EP3SL200H780C3 vs EP3SL200H780C3N Vergleich

Detaillierter Direktvergleich von EP3SL200H780C3 von Altera und EP3SL200H780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL200H780C3 EP3SL200H780C3N
Marke Altera Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $5.900,00 $4.995,00
Manufacturer Intel (formerly Altera) —
Series Stratix III L —
Device EP3SL200 —
Gehäuse 780-ball FCBGA (H780) 780-Ball FCBGA (HBGA), 29 x 29 mm
Logic Elements 200,000 200,000
Logic Array Blocks (LABs) 8,000 8,000
User I/O Pins 488 —
Embedded Memory Bits 10,901,520 10,901,504 bits
Speed Grade 3 (slowest of Stratix III bins) C3 (commercial, -3 speed)
Betriebstemperatur Commercial grade (0C to +85C, exact range [DATA_NEEDED]) 0C to +85C (commercial)
Montageart Surface Mount (BGA) Surface Mount
MSL-Level 3 (168 Hours) 3
Sub-Family Stratix III L (lower-power logic variant) —
Transceivers [DATA_NEEDED: count and speed] 24 channels, up to 3.75 Gbps
DSP Blocks [DATA_NEEDED: count] 384
RoHS-Status [DATA_NEEDED: confirmed in datasheet] —
Lead-Free / Halogen-Free [DATA_NEEDED] —
Family — Stratix III L (low-power)
Process Node — 40 nm
User I/Os — 488
Maximum Internal Clock Frequency — 800 MHz
Voltage - Core — 0.9 V / 1.0 V (core, VCC)
Voltage - I/O — 1.2 V to 3.3 V (VCCIO banks)
Lead-Free / RoHS — Yes
Mounting Pitch — 1.0 mm ball pitch
PLLs — 12 (Stratix III PLL array)
Configuration — JTAG IEEE Std 1149.1, passive/active serial

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern