EP3SL340F1517C4LN - Stratix III L FPGA, 337.5K LE, 1517-FBGA | Intel
Teilenummer: EP3SL340F1517C4LN ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $16874.78 | $16.874,78 |
| 10 | $15200 | $152.000,00 |
| 100 | $13800 | $1.380.000,00 |
| 500 | $12500 | $6.250.000,00 |
| 1.000 | $11200 | $11.200.000,00 |
EP3SL340F1517C4LN Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data rather than by hard-wired mask geometry. Within the broader programmable logic hierarchy, FPGAs sit above CPLDs in density and below ASICs in unit cost; the Stratix III family is Intel's high-performance, low-power FPGA line targeting ASIC prototyping, DSP, and high-speed serial I/O. The 'L' variant (Stratix III L) emphasizes lower static and dynamic power versus the standard Stratix III E family, while preserving the same architecture.
Key specifications of the EP3SL340F1517C4LN include up to 13,500 Logic Array Blocks (LABs), embedded DSP blocks for high-throughput arithmetic, up to 24 transceivers on selected package variants, and rich clock management with PLLs. The 1517-BBGA package provides the largest I/O count in the Stratix III L family and supports high-speed memory interfaces such as DDR3 and QDR II+ with dedicated DQS/DQ pins. Configuration is supported via fast passive parallel, fast active serial, or JTAG.
Architecturally, the device combines Adaptive Logic Modules (ALMs) for fine-grained logic, TriMatrix embedded memory blocks of three depths (MLAB, M9K, M144K) for flexible buffering, and dedicated 18x18 multipliers for DSP. The Quartus II design suite is the primary toolchain. Compared to gate-array ASICs at this density, the EP3SL340F1517C4LN offers in-system reprogrammability and immediate prototyping turnaround at the cost of higher per-unit price and lower raw clock frequency.
Typical applications include high-end ASIC prototyping, wireline telecom line cards, high-performance DSP for radar and medical imaging, broadcast video processing, and military/aerospace test systems. Its 976 user I/Os make it suitable for memory-intensive designs requiring wide external buses, while the 65 nm process keeps dynamic power manageable for thermally constrained chassis designs.
When designing with this FPGA, engineers should plan power sequencing for the 1.1 V core, 2.5 V/3.3 V auxiliaries, and PLL analog supplies separately, and allocate sufficient PCB area for the 1517-ball FC-FBGA footprint. Thermal management is critical: a heatsink with controlled airflow is typically required for continuous operation at full fabric utilization.
This page synthesizes distributor pricing, drop-in Stratix III L alternatives, and practical design notes not found on a single manufacturer page.
Drop-in-Alternativen für EP3SL340F1517C4LN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3SL340F1517C4LN (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3SL340F1517C4L
✅ Drop-In✓ Auf Lager
$14500 / Stück
Datenblatt ansehen →EP3SL340F1517C4
✅ Drop-In✓ Auf Lager
$3300 / Stück
Datenblatt ansehen →EP3SL340F1517C3N
✅ Drop-In✓ Auf Lager
$3750 / Stück
Datenblatt ansehen →EP3SL340F1517C3
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP3SL340F1517C2N
✅ Drop-In✓ Auf Lager
$13200 / Stück
Datenblatt ansehen →EP3SL340F1517C2
✅ Drop-In✓ Auf Lager
$3050 / Stück
Datenblatt ansehen →EP3SL340F1517C4LN Grenzwerte & elektrische Eigenschaften
| Series | Stratix III L |
| Logic Elements | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Embedded Memory Bits | 18,821,144 bits |
| Maximum User I/Os | 976 |
| Gehäuse | 1517-BBGA, FCBGA |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Maximum Fabric Frequency | 450 MHz |
| Betriebstemperaturbereich | 0C to 85C (Commercial) |
| Temperature Grade | C (Commercial) |
| Speed Grade | 4 |
| Lead-Free | Yes |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
EP3SL340F1517C4LN 1517-bbga, fcbga Pinbelegungsleitfaden
Pinbelegung für EP3SL340F1517C4LN (1517-bbga, fcbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3SL340F1517C4LN.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3SL340F1517C4LN ist geeignet für 6 Anwendungs: High-Density ASIC Prototyping, Wireline Telecom Line Cards, High-Performance DSP for Radar and Imaging, Broadcast Video Processing, Military and Aerospace Test Systems, High-Speed Memory Interface Aggregation.
High-Density ASIC Prototyping
The EP3SL340F1517C4LN fits high-density ASIC prototyping because its 337,500 logic elements, 13,500 LABs, and 18.8 Mbits of TriMatrix embedded memory can absorb mid-to-large ASIC RTL designs that target 2-4 million ASIC gates. The 976 user I/Os emulate wide ASIC pin counts needed for SoC bring-up, while Quartus II incremental compilation lets design teams iterate RTL changes block-by-block without full re-synthesis. Compared to ASIC tape-out cycles measured in months, this FPGA delivers working silicon in days, at the cost of higher per-unit pricing. Pair it with a thermal management solution (heatsink plus 200 LFM airflow) to sustain continuous operation during long regression runs.
Empfohlen
Wireline Telecom Line Cards
Stratix III L devices were designed for low-power telecom line cards, and the EP3SL340F1517C4LN is suited for multi-channel packet processing and OTN framer/mapper functions. The 65 nm low-power architecture delivers lower static leakage than the Stratix III E family, which matters in NEBS-compliant chassis where junction-to-ambient thermal budgets are tight. Its 976 I/Os can connect to multiple SFP+ cages and backplane SERDES interfaces, while the embedded TriMatrix memory buffers packet payloads at line rate. Use Quartus II to map Soft Decision FEC and packet classification engines into the fabric. Plan multi-rail sequencing (1.1 V core, 2.5 V aux, 3.3 V I/O) per Stratix III hardware design guidelines.
Empfohlen
High-Performance DSP for Radar and Imaging
The EP3SL340F1517C4LN fits radar and medical imaging signal chains because its dedicated 18x18 multipliers and DSP blocks deliver hundreds of GMACS, enough for pulse compression, FFT, and beamforming kernels at real-time rates. The 18.8 Mbit embedded memory holds FFT twiddle tables and range-Doppler maps without external SRAM. With 976 user I/Os, the device streams high-speed ADC samples directly into the fabric and outputs processed data to a host CPU over PCIe or 10G Ethernet. The commercial 0-85C temperature grade suits controlled-environment imaging carts and lab radar testbeds; for outdoor radar, choose the 'I' (industrial) variant.
Empfohlen
Broadcast Video Processing
The EP3SL340F1517C4LN addresses broadcast video processing where 3G-SDI, HDMI 1.4, and DisplayPort interfaces must be aggregated and color-space-converted in real time. Its 337,500 logic elements plus DSP blocks can host multi-channel scalers and deinterlacers, while 976 I/Os allow direct parallel connection to video frame buffers and SDI PHY chips. The Stratix III L architecture was specifically engineered for power-sensitive broadcast chassis where per-watt processing density matters. Use the device's PLL-based clock tree to generate independent pixel clocks for multiple video planes. Plan PCIe pass-through for host ingest/egress and dedicate PLLs to PTP 1588 for studio timing synchronization.
Empfohlen
Military and Aerospace Test Systems
The EP3SL340F1517C4LN is used in military/aerospace ground test equipment where ASICs are not yet available but production test patterns must emulate the end ASIC. The 1517-FBGA package provides 976 I/Os to break out hundreds of test channels in parallel, and the 18.8 Mbit embedded memory captures deep fault-trace buffers. Quartus II's SignalTap II logic analyzer integrates on-chip debug, reducing external test instrument cost. Note that the 'C' (commercial) grade is limited to 0-85C; for field-test carts that see temperature extremes, designers should select the 'I' (industrial) or look to newer Stratix V variants with broader MIL-PRF support.
Empfohlen
High-Speed Memory Interface Aggregation
The EP3SL340F1517C4LN suits memory aggregation designs that must bridge multiple DDR3 ranks, QDR II+ SRAM, and RLDRAM II to a host ASIC. With 976 user I/Os and dedicated DQS/DQ pins per memory interface, the device can host up to four independent DDR3 controllers running at 800 MHz. The TriMatrix embedded memory blocks (M9K, M144K) act as write-coalescing buffers between interfaces. Quartus II's UniPHY IP provides PHY-level timing closure, reducing bring-up time. Designers should pay attention to simultaneous switching output (SSO) noise: place decoupling on every VCCIO rail and follow Stratix III high-speed memory layout guidelines to maintain signal integrity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3SL340F1517C4LN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3SL340F1517C4L | EP3SL340F1517C4 | EP3SL340F1517C3N | EP3SL340F1517C3 | EP3SL340F1517C2N | EP3SL340F1517C2 |
|---|---|---|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | 4 (fastest) | 4 | 4 | 3 (10% slower) | 3 (10% slower) | 2 (20% slower) | 2 (20% slower) |
| Lead-Free Finish | Yes (N suffix) | No | No | Yes | No | Yes | No |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Maximum User I/Os | 976 | 976 | 976 | 976 | 976 | 976 | 976 |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Wichtigste Unterscheidungsmerkmale
- Highest speed grade available in the 1517-FBGA footprint (vs. EP3SL340F1517C3N)
- Pb-free / RoHS-compliant lead finish (vs. EP3SL340F1517C4L)
- Stratix III L low-power architecture (vs. EP3SE260F1517C4N (Stratix III E family))
Designhinweise
Estimated: at full fabric utilization (approx. 80% logic toggling at 250 MHz), the EP3SL340F1517C4LN can dissipate 15-20 W on the FC-FBGA package. The 1517-ball package has typical theta_JA in the 8-12 C/W range when mounted on a standard JEDEC 4-layer test board with minimal copper. To keep junction temperature below 100C in a commercial-grade design, the heatsink must keep case-to-ambient thermal resistance below approximately 4 C/W, which generally requires a finned aluminum heatsink plus 200 LFM airflow. Always measure junction temperature with the on-die diode under worst-case workload before finalizing the cooling solution.
The 1517-ball FC-FBGA requires an 8+ layer PCB stackup with microvia-in-pad technology for BGA escape routing. Use 1.0 mm or 1.27 mm BGA pitch breakout with the top two layers dedicated to escape traces and adjacent power planes. Per Stratix III hardware design guidelines, place at least one 0.1 uF decoupling capacitor per VCCIO pin and bulk decoupling per power rail. Match length within each DDR3 byte lane and use the Stratix III EMIF Toolkit for read/write deskew before sign-off.
The EP3SL340F1517C4LN requires multiple supply rails: VCC (1.1 V core), VCCPT (1.1 V programmable power technology), VCCPD (3.3 V or 2.5 V), VCCIO (per bank, 1.2 V to 3.3 V), VCCAUX (2.5 V), and VCCA_PLL/VCCD_PLL for analog PLL supplies. Power-on sequence must follow the Stratix III POR specification: VCC before VCCIO and VCCAUX. Skipping the sequence can cause high inrush current and potential latch-up. Use a dedicated power sequencer IC rather than RC delays to ensure monotonic ramp rates under all load conditions.
Estimated: configuration failures are the most common bring-up issue with this 1517-FBGA device. Use the AS (Active Serial) configuration mode with a dedicated EPCS configuration flash for fastest bring-up, or FPP (Fast Passive Parallel) for multi-device chains. Verify CONF_DONE and nSTATUS signals with a logic analyzer on first power-up. Do not share the JTAG chain between the FPGA and the configuration flash without proper buffering, and always issue a JTAG IDCODE check before attempting programming.
Compliance-Informationen
Pb-free / RoHS compliant per the 'N' suffix in the part number. AEC-Q100 not applicable for this FPGA category. Halogen-free status not stated in available data; consult Intel product declaration for verification.