drop-In✓ Auf Lager
$98.5 / Stück
Datenblatt ansehen →EP2C20F672C8N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP2C35F672C8N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone II |
| Logic Elements (LEs) | 33216 |
| Total RAM Bits | 483840 |
| User I/O Count | 475 |
| Embedded Multipliers (18x18) | 35 |
| PLLs | 4 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Betriebstemperatur | 0C to +85C (commercial) |
| Gehäuse | 672-BGA (FineLine BGA) |
| Speed Grade | C8 |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
EP2C35F672C8N 672-bga (fineline bga) Pinbelegungsleitfaden
Pinbelegung für EP2C35F672C8N (672-bga (fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2C35F672C8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2C35F672C8N ist geeignet für 6 Anwendungs: Industrial Motor and Motion Control, Video Processing and Image Pipeline, ASIC Prototyping and Design Verification, Software-Defined Radio (SDR) Baseband, Education and FPGA Training Platforms, Embedded Vision and Machine Vision Front-Ends.
Industrial Motor and Motion Control
The EP2C35F672C8N fits industrial motor and motion control designs because of its 33216 logic elements, 35 dedicated 18x18 hardware multipliers, and 475 user I/O pins - more than enough for multi-axis servo loops, encoder interfaces, and PWM generation channels. The 90 nm Cyclone II fabric at a 1.2 V core typically delivers deterministic timing closure for closed-loop control periods in the 10-50 kHz range, and the 4 on-chip PLLs allow precise quadrature-clock generation from a single reference oscillator. Place the FPGA between the host MCU/CPU and the three-phase inverter bridge with sufficient VCCIO bank separation for 3.3 V logic-side and 5 V gate-driver-side signalling.
Empfohlen
Video Processing and Image Pipeline
With 475 user I/O pins and 483840 bits of embedded M4K RAM, the EP2C35F672C8N is well suited to real-time video pipelines - for example, capturing a parallel 24-bit RGB stream from a CMOS sensor at 60 MHz, performing colour-space conversion and edge detection in fabric, and outputting via a separate bank to an LCD controller or DDR memory buffer. The 35 multipliers handle 8x8 block-matching or Sobel convolution kernels in real time, while per-bank VCCIO flexibility lets the FPGA talk to 1.8 V sensors and 3.3 V display drivers on the same die. Reserve at least 4 I/O banks for video data and add a 2.5 V PLL analog rail for jitter-clean capture clocks.
Empfohlen
ASIC Prototyping and Design Verification
ASIC prototyping and design verification are classic FPGA use cases that the EP2C35F672C8N addresses with its 33216 LEs of LUT-based fabric, which can map roughly 5-10 million gates of equivalent ASIC logic depending on the design mix. The 672-ball FineLine BGA exposes enough user I/O to break out typical ASIC pad-ring signals (often 200-400 pins) plus JTAG and configuration, and the 4 PLLs handle multiple ASIC clock domains. The Quartus II design flow supports incremental compile, which is critical for ASIC prototype bring-up, and the Cyclone II mature timing model makes correlation between FPGA prototype and ASIC back-end easier.
Empfohlen
Software-Defined Radio (SDR) Baseband
Software-defined radio baseband processing benefits from the EP2C35F672C8N's high user-I/O count (475 pins) for ADC/DAC interface, 35 dedicated 18x18 multipliers for digital down-conversion and filtering, and 4 PLLs for generating sample clocks at multiple rates from a single reference. The 90 nm Cyclone II fabric can comfortably implement digital down-converters, channelizers, and modest OFDM modulators for narrowband or experimental SDR platforms. Connect the FPGA between the RF front-end ADC/DAC and a host processor over parallel or LVDS links, using separate I/O banks for clean isolation between digital baseband and analog RF stages.
Empfohlen
Education and FPGA Training Platforms
The EP2C35F672C8N's mature 90 nm Cyclone II architecture, generous 475 user I/O count, and broad availability across 8+ distributors make it an established choice for university FPGA training boards and self-study development kits. Quartus II Web Edition (free for Cyclone II) supports the device fully, with extensive student-facing IP libraries and reference designs available. The 33K-LE fabric comfortably hosts student projects from basic state machines through RISC-V soft cores like the Taiga RISC-V RV32I implementation. Add 5 V tolerant I/O bank protection for lab-bench prototyping safety.
Empfohlen
Embedded Vision and Machine Vision Front-Ends
The EP2C35F672C8N serves well as the front-end processor in embedded vision systems, where it captures image data from parallel camera interfaces, performs on-FPGA pre-processing (debayering, histogram equalization, simple object detection), and forwards compressed or region-of-interest data to a host CPU. The 35 hardware multipliers accelerate kernel-based filters, the 483 Kbit embedded RAM buffers line-scan data without external memory in many cases, and the 475 I/O pins support multi-camera or HDR sensor topologies. Use a separate I/O bank for the camera-link LVDS pairs to control common-mode noise.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2C35F672C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2C35F672C8 | EP2C35F672C7N | EP2C35F672C6N | EP2C35F672C8ES | EP2C35F672I8N | EP2C20F672C8N |
|---|---|---|---|---|---|---|---|
| Package | 672-BGA (FineLine BGA) | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Brand | Altera (now Intel) | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements (LEs) | 33216 | 33216 | 33216 | 33216 | 33216 | 33216 | 18752 |
| Total RAM Bits | 483840 | 483840 | 483840 | 483840 | 483840 | 483840 | 239616 |
| User I/O Count | 475 | 475 | 475 | 475 | 475 | 475 | 315 |
| Speed Grade | C8 | C8 | C7 | C6 | C8 (ES) | I8 | C8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial (ES) | Industrial (-40C to +100C) | Commercial |
| Lead-Free / RoHS | Yes (N suffix) | No (leaded finish) | Yes | Yes | Yes (ES) | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Highest density Cyclone II member still in active distribution at 672-BGA (vs. EP2C20F672C8N)
- Faster timing closure options within the same footprint (vs. EP2C35F672C8N (C8))
- Industrial-temperature variant on identical silicon (vs. EP2C35F672C8N (commercial))
Designhinweise
The 672-ball FineLine BGA package requires a 1.0 mm ball pitch PCB land pattern with non-solder-mask-defined (NSMD) pads for reliable BGA assembly. Plan at least 6 PCB layers with dedicated ground and power planes directly under the BGA to control simultaneous-switching noise (SSN) and to provide a low-impedance return path for high-speed I/O. Use 0.2 mm via-in-pad with filled-and-capped plating if your CM house supports it, otherwise use 0.3 mm dog-bone fan-outs to inner layers. Verify the BGA escape pattern against the Cyclone II Handbook pin-out appendix before committing to stack-up.
Estimated: based on a typical Cyclone II design at 50% toggle rate and 25% utilization, the EP2C35F672C8N core (VCCINT 1.2 V) draws 0.6-1.2 A dynamic + static, while each VCCIO bank (1.5-3.3 V) can draw 0.05-0.3 A depending on I/O count and toggle rate. Use a switching regulator with at least 80% efficiency for VCCINT, plus a low-noise LDO for the PLL analog VCCA rail, and follow the Handbook decoupling guidance of 0.1 uF + 10 uF per bank. Run Quartus II PowerPlay early in the design cycle to refine the budget before PCB layout is finalized.
Three common pitfalls with the EP2C35F672C8N: (1) using the wrong MSEL[3..0] settings for the chosen configuration mode (AS, AP, PS, JTAG) - the device will fail to configure if these are wrong; (2) leaving unused I/O pins floating instead of setting them to 'input tri-stated with weak pull-up' in the Quartus device options, which can cause SSN and unnecessary power; (3) ignoring per-bank VCCIO grouping, which can cause bus contention if signals of different voltage standards share a bank.
Estimated: at full 33K-LE utilization with 50% toggle rate, the EP2C35F672C8N dissipates approximately 2-4 W depending on clock frequency and I/O activity. The 672-BGA package theta_JA is typically 18-22 C/W with a standard 4-layer JEDEC test board, so worst-case junction temperature rise above ambient is 36-88 C - acceptable in commercial (0-85C) and even most industrial environments. For high-temp or sealed enclosures, attach a small copper heatsink or thermal pad directly to the package top surface.
Compliance-Informationen
RoHS compliant per Altera product page (the 'N' suffix denotes lead-free finish). AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part. For automotive applications, consider Cyclone IV E or Cyclone V devices with AEC-Q100 qualification.
