EP3SL340H1152I3N - Stratix III L FPGA, 337.5K LEs, 1152-BGA | Intel
Teilenummer: EP3SL340H1152I3N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18204.74 | $18.204,74 |
| 10 | $17500 | $175.000,00 |
| 100 | $16200 | $1.620.000,00 |
| 500 | $15100 | $7.550.000,00 |
| 1.000 | $14250 | $14.250.000,00 |
EP3SL340H1152I3N Übersicht
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (LBs), programmable interconnect, embedded memory, DSP blocks, and hardened I/O serdes. FPGAs sit at the top of the digital semiconductor hierarchy below ASICs, allowing hardware designers to implement custom parallel processing pipelines, state machines, and high-speed interfaces without the NRE cost of a custom ASIC. The Stratix III family uses TSMC's 65 nm process and emphasizes a low-power "L" variant tuned for power-sensitive applications.
Key features of the EP3SL340H1152I3N include 337,500 logic elements, 18,822,144 bits of embedded RAM, 744 maximum user I/O, programmable power technology with logic-array clocking, on-chip termination (OCT), and DSP blocks supporting high-throughput fixed- and floating-point arithmetic. The device is specified for the industrial temperature grade (-40 °C to +100 °C) and supports multiple high-speed serial protocols through its transceiver channels.
Architecturally, the Stratix III L uses a tile-based logic structure with dedicated carry chains, 8-input adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), and DSP block slices that accelerate IEEE-754 single-precision floating-point operations. The 1152-BGA package exposes the full device periphery for maximum user I/O, making this part the preferred package option when a design needs 500+ board-level signals.
Typical applications include wireline telecom line cards, ASIC prototyping, high-performance DSP pipelines for radar/medical imaging, broadcast video processing, and military/aerospace signal processing. Designers also deploy the EP3SL340H1152I3N in test & measurement instrumentation where its combination of logic density and high I/O count enables a single-chip acquisition/processing backend.
When designing with this FPGA, careful attention to power integrity is required. Programmable power technology combined with on-chip temperature sensors helps dynamic power management, but multi-rail decoupling, bulk bypassing, and a thermal solution sized for the FCBGA's theta-JA are mandatory for reliable industrial operation.
This page synthesizes distributor inventory, drop-in pin-compatible Stratix III L alternatives, application recommendations, and PCB-thermal design notes that the manufacturer datasheet alone does not provide.
Drop-in-Alternativen für EP3SL340H1152I3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3SL340H1152I3N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Embedded Memory, Core Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3SL340H1152I3
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$13234.64 / Stück
Datenblatt ansehen →EP3SL340H1152C4N
⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1245 / Stück
Datenblatt ansehen →EP3SL340H1152C4LN
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1980 / Stück
Datenblatt ansehen →EP3SL340H1152C4L
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3500 / Stück
Datenblatt ansehen →EP3SL340H1152C4
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$11000 / Stück
Datenblatt ansehen →EP3SL340H1152C3N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1895 / Stück
Datenblatt ansehen →EP3SE260F1152I3N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3360 / Stück
Datenblatt ansehen →EP3SL340H1152I3N Grenzwerte & elektrische Eigenschaften
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory | 18,822,144 bits |
| Maximum User I/O | 744 |
| Gehäuse | 1152-BBGA, FCBGA |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Total Memory Bits | 18,822,144 bits |
| Montageart | Surface Mount (BGA) |
| MSL-Level | 4 |
| Lead-Free / RoHS | Yes / Compliant (lead-free BGA per Heisener listing) |
| Moisture Sensitivity | MSL4 (per Partstack) |
EP3SL340H1152I3N 1152-bbga, fcbga Pinbelegungsleitfaden
Pinbelegung für EP3SL340H1152I3N (1152-bbga, fcbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3SL340H1152I3N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3SL340H1152I3N ist geeignet für 6 Anwendungs: ASIC Prototyping, Wireline Telecom Line Cards, Radar Signal Processing, Broadcast Video Processing, Medical Imaging Systems, Test & Measurement Instrumentation.
ASIC Prototyping
The EP3SL340H1152I3N's 337,500 logic elements and 18.8 Mbits of embedded memory make it a go-to platform for ASIC prototyping. Engineers map multi-million-gate ASIC netlists onto one or more Stratix III L devices using Quartus Prime's partition-and-merge flow. The 1152-BGA package exposes 744 user I/Os, sufficient for emulating wide ASIC pinouts. Compared with ASIC tape-out, the FPGA prototype validates RTL, firmware, and system-level behavior months before silicon. JTAG-driven configuration and on-chip logic analyzers (SignalTap) further accelerate debug cycles.
Empfohlen
Wireline Telecom Line Cards
The EP3SL340H1152I3N is widely deployed in high-density telecom line cards where its combination of 337.5K LEs and 744 I/Os supports channelized framers, packet processors, and traffic-management logic on a single device. Hard multi-gigabit transceivers interface with SFP+/XFP optical modules, while DDR3 controller PHYs connect to external packet buffers. Industrial temperature rating (-40C to +100C) is critical for central-office and outdoor cabinet environments. Programmable power technology reduces idle consumption during low-traffic periods.
Empfohlen
Radar Signal Processing
In radar and electronic-warfare systems the EP3SL340H1152I3N's DSP blocks accelerate FFT, pulse compression, and beamforming in real time. The 1152-BGA package supports the wide LVDS data paths typical of phased-array antenna digitization. Industrial temperature grade allows deployment in unmanned outdoor sensor pods. The Stratix III L architecture balances DSP throughput (GMACs/s) with logic density so that a single FPGA can host both the beamforming network and downstream tracker logic, reducing PCB area and bill of materials.
Empfohlen
Broadcast Video Processing
Broadcast studios and video routers use the EP3SL340H1152I3N for SDI/HDMI matrix switching, up/down/cross-conversion, and real-time overlay compositing. The FPGA's 744 I/Os allow direct fan-out to multiple BNC connectors without external crosspoint chips. Embedded memory blocks act as line buffers and frame stores, while DSP slices handle chroma resampling. Quartus Prime's video and image processing suite provides reference IP for SD/HD/3G-SDI and DisplayPort interfaces, shortening development time for broadcast OEM designs.
Empfohlen
Medical Imaging Systems
CT, MRI, and ultrasound scanners leverage the EP3SL340H1152I3N for image reconstruction, beamforming, and front-end digitization. The industrial temperature range supports imaging carts and OR-adjacent equipment, while the abundant logic enables on-chip implementations of filtered back-projection and parallel FFT pipelines. Embedded TriMatrix memory tiles are sized for line buffers used in 2D/3D reconstruction. The 1152-BGA exposes enough I/O for parallel LVDS ADC interfaces typical of 16/32-channel receiver boards.
Empfohlen
Test & Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers use the EP3SL340H1152I3N for sample-rate conversion, pattern generation, and protocol decoding at multi-gigabit rates. The FPGA's 744 I/Os accommodate parallel front-end digitizer outputs, while embedded memory tiles store deep acquisition records. Industrial temperature rating supports benchtop and field-portable instrument enclosures. Designers use Quartus Prime's SignalTap and DSP Builder to integrate acquisition, trigger, and on-screen visualization logic in a single device, reducing parts count.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3SL340H1152I3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3SL340H1152I3 | EP3SL340H1152C4N | EP3SL340H1152C4LN | EP3SL340H1152C3N | EP3SE260F1152I3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BGA (FCBGA) | 1152-BGA - same | 1152-BGA - same | 1152-BGA - same | 1152-BGA - same | 1152-BGA - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 256,000 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C-85C) | Commercial (0C-85C) | Commercial (0C-85C) | Industrial |
| Speed Grade | 3 | 3 | 4 (slower) | 4 (slower) | 3 | 3 |
| Family / Variant | Stratix III L | Stratix III L | Stratix III L | Stratix III L (lower-power) | Stratix III L | Stratix III E (different family) |
Wichtigste Unterscheidungsmerkmale
- Highest-density Stratix III L FPGA in 1152-BGA package (vs. EP3SE260F1152I3N (Stratix III E))
- Industrial temperature grade suitable for harsh environments (vs. EP3SL340H1152C4N (commercial grade))
- Low-power 'L' family variant for power-sensitive designs (vs. EP3SE260F1152I3N (Stratix III E))
- Speed grade 3 balances performance and power efficiency (vs. EP3SL340H1152C4N (speed grade 4))
Designhinweise
Estimated: The FCBGA-1152 package has a typical theta-JA around 8-12 C/W with a properly designed 1 oz copper layer-fanout PCB (8-layer, 4 internal ground/power planes). At full Stratix III L utilization the device can dissipate 8-15 W; junction-to-ambient temperature rise may exceed 80 C without forced-air cooling. For industrial-temperature operation (-40C to +100C junction), a heatsink plus 200 LFM airflow is recommended for continuous full-power designs.
Decouple each VCCINT, VCCA, and VCCPD pin with 0.1 uF X7R ceramic placed within 50 mil of the BGA ball, plus a 10 uF bulk capacitor per voltage rail. Stratix III L power-rail sequencing requires VCCINT to ramp before VCCA; consult the Stratix III Handbook power-management section for the recommended Power-on-Reset (POR) sequencing to avoid latch-up during FPGA configuration.
Use at least an 8-layer PCB stack-up with continuous reference planes for high-speed transceiver and DDR3 channels. Microvia-in-pad or laser-drilled microvia stack-ups are recommended for BGA breakout on the 1.0 mm pitch FCBGA-1152 footprint. Maintain 100 ohm differential impedance for transceiver pairs and 50 ohm single-ended for general-purpose I/O.
Do not assume 1152-BGA compatibility across Stratix III speed grades - all EP3SL340H1152 variants share the same BGA pinout but timing models differ. Using a C4 speed grade part in an I3 design will fail timing closure; using an I3 part in a C4 socket is acceptable but over-spec. Verify exact part ordering codes with Altera/Intel's part-number decoder before committing to PCB layout.
Estimated: Route transceiver channels first with matched-length differential pairs (length matching to within 5 mil). Isolate clock inputs on dedicated GCLK or PLL clock pins. Keep DDR3 byte lanes within a single I/O bank so the dedicated DQS/DQSn phase-alignment circuits can compensate skew. Avoid crossing reference-plane splits on any high-speed net.
Compliance-Informationen
Lead-free per Heisener listing ('LEAD FREE'). RoHS status confirmed per Heisener and Partstack listings. REACH, halogen-free, and conflict-minerals declarations not available in verified data - mark as unknown.