Intel

EP3SL340F1517C4LN - Stratix III L FPGA, 337.5K LE, 1517-FBGA | Intel

MPN: EP3SL340F1517C4LN ✗ Cuối đời

1.1 V Vdss 1517-BBGA, FCBGA Package 450 MHz Speed 18,821,144 bits Memory

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EP3SL340F1517C4LN Tóm tắt

The Intel EP3SL340F1517C4LN is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) with 337,500 logic elements, 18,822,144 bits of embedded memory, and 976 maximum user I/Os, housed in a 1517-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. It is fabricated on a 65 nm CMOS process with a 1.1 V core supply, operates at up to 450 MHz fabric performance, and ships in the commercial 0C to 85C temperature grade with Pb-free lead finish.

A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data rather than by hard-wired mask geometry. Within the broader programmable logic hierarchy, FPGAs sit above CPLDs in density and below ASICs in unit cost; the Stratix III family is Intel's high-performance, low-power FPGA line targeting ASIC prototyping, DSP, and high-speed serial I/O. The 'L' variant (Stratix III L) emphasizes lower static and dynamic power versus the standard Stratix III E family, while preserving the same architecture.

Key specifications of the EP3SL340F1517C4LN include up to 13,500 Logic Array Blocks (LABs), embedded DSP blocks for high-throughput arithmetic, up to 24 transceivers on selected package variants, and rich clock management with PLLs. The 1517-BBGA package provides the largest I/O count in the Stratix III L family and supports high-speed memory interfaces such as DDR3 and QDR II+ with dedicated DQS/DQ pins. Configuration is supported via fast passive parallel, fast active serial, or JTAG.

Architecturally, the device combines Adaptive Logic Modules (ALMs) for fine-grained logic, TriMatrix embedded memory blocks of three depths (MLAB, M9K, M144K) for flexible buffering, and dedicated 18x18 multipliers for DSP. The Quartus II design suite is the primary toolchain. Compared to gate-array ASICs at this density, the EP3SL340F1517C4LN offers in-system reprogrammability and immediate prototyping turnaround at the cost of higher per-unit price and lower raw clock frequency.

Typical applications include high-end ASIC prototyping, wireline telecom line cards, high-performance DSP for radar and medical imaging, broadcast video processing, and military/aerospace test systems. Its 976 user I/Os make it suitable for memory-intensive designs requiring wide external buses, while the 65 nm process keeps dynamic power manageable for thermally constrained chassis designs.

When designing with this FPGA, engineers should plan power sequencing for the 1.1 V core, 2.5 V/3.3 V auxiliaries, and PLL analog supplies separately, and allocate sufficient PCB area for the 1517-ball FC-FBGA footprint. Thermal management is critical: a heatsink with controlled airflow is typically required for continuous operation at full fabric utilization.

This page synthesizes distributor pricing, drop-in Stratix III L alternatives, and practical design notes not found on a single manufacturer page.

Bộ thay thế dễ dàng lắp đặt cho EP3SL340F1517C4LN — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SL340F1517C4LN (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Mounting Type.

EP3SL340F1517C2

Intel

Package: 1517-ball FCBGA

Speed Grade: C2

Operating Temperature: 0C to +85C (Commercial grade C2)