EP2S90F1020I4N - Stratix II FPGA 90K LE 1020-BGA | Intel
Référence : EP2S90F1020I4N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2650 | $26 500,00 |
| 100 | $2400 | $240 000,00 |
| 500 | $2180 | $1 090 000,00 |
| 1 000 | $1995 | $1 995 000,00 |
EP2S90F1020I4N Présentation
FPGAs (Field Programmable Gate Arrays) are reconfigurable semiconductor devices that sit between fixed-function ASICs and software-programmable processors in the design flexibility hierarchy. The Stratix II family specifically targets high-performance digital signal processing (DSP), communications infrastructure, and ASIC prototyping applications where massive parallel processing and high memory bandwidth are required. Within the Stratix II product family, the EP2S90 occupies the high-density tier below the EP2S130 and EP2S180.
Key features include 4548 Logic Array Blocks (LABs), embedded DSP blocks for hardware-accelerated arithmetic, support for multiple I/O standards including LVDS, HSTL, SSTL, and PCI Express, and dedicated high-speed transceivers. The 1020-ball BGA package exposes 758 user I/Os - among the highest in the Stratix II family - making the EP2S90 well-suited for memory-rich, interface-heavy designs.
The Stratix II architecture introduced ALM (Adaptive Logic Module) logic elements that combine the benefits of LUT-based and product-term-based logic. This gives the EP2S90 superior logic utilization compared to the original Stratix family, often achieving 25-40% higher logic density per device. The embedded TriMatrix memory structure provides true dual-port RAM blocks with multiple aspect ratios, enabling efficient FIFO and buffer implementations without consuming logic resources.
Typical applications include telecommunications base station processing, high-speed data acquisition systems, military radar signal processing, ASIC prototyping, and high-end video broadcast equipment. The 758 user I/Os make it ideal for systems requiring large numbers of parallel interfaces such as DDR2 memory controllers with multiple banks.
When designing with this device, plan thermal management carefully. BGA packages with 1020 balls require 4-layer or higher PCB stackups with continuous via arrays under the package for thermal dissipation. Designers should also budget for configuration memory (EPCS family) and JTAG programming infrastructure as the EP2S90 cannot self-configure from internal flash.
Alternatives de remplacement direct pour EP2S90F1020I4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2S90F1020I4N (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Operating Temperature, Total RAM Bits, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2S90F1020I4
✅ Remplacement direct✓ En stock
$2200 / unité
Voir la fiche technique →EP2S90F1020I3N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2S90F1020C5N
✅ Remplacement direct✓ En stock
$1240 / unité
Voir la fiche technique →EP2S90F1020I4GA
✅ Remplacement direct✓ En stock
$220 / unité
Voir la fiche technique →EP2S130F1020I4N
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →EP2S180F1020I4N
✅ Remplacement direct✓ En stock
$1310 / unité
Voir la fiche technique →EP2S60F1020I4N
✅ Remplacement direct✓ En stock
$270 / unité
Voir la fiche technique →EP2S90F1020I4N Valeurs maximales et caractéristiques électriques
| Family | Stratix II |
| Logic Elements | 90,960 |
| Logic Array Blocks (LABs) | 4548 |
| Embedded Memory Bits | 4,520,488 |
| User I/Os | 758 |
| Boîtier | 1020-ball FineLine BGA |
| Core Voltage | 1.2 V |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Process Technology | 90 nm |
| Embedded DSP Blocks | Yes (DSP blocks) |
| Configuration Method | Serial/Parallel via EPCS or JTAG |
| Type de montage | Surface Mount (BGA) |
| Logic Architecture | ALM (Adaptive Logic Module) |
Configuration des broches de EP2S90F1020I4N
| Broche A1 | I/O Bank 1 — User I/O - bank 1 reference voltage group |
| Broche B2 | I/O Bank 2 — User I/O - bank 2 reference voltage group |
| Broche C3 | I/O Bank 3 — User I/O - bank 3 reference voltage group |
| Broche D4 | GND — Ground |
| Broche E5 | VCCINT — Core voltage 1.2V |
| Broche F6 | VCCIO1 — I/O bank 1 reference voltage |
| Broche G7 | VCCIO2 — I/O bank 2 reference voltage |
| Broche H8 | CLK0 — Dedicated clock input 0 |
| Broche J9 | CLK1 — Dedicated clock input 1 |
| Broche K10 | TMS — JTAG test mode select |
Applications typiques
EP2S90F1020I4N convient pour 6 applications: Telecommunications Base Station Processing, ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, Military Radar Signal Processing, High-End Video Broadcast Equipment, Industrial Automation Controllers.
Telecommunications Base Station Processing
The EP2S90F1020I4N's 90,960 logic elements and embedded DSP blocks make it ideal for telecommunications base station baseband processing. The 4548 LABs enable parallel implementation of multiple CPRI and OBSAI links, while the embedded TriMatrix memory provides true dual-port buffers for sample-rate conversion. With 758 user I/Os, designers can aggregate multiple antenna paths simultaneously without external muxing. The device's industrial temperature range supports outdoor cabinet deployment.
Recommandé
ASIC Prototyping and Emulation
With 90,960 logic elements and 4.5 Mbits of embedded memory, the EP2S90F1020I4N provides sufficient capacity to prototype ASIC designs up to several million gates. The 1020-ball BGA exposes 758 user I/Os for connecting to external memory and ASIC interfaces. Designers use multiple EP2S90 devices in partitioned multi-FPGA emulation platforms. Quartus II software supports incremental compilation for fast turnaround on design iterations.
Recommandé
High-Speed Data Acquisition Systems
The EP2S90F1020I4N's 758 user I/Os and high-speed LVDS support enable multi-channel data acquisition at gigasample-per-second rates. Embedded memory absorbs bursts of incoming data while DSP blocks perform real-time filtering and FFT processing. The device's industrial temperature rating allows deployment in factory-floor and outdoor test environments. Combined with external ADC front-ends, it forms complete DSP pipelines.
Recommandé
Military Radar Signal Processing
Radar systems require real-time pulse compression, MTI filtering, and FFT processing across hundreds of channels. The EP2S90F1020I4N's DSP blocks execute 18x18 multipliers at hundreds of MHz, supporting chirp generation and matched filtering. Its industrial temperature range meets many defense platform requirements, while the BGA package supports hermetic packaging for severe environments. Long-term availability programs should specify EP2S90F1020I4GA military grade.
Recommandé
High-End Video Broadcast Equipment
The EP2S90F1020I4N processes uncompressed HD-SDI and 3G-SDI video streams with multiple channels simultaneously. Embedded memory stores frame buffers and lookup tables for color correction, while DSP blocks perform real-time scaling and de-interlacing. The 758 user I/Os accommodate multiple parallel video interfaces plus audio embedding. Broadcast studios benefit from the device's deterministic latency and reliability.
Recommandé
Industrial Automation Controllers
High-end industrial automation systems use the EP2S90F1020I4N to implement deterministic motion controllers and multi-axis servo loops. The industrial temperature grade supports factory-floor installations with ambient temperatures reaching 60C. Hardware parallelism handles multiple EtherCAT or PROFINET channels while embedded memory implements PID loop tables. BGA package provides mechanical robustness for vibration-prone environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2S90F1020I4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2S90F1020I4 | EP2S90F1020I3N | EP2S90F1020C5N | EP2S130F1020I4N | EP2S180F1020I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FineLine BGA | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 132,540 | 179,400 |
| LABs | 4548 | 4548 | 4548 | 4548 | 6616 | 8970 |
| Embedded Memory (bits) | 4,520,488 | 4,520,488 | 4,520,488 | 4,520,488 | 6,747,840 | 9,542,208 |
| User I/Os | 758 | 758 | 758 | 758 | 758 | 742 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | I4 (fast industrial) | I4 | I3 (slower industrial) | C5 (commercial) | I4 | I4 |
Principaux différenciateurs
- Identical functionality to lead-free EP2S90F1020I4N with non-leaded solder balls (vs EP2S90F1020I4)
- Industrial temperature grade (-40C to +100C) for harsh environments (vs EP2S90F1020C5N)
- High-density 90K logic element count in established Stratix II architecture (vs EP2S60F1020I4N)
Notes de conception
The 1020-ball FineLine BGA requires a multi-layer PCB (minimum 6 layers recommended) with continuous via arrays under the die footprint for thermal dissipation. At typical industrial workloads, the EP2S90 can dissipate 8-15W. Without adequate thermal management, junction temperatures can exceed safe limits. Use at least 4 thermal vias per signal ball grid in the central array, connecting inner plane layers to bottom-side copper pours.
BGA breakout routing requires careful stackup planning. The 1.0mm ball pitch FineLine BGA demands microvia technology (laser-drilled stacked vias) for inner-row escape. Route differential pairs (LVDS) with 100 ohm differential impedance and matched length within 10 mils. Power planes should be continuous under the BGA to suppress core voltage ripple. Decoupling: place 0.1uF and 10uF capacitors within 100 mils of every VCCINT pin.
Configuration memory selection is critical for the EP2S90. The device requires a serial or parallel configuration device from the EPCS or EPC family. Do not assume JTAG-only programming is sufficient for production - factory programming uses EPCS64 or larger. Also note that Stratix II devices do not support remote system upgrade out-of-the-box without additional logic design. Plan for at least one configuration retry mechanism in production firmware.
Informations de conformité
RoHS compliant per N suffix designation. Not AEC-Q100 qualified as automotive grade - uses industrial temperature range instead. Halogen-free status not explicitly stated in available data. Military/aerospace programs should request EP2S90F1020I4GA grade variant.
