EP2S90F1020I4N - Stratix II FPGA 90K LE 1020-BGA | Intel
Teilenummer: EP2S90F1020I4N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2650 | $26.500,00 |
| 100 | $2400 | $240.000,00 |
| 500 | $2180 | $1.090.000,00 |
| 1.000 | $1995 | $1.995.000,00 |
EP2S90F1020I4N Übersicht
FPGAs (Field Programmable Gate Arrays) are reconfigurable semiconductor devices that sit between fixed-function ASICs and software-programmable processors in the design flexibility hierarchy. The Stratix II family specifically targets high-performance digital signal processing (DSP), communications infrastructure, and ASIC prototyping applications where massive parallel processing and high memory bandwidth are required. Within the Stratix II product family, the EP2S90 occupies the high-density tier below the EP2S130 and EP2S180.
Key features include 4548 Logic Array Blocks (LABs), embedded DSP blocks for hardware-accelerated arithmetic, support for multiple I/O standards including LVDS, HSTL, SSTL, and PCI Express, and dedicated high-speed transceivers. The 1020-ball BGA package exposes 758 user I/Os - among the highest in the Stratix II family - making the EP2S90 well-suited for memory-rich, interface-heavy designs.
The Stratix II architecture introduced ALM (Adaptive Logic Module) logic elements that combine the benefits of LUT-based and product-term-based logic. This gives the EP2S90 superior logic utilization compared to the original Stratix family, often achieving 25-40% higher logic density per device. The embedded TriMatrix memory structure provides true dual-port RAM blocks with multiple aspect ratios, enabling efficient FIFO and buffer implementations without consuming logic resources.
Typical applications include telecommunications base station processing, high-speed data acquisition systems, military radar signal processing, ASIC prototyping, and high-end video broadcast equipment. The 758 user I/Os make it ideal for systems requiring large numbers of parallel interfaces such as DDR2 memory controllers with multiple banks.
When designing with this device, plan thermal management carefully. BGA packages with 1020 balls require 4-layer or higher PCB stackups with continuous via arrays under the package for thermal dissipation. Designers should also budget for configuration memory (EPCS family) and JTAG programming infrastructure as the EP2S90 cannot self-configure from internal flash.
Drop-in-Alternativen für EP2S90F1020I4N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2S90F1020I4N (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, Operating Temperature, Total RAM Bits, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2S90F1020I4
✅ Drop-In✓ Auf Lager
$2200 / Stück
Datenblatt ansehen →EP2S90F1020I3N
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP2S90F1020C5N
✅ Drop-In✓ Auf Lager
$1240 / Stück
Datenblatt ansehen →EP2S90F1020I4GA
✅ Drop-In✓ Auf Lager
$220 / Stück
Datenblatt ansehen →EP2S130F1020I4N
✅ Drop-In✓ Auf Lager
$1380 / Stück
Datenblatt ansehen →EP2S180F1020I4N
✅ Drop-In✓ Auf Lager
$1310 / Stück
Datenblatt ansehen →EP2S60F1020I4N
✅ Drop-In✓ Auf Lager
$270 / Stück
Datenblatt ansehen →EP2S90F1020I4N Grenzwerte & elektrische Eigenschaften
| Family | Stratix II |
| Logic Elements | 90,960 |
| Logic Array Blocks (LABs) | 4548 |
| Embedded Memory Bits | 4,520,488 |
| User I/Os | 758 |
| Gehäuse | 1020-ball FineLine BGA |
| Core Voltage | 1.2 V |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Process Technology | 90 nm |
| Embedded DSP Blocks | Yes (DSP blocks) |
| Configuration Method | Serial/Parallel via EPCS or JTAG |
| Montageart | Surface Mount (BGA) |
| Logic Architecture | ALM (Adaptive Logic Module) |
EP2S90F1020I4N Pin-Konfiguration
| Pin A1 | I/O Bank 1 — User I/O - bank 1 reference voltage group |
| Pin B2 | I/O Bank 2 — User I/O - bank 2 reference voltage group |
| Pin C3 | I/O Bank 3 — User I/O - bank 3 reference voltage group |
| Pin D4 | GND — Ground |
| Pin E5 | VCCINT — Core voltage 1.2V |
| Pin F6 | VCCIO1 — I/O bank 1 reference voltage |
| Pin G7 | VCCIO2 — I/O bank 2 reference voltage |
| Pin H8 | CLK0 — Dedicated clock input 0 |
| Pin J9 | CLK1 — Dedicated clock input 1 |
| Pin K10 | TMS — JTAG test mode select |
Typische Anwendungen
EP2S90F1020I4N ist geeignet für 6 Anwendungs: Telecommunications Base Station Processing, ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, Military Radar Signal Processing, High-End Video Broadcast Equipment, Industrial Automation Controllers.
Telecommunications Base Station Processing
The EP2S90F1020I4N's 90,960 logic elements and embedded DSP blocks make it ideal for telecommunications base station baseband processing. The 4548 LABs enable parallel implementation of multiple CPRI and OBSAI links, while the embedded TriMatrix memory provides true dual-port buffers for sample-rate conversion. With 758 user I/Os, designers can aggregate multiple antenna paths simultaneously without external muxing. The device's industrial temperature range supports outdoor cabinet deployment.
Empfohlen
ASIC Prototyping and Emulation
With 90,960 logic elements and 4.5 Mbits of embedded memory, the EP2S90F1020I4N provides sufficient capacity to prototype ASIC designs up to several million gates. The 1020-ball BGA exposes 758 user I/Os for connecting to external memory and ASIC interfaces. Designers use multiple EP2S90 devices in partitioned multi-FPGA emulation platforms. Quartus II software supports incremental compilation for fast turnaround on design iterations.
Empfohlen
High-Speed Data Acquisition Systems
The EP2S90F1020I4N's 758 user I/Os and high-speed LVDS support enable multi-channel data acquisition at gigasample-per-second rates. Embedded memory absorbs bursts of incoming data while DSP blocks perform real-time filtering and FFT processing. The device's industrial temperature rating allows deployment in factory-floor and outdoor test environments. Combined with external ADC front-ends, it forms complete DSP pipelines.
Empfohlen
Military Radar Signal Processing
Radar systems require real-time pulse compression, MTI filtering, and FFT processing across hundreds of channels. The EP2S90F1020I4N's DSP blocks execute 18x18 multipliers at hundreds of MHz, supporting chirp generation and matched filtering. Its industrial temperature range meets many defense platform requirements, while the BGA package supports hermetic packaging for severe environments. Long-term availability programs should specify EP2S90F1020I4GA military grade.
Empfohlen
High-End Video Broadcast Equipment
The EP2S90F1020I4N processes uncompressed HD-SDI and 3G-SDI video streams with multiple channels simultaneously. Embedded memory stores frame buffers and lookup tables for color correction, while DSP blocks perform real-time scaling and de-interlacing. The 758 user I/Os accommodate multiple parallel video interfaces plus audio embedding. Broadcast studios benefit from the device's deterministic latency and reliability.
Empfohlen
Industrial Automation Controllers
High-end industrial automation systems use the EP2S90F1020I4N to implement deterministic motion controllers and multi-axis servo loops. The industrial temperature grade supports factory-floor installations with ambient temperatures reaching 60C. Hardware parallelism handles multiple EtherCAT or PROFINET channels while embedded memory implements PID loop tables. BGA package provides mechanical robustness for vibration-prone environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2S90F1020I4N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2S90F1020I4 | EP2S90F1020I3N | EP2S90F1020C5N | EP2S130F1020I4N | EP2S180F1020I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FineLine BGA | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 132,540 | 179,400 |
| LABs | 4548 | 4548 | 4548 | 4548 | 6616 | 8970 |
| Embedded Memory (bits) | 4,520,488 | 4,520,488 | 4,520,488 | 4,520,488 | 6,747,840 | 9,542,208 |
| User I/Os | 758 | 758 | 758 | 758 | 758 | 742 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | I4 (fast industrial) | I4 | I3 (slower industrial) | C5 (commercial) | I4 | I4 |
Wichtigste Unterscheidungsmerkmale
- Identical functionality to lead-free EP2S90F1020I4N with non-leaded solder balls (vs. EP2S90F1020I4)
- Industrial temperature grade (-40C to +100C) for harsh environments (vs. EP2S90F1020C5N)
- High-density 90K logic element count in established Stratix II architecture (vs. EP2S60F1020I4N)
Designhinweise
The 1020-ball FineLine BGA requires a multi-layer PCB (minimum 6 layers recommended) with continuous via arrays under the die footprint for thermal dissipation. At typical industrial workloads, the EP2S90 can dissipate 8-15W. Without adequate thermal management, junction temperatures can exceed safe limits. Use at least 4 thermal vias per signal ball grid in the central array, connecting inner plane layers to bottom-side copper pours.
BGA breakout routing requires careful stackup planning. The 1.0mm ball pitch FineLine BGA demands microvia technology (laser-drilled stacked vias) for inner-row escape. Route differential pairs (LVDS) with 100 ohm differential impedance and matched length within 10 mils. Power planes should be continuous under the BGA to suppress core voltage ripple. Decoupling: place 0.1uF and 10uF capacitors within 100 mils of every VCCINT pin.
Configuration memory selection is critical for the EP2S90. The device requires a serial or parallel configuration device from the EPCS or EPC family. Do not assume JTAG-only programming is sufficient for production - factory programming uses EPCS64 or larger. Also note that Stratix II devices do not support remote system upgrade out-of-the-box without additional logic design. Plan for at least one configuration retry mechanism in production firmware.
Compliance-Informationen
RoHS compliant per N suffix designation. Not AEC-Q100 qualified as automotive grade - uses industrial temperature range instead. Halogen-free status not explicitly stated in available data. Military/aerospace programs should request EP2S90F1020I4GA grade variant.
