Altera

EP2C35F672C8N - Cyclone II FPGA, 33K LEs, 672-BGA | Altera

料号: EP2C35F672C8N ✓ 量产中
有现货 1-3 个工作日内发货
1.2 V Vdss 672-BGA (FineLine BGA) Package C8 Speed
低至 $77.14 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-08
批量定价
数量 单价 小计
1 $128.57 $128.57
10 $115.71 $1,157.10
100 $102.86 $10,286.00
500 $90 $45,000.00
1,000 $77.14 $77,140.00
ℹ️ 所有价格均以 USD 计价

EP2C35F672C8N 概述

The Altera (now Intel) EP2C35F672C8N is a Cyclone II family Field Programmable Gate Array (FPGA) fabricated on a 90 nm low-k process, delivering 33,216 logic elements (LEs), 483,840 total RAM bits, and 475 user I/O pins in a 672-ball FineLine BGA package. It targets cost-sensitive high-volume designs that need substantially more logic capacity than what first-generation Cyclone devices offered, while keeping the silicon cost low through 90 nm process scaling and an optimized LUT-based architecture.

A Field Programmable Gate Array (FPGA) is a programmable logic device built from an array of configurable logic blocks (LUTs), programmable routing, and dedicated hard-IP blocks such as block RAM, multipliers, and I/O serializers. FPGAs sit in the broader hierarchy of programmable logic -> programmable logic devices -> digital semiconductor ICs, and are typically used when design flexibility, parallelism, and time-to-market outweigh the unit cost of an ASIC. The Cyclone II family specifically targets the low-cost FPGA segment and is the successor to the original Cyclone series, extending density up to 68,416 LEs and offering up to 1.1 Mbits of embedded memory across the family.

The EP2C35F672C8N features 35 embedded 18x18 multipliers for DSP-style operations, four phase-locked loops (PLLs) for clock generation and conditioning, and 33216 logic elements backed by approximately 0.5 Mbit of on-chip RAM. It supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS, making it broadly compatible with both legacy parallel buses and high-speed differential interfaces common in industrial and consumer designs. The device operates at a core voltage of 1.2 V with I/O supply rails configurable from 1.5 V to 3.3 V depending on the standard.

Architecturally, the EP2C35F672C8N combines a four-input look-up table (LUT) logic fabric with dedicated M4K memory blocks, multiplier blocks, and a row/column interconnect optimized for the 90 nm node. The 672-ball FineLine BGA package exposes 475 usable I/O pins while leaving the remaining balls for power, ground, and configuration. The die is the same silicon used across speed grades, with the speed/grade suffix (C8N) defining timing closure limits rather than functional capability. This means the C7, C8, and C6 variants are typically drop-in alternatives differing only in maximum operating frequency.

Typical applications include industrial motor and motion control, video processing pipelines, software-defined radio (SDR) baseband, low-cost ASIC prototyping, and embedded vision front-ends. The large user-I/O count (475) and generous memory bandwidth make it a popular choice for bridging parallel image sensors to processors, glue logic replacement, and education platforms that need to expose many pins for student projects. The wide distribution of the device across octopart-listed suppliers also makes it a familiar reference design for FPGA training boards.

When designing with this device, observe the I/O bank grouping rules - each bank shares VCCIO and reference voltage constraints, so split-bus interfaces (e.g., 3.3 V and 1.8 V on the same bus) require careful bank planning. For high-toggle-rate outputs, derate the simultaneous-switching output (SSO) budget per the datasheet I/O chapter to keep ground bounce within spec, and use the Quartus II PowerPlay analyzer to estimate dynamic current before committing to a particular decoupling network.

This page synthesizes distributor pricing (as of 2026-09-08), pin-compatible Cyclone II speed-grade and package alternatives, and practical design notes not found in the manufacturer datasheet alone.

直接替换替代料: EP2C35F672C8N ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: EP2C35F672C8N (相同外形与封装尺寸) ——差异在于 Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.

Intel
Operating Temperature: 0°C to 85°C (C6 speed grade, commercial)
Process Technology: 90 nm CMOS
RoHS Status: Lead-Free (per distributor listing)
对比 EP2C35F672C8N →
Intel
Speed Grade: 7 (commercial)
Process Technology: 90 nm low-k CMOS
对比 EP2C35F672C8N →
Altera
Package: 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch
Speed Grade: -7
Operating Temperature: 0 °C to +85 °C (commercial)
对比 EP2C35F672C8N →
Altera
Package: 672-BGA (FineLine BGA, 1.0 mm pitch)
Speed Grade: C8 (commercial, 8 ns pin-to-pin)
RoHS Status: Compliant (lead-free package)
对比 EP2C35F672C8N →
Altera
Package: 672-ball FBGA (FineLine BGA), 26x26 mm
Operating Temperature: 0°C to +85°C (commercial)
Process Technology: 90 nm CMOS
对比 EP2C35F672C8N →
Intel
Package: 672-ball FBGA (FineLine BGA), 27 mm
Speed Grade: 6
Operating Temperature: -40 C to +100 C (industrial, 'I' suffix)
对比 EP2C35F672C8N →
Intel
Package: 672-ball FineLine BGA (FBGA)
Speed Grade: 8 (C8 core)
Process Technology: 90 nm CMOS SRAM
对比 EP2C35F672C8N →
Intel
Package: 672-BGA (FineLine)
Speed Grade: 8
Operating Temperature: -40C to +100C (industrial)
对比 EP2C35F672C8N →
Intel
Package: 672-BGA (FBGA)
Speed Grade: 7
对比 EP2C35F672C8N →

快速对比工具——选择替代料号进行并排对比:

EP2C35F672C8

✅ 直接替换
Altera
📦 672-BGA
Cyclone II · 33,216 · 483,840 · 35 · 475 · 4 · 672-BGA (FineLine BGA, 1.0 mm pitch) · C8 (commercial, 8 ns pin-to-pin)

✓ 有现货

$71.85 / 个

查看数据手册 →

EP2C35F672C7N

✅ 直接替换
Altera
📦 672-BGA
Cyclone II · 33,216 · 2,100 · 483,840 bits · 35 · 4 · 475 · 8

✓ 有现货

$98 / 个

查看数据手册 →

EP2C35F672C6N

✅ 直接替换
Intel
📦 672-BGA
Cyclone II · 33,216 · 33,216 · 483,840 · 2076 · 33216 · 483840 bit · 475

✓ 有现货

$122.5 / 个

查看数据手册 →

EP2C35F672C8ES

✅ 直接替换
Altera
📦 672-BGA
Cyclone II · 90 nm CMOS · 33,216 · 483,840 bits · 35 · 475 · 4 · 672-ball FBGA (FineLine BGA), 26x26 mm

✓ 有现货

$118 / 个

查看数据手册 →

EP2C35F672I8N

✅ 直接替换
Intel
📦 672-BGA
Cyclone II · Cyclone II · 33,216 · 483,840 · 35 · 132 · 475 · 4

✓ 有现货

$98.5 / 个

查看数据手册 →

EP2C20F672C8N

✅ 直接替换 ⚠️ 规格未核验
📦 672-BGA
same 672-BGA footprint; logic capacity reduced from 33216 to 18752 LEs (-44%), fewer multipliers, same speed grade

📋 参考替代料(不在目录中)

EP2C35F672C8N 最大额定值与电气特性

Family Cyclone II
Logic Elements (LEs) 33216
Total RAM Bits 483840
User I/O Count 475
Embedded Multipliers (18x18) 35
PLLs 4
Process Technology 90 nm
Core Voltage 1.2 V
工作温度 0C to +85C (commercial)
封装 672-BGA (FineLine BGA)
Speed Grade C8
安装类型 Surface Mount
RoHS 状态 Compliant
Lead-Free Yes

EP2C35F672C8N 672-bga (fineline bga) 引脚配置指南

EP2C35F672C8N(672-bga (fineline bga) 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

EP2C35F672C8N 的 672-bga (fineline bga) 封装引脚图

暂无详细引脚数据: EP2C35F672C8N.

请参阅 数据手册 以查看完整引脚配置。

典型应用

EP2C35F672C8N 适用于 6 应用s: Industrial Motor and Motion Control, Video Processing and Image Pipeline, ASIC Prototyping and Design Verification, Software-Defined Radio (SDR) Baseband, Education and FPGA Training Platforms, Embedded Vision and Machine Vision Front-Ends.

🏭

Industrial Motor and Motion Control

The EP2C35F672C8N fits industrial motor and motion control designs because of its 33216 logic elements, 35 dedicated 18x18 hardware multipliers, and 475 user I/O pins - more than enough for multi-axis servo loops, encoder interfaces, and PWM generation channels. The 90 nm Cyclone II fabric at a 1.2 V core typically delivers deterministic timing closure for closed-loop control periods in the 10-50 kHz range, and the 4 on-chip PLLs allow precise quadrature-clock generation from a single reference oscillator. Place the FPGA between the host MCU/CPU and the three-phase inverter bridge with sufficient VCCIO bank separation for 3.3 V logic-side and 5 V gate-driver-side signalling.

📺

Video Processing and Image Pipeline

With 475 user I/O pins and 483840 bits of embedded M4K RAM, the EP2C35F672C8N is well suited to real-time video pipelines - for example, capturing a parallel 24-bit RGB stream from a CMOS sensor at 60 MHz, performing colour-space conversion and edge detection in fabric, and outputting via a separate bank to an LCD controller or DDR memory buffer. The 35 multipliers handle 8x8 block-matching or Sobel convolution kernels in real time, while per-bank VCCIO flexibility lets the FPGA talk to 1.8 V sensors and 3.3 V display drivers on the same die. Reserve at least 4 I/O banks for video data and add a 2.5 V PLL analog rail for jitter-clean capture clocks.

🖥️

ASIC Prototyping and Design Verification

ASIC prototyping and design verification are classic FPGA use cases that the EP2C35F672C8N addresses with its 33216 LEs of LUT-based fabric, which can map roughly 5-10 million gates of equivalent ASIC logic depending on the design mix. The 672-ball FineLine BGA exposes enough user I/O to break out typical ASIC pad-ring signals (often 200-400 pins) plus JTAG and configuration, and the 4 PLLs handle multiple ASIC clock domains. The Quartus II design flow supports incremental compile, which is critical for ASIC prototype bring-up, and the Cyclone II mature timing model makes correlation between FPGA prototype and ASIC back-end easier.

🌐

Software-Defined Radio (SDR) Baseband

Software-defined radio baseband processing benefits from the EP2C35F672C8N's high user-I/O count (475 pins) for ADC/DAC interface, 35 dedicated 18x18 multipliers for digital down-conversion and filtering, and 4 PLLs for generating sample clocks at multiple rates from a single reference. The 90 nm Cyclone II fabric can comfortably implement digital down-converters, channelizers, and modest OFDM modulators for narrowband or experimental SDR platforms. Connect the FPGA between the RF front-end ADC/DAC and a host processor over parallel or LVDS links, using separate I/O banks for clean isolation between digital baseband and analog RF stages.

🎓

Education and FPGA Training Platforms

The EP2C35F672C8N's mature 90 nm Cyclone II architecture, generous 475 user I/O count, and broad availability across 8+ distributors make it an established choice for university FPGA training boards and self-study development kits. Quartus II Web Edition (free for Cyclone II) supports the device fully, with extensive student-facing IP libraries and reference designs available. The 33K-LE fabric comfortably hosts student projects from basic state machines through RISC-V soft cores like the Taiga RISC-V RV32I implementation. Add 5 V tolerant I/O bank protection for lab-bench prototyping safety.

🎥

Embedded Vision and Machine Vision Front-Ends

The EP2C35F672C8N serves well as the front-end processor in embedded vision systems, where it captures image data from parallel camera interfaces, performs on-FPGA pre-processing (debayering, histogram equalization, simple object detection), and forwards compressed or region-of-interest data to a host CPU. The 35 hardware multipliers accelerate kernel-based filters, the 483 Kbit embedded RAM buffers line-scan data without external memory in many cases, and the 475 I/O pins support multi-camera or HDR sensor topologies. Use a separate I/O bank for the camera-link LVDS pairs to control common-mode noise.

What is the logic element count of EP2C35F672C8N?
The EP2C35F672C8N contains 33216 logic elements (LEs) in its Cyclone II FPGA fabric. According to the Altera Cyclone II Device Handbook, the LE is the basic logic unit built from a 4-input LUT, a programmable register, and a carry chain. The 33K LE count sits in the mid-density range of the Cyclone II family, which spans from 4,608 LEs in the smallest member up to 68,416 LEs in the largest.
How many user I/O pins does EP2C35F672C8N have?
The EP2C35F672C8N provides 475 usable user I/O pins out of a 672-ball FineLine BGA package. The remaining balls are allocated to power (VCCINT, VCCIO), ground, configuration (nCONFIG, nSTATUS, CONF_DONE, MSEL), and JTAG (TCK, TMS, TDI, TDO) signals. The high user-I/O count makes this device suitable for wide-parallel buses, video interfaces, and multi-channel data acquisition front-ends.
What is the operating voltage of EP2C35F672C8N?
The EP2C35F672C8N operates from a 1.2 V core supply (VCCINT) with configurable VCCIO rails per I/O bank supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V signalling depending on the I/O standard in use. The PLL analog supply (VCCA) typically requires a clean 2.5 V rail, and auxiliary JTAG/configuration pins use the same VCCIO bank as the associated I/O. Designers should follow the Cyclone II Handbook decoupling recommendations.
What is the difference between EP2C35F672C8N and EP2C35F672C8?
The EP2C35F672C8N and EP2C35F672C8 share the same silicon die, 672-BGA package, and 33216 logic elements; the trailing 'N' on the part number denotes the lead-free / RoHS-compliant terminal finish, while the bare EP2C35F672C8 uses a leaded finish. Both parts are drop-in compatible at the PCB footprint level, but for new designs the 'N' (lead-free) variant is preferred to meet RoHS requirements.
What is the difference between speed grades C6, C7, and C8 on Cyclone II?
The C6, C7, and C8 speed grades on Cyclone II devices reflect progressively slower timing closure: C6 is the fastest, C8 the slowest. According to Altera's speed-grade methodology, each step typically relaxes internal timing by roughly 10-15%, allowing the same design to run at lower core voltage or with worse PVT conditions. The silicon die, package, and pinout are identical, so C6/C7/C8 are drop-in alternatives when timing margin permits.
Where can I buy EP2C35F672C8N and what is the lead time?
The EP2C35F672C8N is in stock at major distributors including DigiKey, Mouser, and Heisener, with Heisener reporting in stock and same-day shipment as of 2026-09-08. Pricing starts at approximately $128.57 for 1 piece with volume discounts available down to roughly $77.14 at 1000-piece quantities. Lead time is typically 1-3 days for in-stock inventory.
What is the price of EP2C35F672C8N as of 2026?
As of 2026-09-08, the EP2C35F672C8N unit price is approximately $128.57 at qty 1, scaling down to ~$115.71 at qty 10, ~$102.86 at qty 100, ~$90.00 at qty 500, and ~$77.14 at qty 1000 per Heisener's listing. Pricing fluctuates based on distributor stock and lead time; check Octopart for a live comparison across 8 distributors. Volume pricing for OEM contracts is typically negotiated directly with the manufacturer.
Is EP2C35F672C8N in stock at major distributors?
Yes, the EP2C35F672C8N is widely available at major distributors as of 2026-09-08, with Heisener specifically reporting in stock. The part is also listed on Mouser, DigiKey (under the closely related EP2C35F672C8 listing), Octopart, and Xecor. The broad availability across 8+ distributors and large stock levels indicate an active supply chain, though Cyclone II is a mature 90 nm family and should be considered for long-term lifecycle planning.
EP2C35F672C8N vs EP2C35F484C8N - which is better for video processing?
The EP2C35F672C8N with 475 user I/O pins in a 672-BGA package is generally better for video processing applications that require wide parallel pixel buses (24-bit RGB, dual-camera MIPI-style interfaces, or memory-mapped parallel display outputs) - the extra I/O count directly supports higher bus widths. The EP2C35F484C8N uses a smaller 484-BGA package with fewer user I/Os but the same 33216 LE fabric, so if your video pipeline fits within its I/O budget, it can be a more cost-effective PCB-routing choice. Both share identical logic capacity.
What is the best drop-in replacement for EP2C35F672C8N?
The best drop-in replacements for EP2C35F672C8N are the other speed grades in the same 672-BGA package: EP2C35F672C7N (faster, C7 speed grade) and EP2C35F672C6N (fastest, C6 speed grade). All three use the same silicon die, the same 672-ball FineLine BGA pinout, and the same Quartus II design flow, so they are pin-compatible footprint replacements. For lower-cost applications, EP2C20F672C8N offers similar package and pinout with reduced logic capacity.
When should I choose EP2C35F672C8N over a Cyclone IV E device?
Choose the EP2C35F672C8N (Cyclone II) over a Cyclone IV E when you need a proven, mature FPGA with extensive existing IP libraries, wide distributor availability, and lower unit cost on 90 nm silicon. Choose Cyclone IV E (e.g., EP4CE30F672I7N) when you need better performance-per-watt, 60 nm process scaling, longer-term lifecycle commitment from Intel/Altera, and support for newer tool features. Cyclone II remains viable for cost-sensitive industrial and education designs through 2026.
Where to download EP2C35F672C8N datasheet PDF?
The EP2C35F672C8N datasheet PDF can be downloaded from Alldatasheet.com (the 470-page Cyclone II Device Handbook Volume 1 at alldatasheet.com/datasheet-pdf/pdf/527262/ALTERA/EP2C35F672C8N.html), from Datasheets.com, or from Intel's official FPGA documentation center after registering for a free account. The Cyclone II Device Handbook covers all family members including EP2C35; the device-specific pin-out file (672-BGA) is in the handbook's pin-out appendix and as a separate .csv download.
Where to find EP2C35F672C8N pinout for 672-BGA?
The EP2C35F672C8N pinout for the 672-ball FineLine BGA package is documented in the Cyclone II Device Handbook, Chapter 6 (Package Information) and in the pin-out appendix tables. Each ball is assigned a unique ball coordinate (e.g., AA1, AB2) along with the user I/O bank number, I/O standard compatibility, and function for dual-purpose pins (configuration vs user I/O). Quartus II also generates the pin-out automatically once the device and package are selected in the Pin Planner.
What are the key specifications of EP2C35F672C8N that engineers should know?
The EP2C35F672C8N combines 33216 logic elements (LEs), 483840 bits of embedded RAM (organized as M4K blocks), 35 hard 18x18 multipliers for DSP operations, 4 PLLs for clock management, and 475 usable user I/O pins in a 672-ball FineLine BGA package. Fabricated on a 90 nm process, it operates from a 1.2 V core supply with per-bank VCCIO supporting LVTTL, LVCMOS, PCI, SSTL, and LVDS standards. The Cyclone II family delivers cost-optimized mid-density FPGA fabric at roughly $77-$128 per unit in 2026.

工程参考数据: EP2C35F672C8N ——对比、设计指导和合规信息。

选型指南

Choose the EP2C35F672C8N when your design needs 33K LEs of Cyclone II fabric with 475 user I/Os and you are targeting cost-sensitive commercial-temperature applications on the C8 timing grade. Choose EP2C35F672C6N or EP2C35F672C7N if you need faster timing closure (C6/C7 are progressively faster speed grades on the same die and footprint). Choose EP2C35F672I8N if your product must operate in industrial temperature ranges -40C to +100C, accepting slightly slower timing (I8 vs C8). Choose EP2C35F672C8 (without 'N' suffix) only if you specifically need the leaded finish for legacy non-RoHS assemblies. Choose EP2C20F672C8N if your design fits within 18752 LEs and you want to reduce unit cost - it shares the 672-BGA footprint so PCB layout remains compatible. All six parts listed as alternatives use the same 672-ball FineLine BGA and same Quartus II design flow, making the family flexible for cost/performance/temperature trade-offs.

与替代料对比

参数 本产品 EP2C35F672C8 EP2C35F672C7N EP2C35F672C6N EP2C35F672C8ES EP2C35F672I8N EP2C20F672C8N
Package 672-BGA (FineLine BGA) 672-BGA - same 672-BGA - same 672-BGA - same 672-BGA - same 672-BGA - same 672-BGA - same
Brand Altera (now Intel) Altera Altera Altera Altera Altera Altera
Logic Elements (LEs) 33216 33216 33216 33216 33216 33216 18752
Total RAM Bits 483840 483840 483840 483840 483840 483840 239616
User I/O Count 475 475 475 475 475 475 315
Speed Grade C8 C8 C7 C6 C8 (ES) I8 C8
Temperature Grade Commercial (0C to +85C) Commercial Commercial Commercial Commercial (ES) Industrial (-40C to +100C) Commercial
Lead-Free / RoHS Yes (N suffix) No (leaded finish) Yes Yes Yes (ES) Yes Yes

关键差异点

  • Highest density Cyclone II member still in active distribution at 672-BGA (对比 EP2C20F672C8N)
  • Faster timing closure options within the same footprint (对比 EP2C35F672C8N (C8))
  • Industrial-temperature variant on identical silicon (对比 EP2C35F672C8N (commercial))

设计说明

The 672-ball FineLine BGA package requires a 1.0 mm ball pitch PCB land pattern with non-solder-mask-defined (NSMD) pads for reliable BGA assembly. Plan at least 6 PCB layers with dedicated ground and power planes directly under the BGA to control simultaneous-switching noise (SSN) and to provide a low-impedance return path for high-speed I/O. Use 0.2 mm via-in-pad with filled-and-capped plating if your CM house supports it, otherwise use 0.3 mm dog-bone fan-outs to inner layers. Verify the BGA escape pattern against the Cyclone II Handbook pin-out appendix before committing to stack-up.

Estimated: based on a typical Cyclone II design at 50% toggle rate and 25% utilization, the EP2C35F672C8N core (VCCINT 1.2 V) draws 0.6-1.2 A dynamic + static, while each VCCIO bank (1.5-3.3 V) can draw 0.05-0.3 A depending on I/O count and toggle rate. Use a switching regulator with at least 80% efficiency for VCCINT, plus a low-noise LDO for the PLL analog VCCA rail, and follow the Handbook decoupling guidance of 0.1 uF + 10 uF per bank. Run Quartus II PowerPlay early in the design cycle to refine the budget before PCB layout is finalized.

Three common pitfalls with the EP2C35F672C8N: (1) using the wrong MSEL[3..0] settings for the chosen configuration mode (AS, AP, PS, JTAG) - the device will fail to configure if these are wrong; (2) leaving unused I/O pins floating instead of setting them to 'input tri-stated with weak pull-up' in the Quartus device options, which can cause SSN and unnecessary power; (3) ignoring per-bank VCCIO grouping, which can cause bus contention if signals of different voltage standards share a bank.

Estimated: at full 33K-LE utilization with 50% toggle rate, the EP2C35F672C8N dissipates approximately 2-4 W depending on clock frequency and I/O activity. The 672-BGA package theta_JA is typically 18-22 C/W with a standard 4-layer JEDEC test board, so worst-case junction temperature rise above ambient is 36-88 C - acceptable in commercial (0-85C) and even most industrial environments. For high-temp or sealed enclosures, attach a small copper heatsink or thermal pad directly to the package top surface.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

RoHS compliant per Altera product page (the 'N' suffix denotes lead-free finish). AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part. For automotive applications, consider Cyclone IV E or Cyclone V devices with AEC-Q100 qualification.

数据核验日期: 2026-09-08 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

EP2C35F672C8N EP2C35F672C8N datasheet Altera Cyclone II EP2C35 Cyclone II 672-BGA FPGA EP2C35F672C8N 475 I/O EP2C35F672C8N FPGA price buy EP2C35F672C8N vs EP2C20F672C8N EP2C35F672C8N industrial temperature Cyclone II speed grade C8 C7 C6 EP2C35F672C8N FPGA video processing EP2C35F672C8N pinout 672 BGA what is Cyclone II FPGA

相关元器件 & 术语

Altera Intel EP2C35F672C8N Cyclone II Field Programmable Gate Array FPGA logic element 4-input LUT M4K memory block FineLine BGA 672-BGA 90 nm process embedded multiplier PLL LVDS SSTL PCI Quartus II ASIC prototyping RoHS AEC-Q100 I/O bank VCCINT VCCIO VCCA
快速报价
填写完整信息——我们的销售团队将在 24 小时内回复
料号 制造商 封装 QTY 目标价 小计
合计: $0.00 USD
✓
报价已提交!

我们将在 24 小时内回复您的邮件

1
询价已提交
2
已收到报价
3
已下单
4
支付
5
已发货
6
已送达
查看询价详情