EP3SL200H780C2 - Stratix III L FPGA, 200K LE, 780-BGA | Intel
Teilenummer: EP3SL200H780C2 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8559.95 | $8.559,95 |
| 10 | $8200 | $82.000,00 |
| 100 | $7800 | $780.000,00 |
| 500 | $7350 | $3.675.000,00 |
| 1.000 | $6950 | $6.950.000,00 |
EP3SL200H780C2 Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable routing that the designer programs after manufacturing. Within the broader hierarchy, FPGAs sit alongside ASICs, CPLDs, and microcontrollers as programmable logic devices, with Stratix III positioned at the high-performance, high-density tier used in ASIC prototyping, signal processing, and high-throughput I/O bridging.
The EP3SL200H780C2 integrates 8,000 LABs/CLBs, 200,000 logic elements, 1,152 embedded 18x18 multipliers for DSP, and up to 12.7 Mbit of embedded RAM. Transceiver and I/O resources scale with package selection; the H780 package exposes 488 user I/O to support parallel LVDS, DDR2/DDR3 memory interfaces, and source-synchronous high-speed links. The device is fabricated on a 65 nm process tuned for low static and dynamic power, with programmable power technology that lets unused blocks enter a low-leakage state.
This part targets designers building high-density prototyping platforms, ASIC emulation rigs, high-speed data-acquisition front ends, and radar or wireless baseband pre-processing pipelines. The 488 I/O and abundant DSP blocks make it particularly suitable for parallel digital signal processing pipelines and complex state-machine controllers.
When designing with this device, expect power estimation via the Altera/Intel PowerPlay Early Power Estimator (EPE) before PCB layout; the 780-ball FCBGA requires a multilayer PCB with microvia stackups, matched-length impedance control on high-speed pairs, and a minimum 8-layer stackup with continuous reference planes.
This page synthesizes distributor pricing from Heisener and DigiKey-style listings, drop-in Stratix III / Stratix V alternatives, and practical design notes not found in the standalone datasheet.
Drop-in-Alternativen für EP3SL200H780C2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3SL200H780C2 (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Family, Embedded Memory Bits.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3SL200H780C2N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6050 / Stück
Datenblatt ansehen →EP3SL200H780C2LN
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP3SL200H780C3N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4995 / Stück
Datenblatt ansehen →EP3SL200H780C3
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5900 / Stück
Datenblatt ansehen →EP3SL200H780C4N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP3SL200H780C4
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1210 / Stück
Datenblatt ansehen →EP3SL200H780I3N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7200 / Stück
Datenblatt ansehen →EP3SL200H780C2 Grenzwerte & elektrische Eigenschaften
| Series | Stratix III L |
| Logic Elements | 200,000 |
| LABs / CLBs | 8000 |
| Total Memory Bits | 10,901,504 |
| User I/O Count | 488 |
| Gehäuse | 780-BBGA, FCBGA |
| Betriebstemperatur | 0C to +85C (Commercial) |
| Montageart | Surface Mount |
| Process Node | 65 nm |
| RoHS-Status | Compliant |
| Lead Free | Yes |
EP3SL200H780C2 780-bbga, fcbga Pinbelegungsleitfaden
Pinbelegung für EP3SL200H780C2 (780-bbga, fcbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3SL200H780C2.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3SL200H780C2 ist geeignet für 6 Anwendungs: ASIC Prototyping and Emulation, High-Speed Data Acquisition Front End, Wireless Baseband Pre-Processing, Radar Signal Processing Pipelines, Industrial Imaging and Machine Vision, High-Speed Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP3SL200H780C2 is well suited to ASIC prototyping where designers partition multi-million-gate ASIC netlists across multiple FPGAs. With 200,000 logic elements and 8,000 LABs/CLBs, each device holds a substantial slice of the ASIC design, while 488 user I/O enable high-pin-count chip-to-chip interconnect via LVDS or HSTC. The 65 nm low-power process reduces prototype heat generation, simplifying chassis design versus older 90 nm FPGAs. Programmable Power Technology lets unused blocks enter a low-leakage state, so the prototype closely matches real ASIC power when most logic is active. Designers use the Quartus II design tools to compile, partition, and time-budget their prototype across 2-4 EP3SL200H780C2 devices, accelerating software development before tapeout.
Empfohlen
High-Speed Data Acquisition Front End
With 488 user I/O supporting parallel LVDS pairs and 10,901,504 bits of embedded memory, the EP3SL200H780C2 works well as the FPGA core of a multi-channel data acquisition board. The 65 nm process gives the device high enough Fmax at speed grade 2 to capture and pre-process data from parallel ADCs, while embedded DSP blocks implement FIR filters and FFTs in real time. The 780-ball FCBGA exposes enough general-purpose I/O to interface with DDR2/DDR3 buffers that act as deep capture memory. Designers using the EP3SL200H780C2 in data acquisition typically pair it with an external clock-distribution network and ADC such as the AD9255; the FPGA can multiplex, down-sample, and forward packets over Ethernet or PCIe.
Empfohlen
Wireless Baseband Pre-Processing
Wireless baseband pre-processing benefits from the EP3SL200H780C2's 200,000 logic elements and embedded DSP blocks, which let engineers implement channelization, pulse shaping, and pre-FFT processing in FPGA fabric. The 488 user I/O give enough pins to receive digitized IF data from multiple ADC channels, while the embedded 18x18 multipliers accelerate correlators and matched filters. Stratix III L's low-power focus reduces heat in dense base-station enclosures, an advantage when several EP3SL200H780C2 devices share a chassis. Designers implement the radio PHY layer on the EP3SL200H780C2 and forward decoded data to a host processor via SERDES or parallel LVDS.
Empfohlen
Radar Signal Processing Pipelines
Radar pulse-compression and beamforming pipelines fit the EP3SL200H780C2 well: 200,000 logic elements and embedded DSP blocks accelerate FFTs, FIR matched filters, and adaptive beamformers, while 10.9 Mbit of embedded RAM serves as ping-pong buffers between processing stages. The 780-ball FCBGA package exposes 488 user I/O for high-speed digitizer and DAC connections, and the low-power 65 nm process keeps the FPGA within the thermal envelope of airborne or vehicle-mounted enclosures. Designers implement the pulse-compression engine on EP3SL200H780C2, feeding processed data downstream to a tracking processor over a parallel or SERDES link.
Empfohlen
Industrial Imaging and Machine Vision
Industrial imaging systems leverage the EP3SL200H780C2 to ingest data from multiple high-resolution image sensors and run real-time pre-processing such as demosaicing, gamma correction, and defect detection. The 488 I/O accept parallel Camera Link or LVDS sensor outputs, while embedded DSP blocks handle 2D filter kernels at line rate. The 65 nm process yields predictable thermal performance in factory-floor cabinets where ambient temperatures can vary widely. Designers combine the EP3SL200H780C2 with external DDR2/DDR3 frame buffers and route processed image regions over Ethernet or PCIe to a host controller.
Empfohlen
High-Speed Test and Measurement Instrumentation
Test and measurement instruments such as protocol analyzers and logic analyzers depend on the EP3SL200H780C2's combination of 488 user I/O and 200,000 logic elements to capture and decode parallel bus traffic in real time. The device's embedded memory (10.9 Mbit) holds deep capture buffers, while embedded DSP blocks accelerate protocol decoding (PCIe, SATA, USB, custom). The H780 FCBGA footprint exposes enough I/O for 32-bit parallel probes plus trigger/clock channels. Designers use the EP3SL200H780C2 as the central FPGA in a high-end logic analyzer, then upload traces to a host PC over USB or Ethernet for software analysis.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3SL200H780C2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3SL200H780C2N | EP3SL200H780C3N | EP3SL200H780I3N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-BBGA FCBGA | 780-BBGA FCBGA - same | 780-BBGA FCBGA - same | 780-BBGA FCBGA - same |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 |
| LABs/CLBs | 8,000 | 8,000 | 8,000 | 8,000 |
| User I/O | 488 | 488 | 488 | 488 |
| Speed Grade | 2 (Commercial) | 2 (Commercial) | 3 (Commercial) | 3 (Industrial) |
| Temperature Range | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | -40C to +100C |
| Process Node | 65 nm low-power | 65 nm low-power | 65 nm low-power | 65 nm low-power |
| Lead Free | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Same-footprint speed grade flexibility within Stratix III L family (vs. EP3SL200H780C3N)
- Commercial vs industrial temperature grade availability (vs. EP3SL200H780I3N)
- Lower static and dynamic power vs standard Stratix III (vs. EP3S200F780C2)
Designhinweise
Estimated: Stratix III L devices at 200K LE with sustained logic activity around 70-80% can dissipate 8-12 W. The 780-ball FCBGA package has a theta_JA of approximately 8-12 C/W with the recommended thermal via array and 4 oz copper on inner layers, yielding a junction temperature rise of 65-145 C above ambient. For reliable operation, designers must provide a thermal via array under the central ground balls and at least a 6x6 grid of inner-layer copper pour pads, per the Stratix III Device Handbook thermal design guidelines.
The 780-ball FCBGA requires a high-density interconnect PCB stackup. Use at least an 8-layer board with HDI (microvia) construction to fan out the 1.0 mm pitch BGA. Match trace impedance to 50 ohm single-ended or 100 ohm differential for LVDS pairs, and apply length-matching to within 10-20 mil on byte-lane signals to DDR2/DDR3 memory interfaces. Continuous reference planes on layers L2 and L7 are essential; route high-speed signals on stripline layers (L3-L6) referenced to solid ground.
Do not omit the configuration flash or JTAG header: the EP3SL200H780C2 needs an EPCS or EPCQ configuration device or JTAG-driven programming for production boards. Power sequencing of VCCINT before VCCIO is mandatory - apply VCCINT (typically 0.9 V or 1.1 V) before VCCIO (1.2-3.3 V) within the Altera-specified ramp window, or the device may latch up. Use the PowerPlay Early Power Estimator (EPE) before schematic freeze to validate regulator sizing.
Compliance-Informationen
RoHS-compliant per Altera/Intel product page. Lead-free. Reach and halogen-free status not explicitly stated in Verified Web Data; marked unknown. AEC-Q100 not applicable (FPGA, not an automotive-grade IC).