EP3SL200H780C3 - 200K LE Stratix III L FPGA 780-BGA | Altera / Intel
Teilenummer: EP3SL200H780C3 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7098.91 | $7.098,91 |
| 5 | $6800 | $34.000,00 |
| 10 | $6500 | $65.000,00 |
| 25 | $6300 | $157.500,00 |
| 50 | $6100 | $305.000,00 |
| 100 | $5900 | $590.000,00 |
EP3SL200H780C3 Übersicht
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs / LABs), programmable routing, dedicated hard IP such as DSP blocks and transceivers, and on-chip memory. Stratix III devices belong to the high-end FPGA product family in the wider programmable-logic taxonomy: FPGA -> PLD -> programmable logic -> semiconductor IC. Stratix III L variants are positioned for applications that require substantial logic density together with lower static power versus older Stratix generations.
Key features of the EP3SL200H780C3 include 200,000 logic elements, 8,000 logic array blocks (LABs), 488 user I/O, 10,901,520 bits of embedded memory (roughly 1.36 Mbyte), high-speed transceiver blocks, and dedicated DSP blocks. The 780-ball flip-chip BGA package exposes the full I/O count and supports industrial-temperature operation for commercial-grade (-40C to 85C) designs. Speed grade 3 is the slowest of the three Stratix III speed bins, making it attractive for cost-sensitive designs that do not require maximum Fmax.
Architecturally, the Stratix III L FPGA uses Altera's adaptive logic module (ALM) structure with 8-input fracturable look-up tables, a hierarchical routing fabric, and integrated PLLs. Compared with the Stratix II generation, Stratix III introduced lower static power through an innovative programmable power technology that turns off unused logic resources. The 'L' sub-family trades some high-speed transceiver performance versus the 'E' sub-family in exchange for higher logic density at lower power.
Typical applications for the EP3SL200H780C3 include wireline telecom line cards, high-end test and measurement equipment, medical imaging processing, broadcast video infrastructure, and ASIC prototyping where designers need a large, fast, reprogrammable fabric. Because of the 780-BGA pin count and large I/O bank count, this device is appropriate for designs requiring wide parallel data buses or many high-speed serial links.
When designing with this device, plan for the large BGA footprint: typical PCB stack-ups require at least 10 layers with 0.8 mm or 1.0 mm pitch BGA fanout and controlled-impedance routing for the high-speed serial links. Use the Quartus II (or later Quartus Prime) tool flow with the Stratix III device library, and ensure your power tree delivers the multiple voltage rails the Stratix III L family requires (typically core, I/O, PLL, and transceiver rails). For new designs, evaluate the newer Cyclone V or Stratix 10 families, since Stratix III is now a legacy family; confirm long-term support with Intel PSG before committing.
Drop-in-Alternativen für EP3SL200H780C3 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3SL200H780C3 (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3SL200H780C2
✅ Drop-In✓ Auf Lager
$6950 / Stück
Datenblatt ansehen →EP3SL200H780C2N
✅ Drop-In✓ Auf Lager
$6050 / Stück
Datenblatt ansehen →EP3SL200H780C3 Grenzwerte & elektrische Eigenschaften
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix III L |
| Device | EP3SL200 |
| Gehäuse | 780-ball FCBGA (H780) |
| Logic Elements | 200,000 |
| Logic Array Blocks (LABs) | 8,000 |
| User I/O Pins | 488 |
| Embedded Memory Bits | 10,901,520 |
| Speed Grade | 3 (slowest of Stratix III bins) |
| Montageart | Surface Mount (BGA) |
| MSL-Level | 3 (168 Hours) |
| Sub-Family | Stratix III L (lower-power logic variant) |
EP3SL200H780C3 780-ball fcbga (h780) Pinbelegungsleitfaden
Pinbelegung für EP3SL200H780C3 (780-ball fcbga (h780)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3SL200H780C3.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3SL200H780C3 ist geeignet für 6 Anwendungs: Wireline Telecom Line Card, Test and Measurement Instrumentation, Medical Imaging Processing, Broadcast Video Infrastructure, ASIC Prototyping, Industrial Control and Robotics.
Wireline Telecom Line Card
The EP3SL200H780C3's 200,000 logic elements and 488 user I/O pins deliver the fabric density required for high-density telecom line-card designs that need parallel processing of many packet streams. Its 10,901,520 bits of embedded memory enable deep packet buffers and lookup-table storage without external SRAM. The H780 FCBGA exposes enough high-speed LVDS pairs for framer/serializer interconnect, and the device's high I/O count supports the wide parallel data buses used between network processors and PHY devices. Designers can implement packet classification, QoS scheduling, and traffic shaping in a single device.
Empfohlen
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers use the EP3SL200H780C3's 200K logic elements for parallel sample buffering, real-time signal processing, and protocol decode in a single FPGA. The 488 user I/O pins accommodate multi-channel analog front-end digitizer interconnect, while 10.9 Mbits of embedded memory support deep acquisition windows. The Quartus II DSP Builder flow enables direct implementation of FIR filters and FFT engines against the device's DSP blocks, and JTAG-based debugging via SignalTap simplifies prototype bring-up.
Empfohlen
Medical Imaging Processing
Ultrasound beamformers, CT scanners, and MRI pre-processors rely on the EP3SL200H780C3's combination of high logic density and embedded memory to run parallel channel processing for image reconstruction. The device's 488 I/O pins connect to multi-channel ADC front-ends over LVDS, while on-chip block RAM provides scan-line buffering. The Stratix III L sub-family's lower static power versus earlier Stratix generations helps meet medical equipment thermal budgets. Designers implement beamforming, FFTs, and image enhancement in DSP blocks rather than external DSPs, reducing BOM cost.
Empfohlen
Broadcast Video Infrastructure
Broadcast video routers, switchers, and 4K/8K up-converters use the EP3SL200H780C3's parallel I/O fabric to handle uncompressed video streams at SDI, HDMI, and DisplayPort rates. The 200K logic elements support real-time color-space conversion, scaling, and frame-rate conversion across multiple video channels simultaneously. The 780-BGA package exposes enough high-speed serial transceivers (where available on Stratix III L) to drive multiple SDI links at 3G-SDI or 12G-SDI rates. Embedded block RAM holds intermediate frame buffers, eliminating external SRAM.
Empfohlen
ASIC Prototyping
Semiconductor companies use EP3SL200H780C3 devices to prototype large ASIC designs before tape-out because 200K logic elements is sufficient for many mid-complexity SoCs split across one or two FPGAs. The 780-BGA footprint is supported by all major ASIC prototyping platforms, and the Quartus II synthesis flow handles Verilog/VHDL from popular ASIC RTL flows. Multi-FPGA partitioning is simplified by the device's high I/O count, which keeps inter-FPGA pin count manageable. Debugging is supported via SignalTap and JTAG scan chains mapped to internal ASIC registers.
Empfohlen
Industrial Control and Robotics
High-end industrial controllers, machine-vision platforms, and motion-control systems use the EP3SL200H780C3 to combine multiple Ethernet/IP protocols, real-time servo loops, and machine-vision pipelines in a single FPGA. The 488 user I/O pins accommodate multi-axis encoder feedback, GPIO, and Ethernet PHYs in parallel, while the 10.9 Mbits of embedded memory buffer image frames for vision processing. The Stratix III L sub-family's lower static power suits fan-less industrial enclosures, and the FCBGA package provides mechanical robustness against vibration.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3SL200H780C3 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3SL200H780C2 | EP3SL200H780C2N | EP3SL200F1517I4N |
|---|---|---|---|---|
| Package | 780-ball FCBGA (H780) | 780-ball FCBGA (H780) - same | 780-ball FCBGA (H780) - same | 1517-ball FCBGA (F1517) - different |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Series | Stratix III L | Stratix III L | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 |
| Speed Grade | 3 (slowest) | 2 (faster) | 2 (faster) | I4 (industrial) |
| Embedded Memory (bits) | 10,901,520 | 10,901,520 | 10,901,520 | 10,901,520 |
| Operating Temperature | Commercial | Commercial | Commercial | Industrial (-40C to +85C) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Lowest-cost speed grade in the 200K-LE Stratix III L family (vs. EP3SL200H780C2)
- Highest logic density within Stratix III L with full 488-I/O exposure (vs. EP3SL150F1152C4N)
- Lower static power versus Stratix III E variant (vs. EP3SE260F780C3)
Designhinweise
Estimated: The 780-ball FCBGA at 0.8 mm or 1.0 mm pitch requires a multilayer PCB stackup with at least 10 layers, microvia or via-in-pad technology, and controlled-impedance routing for high-speed serial links. Plan escape routing using dog-bone fanout for outer-row balls, and allocate dedicated ground and power planes immediately beneath the BGA. Decoupling capacitors (100 nF, 10 nF, 1 nF mixed values) must be placed within 2 mm of each power pin pair.
The Stratix III L device requires multiple voltage rails (VCCINT for core, VCCIO for I/O banks, VCC_PLL for PLLs, VCC_TX/RX for transceivers where applicable, and VCCAUX). Each rail has its own ramp-rate and sequencing requirement per the Stratix III handbook; failing to meet sequencing can latch-up the device. Use a dedicated FPGA power sequencer IC (for example LTC2928 or similar) to ensure correct order on every power-up event.
At 200K logic elements and Stratix III's power budget, total power dissipation in worst-case designs can exceed 15-20 W. The 780-BGA package requires a heatsink or thermal pad interface material even with airflow, especially for industrial-temperature operation. Junction-to-ambient thermal resistance must be evaluated against the package's theta_JA in the Quartus II power analyzer tool before committing to the PCB layout.
Do not assume all 488 user I/O pins are general-purpose - many are dedicated clock inputs, JTAG pins, configuration pins, or high-speed transceiver pins that cannot be repurposed. Use the Stratix III device pin-out file (CSV download from Intel PSG) to verify every ball assignment before schematic capture. Configuration mode (AS, AP, PS, FPP) must be selected correctly based on the configuration device used (EPCS or EPCQ family flash).
Differential pair routing (LVDS, LVPECL, HSTL) requires matched trace lengths (typically ±0.13 mm tolerance for LVDS) and 100 ohm differential impedance. Clock inputs should be routed on inner signal layers with ground shielding and a via count of no more than 2. Stratix III transceivers (where present on the L sub-family) require additional attention to AC-coupling capacitor placement and transmitter pre-emphasis settings configured in Quartus II.
Compliance-Informationen
Compliance flags could not be confirmed from the verified web data provided; the manufacturer datasheet should be checked for RoHS, REACH, lead-free, and halogen-free status. AEC-Q100 does not apply to FPGAs.
