EP4CE30F23I8LN - Cyclone IV E FPGA, 28.8K LEs, 484-FBGA | Intel
Teilenummer: EP4CE30F23I8LN ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.4 | $724,00 |
| 100 | $64.9 | $6.490,00 |
| 500 | $58.2 | $29.100,00 |
| 1.000 | $52.1 | $52.100,00 |
EP4CE30F23I8LN Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, interconnect, and I/O cells that can be re-programmed at the hardware level after manufacturing. Within the broader silicon taxonomy, FPGAs belong to programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Cyclone IV E sits in the low-power, high-volume segment of Intel's FPGA portfolio, optimized for cost-sensitive applications such as industrial control, video processing, and communications infrastructure.
Key features of this device include 4 PLLs, 66 embedded 18x18 multipliers (132 9x9 multipliers), and support for external memory interfaces including DDR, DDR2, SDR, and QDRII SRAM. The device operates from a 1.2V core supply with 2.5V/3.3V I/O bank supplies. The F23 package integrates 484 balls on a 1.0mm pitch in a 23x23mm body, providing ample routing density for high-pin-count designs while remaining compatible with conventional PCB assembly.
Typical applications span industrial machine vision, motor and motion control, low-cost ASIC prototyping, video bridging and processing, and embedded display controllers. The combination of low static power (typical Cyclone IV E family), abundant logic, and a mature Quartus II / Quartus Prime toolchain makes this part attractive for long-life industrial designs.
When designing with the EP4CE30F23I8LN, ensure the PCB has a proper 4-layer or better stack-up to support 1.0mm-pitch BGA fanout. The 484-FBGA demands either via-in-pad or dog-bone fanout; verify with your assembly house. Plan I/O bank partitioning early - each bank has its own VCCIO and reference voltage, and mixing multiple I/O standards (e.g., 1.8V LVCMOS and 3.3V LVTTL) requires careful VREF planning.
This page synthesizes distributor pricing, drop-in Cyclone IV E family alternatives in the same 484-FBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für EP4CE30F23I8LN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4CE30F23I8LN (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Logic Elements, RoHS Status, Configuration Modes.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4CE30F23I7N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP4CE30F23C8N
✅ Drop-In✓ Auf Lager
$22.4 / Stück
Datenblatt ansehen →EP4CE30F23I8LN
✅ Drop-In✓ Auf Lager
$52.1 / Stück
Datenblatt ansehen →EP4CE30F29I7N
✅ Drop-In✓ Auf Lager
$47.85 / Stück
Datenblatt ansehen →EP4CE30F23I8LN Grenzwerte & elektrische Eigenschaften
| Family | Cyclone IV E |
| Logic Elements | 28,848 |
| Configurable Logic Blocks (CLBs) | 1803 |
| Embedded Memory Bits | 608,256 bits |
| Embedded Memory (Kbits) | 594 Kbits |
| Maximum User I/Os | 328 |
| Embedded 18x18 Multipliers | 66 |
| Embedded 9x9 Multipliers | 132 |
| PLLs | 4 |
| Core Voltage | 1.2 V |
| I/O Bank Supplies | 2.5 V / 3.3 V |
| Gehäuse | 484-FBGA (F23) |
| Pitch | 1.0 mm |
| Body Size | 23 x 23 mm |
| Operating Temperature (Industrial) | -40C to +100C (junction) |
| Speed Grade | 8 |
| Montageart | Surface Mount |
| RoHS-Status | Compliant (lead-free FBGA) |
EP4CE30F23I8LN 484-fbga (f23) Pinbelegungsleitfaden
Pinbelegung für EP4CE30F23I8LN (484-fbga (f23)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CE30F23I8LN.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CE30F23I8LN ist geeignet für 6 Anwendungs: Industrial Machine Vision, Motor and Motion Control, Video Bridging and Display Processing, Low-Cost ASIC Prototyping, Communications Infrastructure (Backplane Bridging), Embedded Display Controllers.
Industrial Machine Vision
The EP4CE30F23I8LN's 28,848 logic elements and 608 Kbits of embedded memory make it well-suited to mid-resolution machine vision pipelines. The device hosts Bayer-to-RGB conversion, Sobel edge detection, and histogram accumulation in a single fabric at 60-120 MHz pixel clock, while the 4 PLLs generate independent clock domains for camera sensor, memory interface, and Ethernet MAC. Compared with microcontrollers, the FPGA parallelizes pixel processing, and compared with DSPs, the F23 484-FBGA package exposes enough I/O (328 user pins) to drive parallel image sensors and LVDS displays simultaneously.
Empfohlen
Motor and Motion Control
The EP4CE30F23I8LN provides deterministic logic for multi-axis servo and stepper motor control, where its 66 embedded 18x18 multipliers accelerate Field-Oriented Control (FOC) Clarke/Park transforms and PID loop math. Industrial temperature grade (-40C to +100C junction) ensures reliable operation in cabinet environments, while the 328 user I/Os drive multiple encoder inputs, PWM outputs, and gate-driver enable signals without external logic. The F23 484-FBGA package offers the pin density needed for 6-axis systems with redundancy, and the 4 PLLs synchronize ADC sampling to PWM switching.
Empfohlen
Video Bridging and Display Processing
Video bridging designs use the EP4CE30F23I8LN to convert between DVI, HDMI, LVDS, MIPI CSI-2, and RGB parallel interfaces, where the fabric performs color-space conversion and frame-rate scaling. The DDR2 memory controller supports frame-buffer line-store operation, while the 132 9x9 multipliers handle bilinear scaling coefficients in real time. Compared with ASSPs, this FPGA adapts to custom timing requirements, and the F23 484-FBGA's 328 I/Os accept 24-bit RGB plus sync, clock, and auxiliary control signals without external muxing.
Empfohlen
Low-Cost ASIC Prototyping
For ASIC prototyping the EP4CE30F23I8LN offers a 28,848-LE fabric sufficient for partitioning and verifying mid-complexity ASIC RTL before tape-out. The Quartus Prime software flow supports ASIC-style synthesis constraints, and the F23 484-FBGA exposes JTAG, configuration, and clock pins identically to production Intel devices. Compared with emulation-grade FPGAs (Stratix), the Cyclone IV E cuts prototyping cost by 5-10x while still validating I/O protocols and memory controllers.
Empfohlen
Communications Infrastructure (Backplane Bridging)
Backplane bridging designs use the EP4CE30F23I8LN to translate between serial protocols (SFP, UART, SPI, I2C) and parallel buses, providing protocol-aware buffering in the 608 Kbits embedded memory. The 4 PLLs enable independent clock domains per link, and the 328 user I/Os support multi-drop parallel backplanes. Industrial temperature grade ensures reliable operation in telecom cabinets; the F23 484-FBGA's 1.0mm pitch simplifies thermal management with copper pours underneath.
Empfohlen
Embedded Display Controllers
The EP4CE30F23I8LN drives TFT LCD panels up to XGA resolution by generating HSYNC/VSYNC/DE timing, performing color-depth reduction, and overlaying on-screen graphics stored in the 608 Kbits embedded block RAM. Compared with fixed-function display controllers, the FPGA supports custom gamma curves and touch-screen arbitration. The F23 484-FBGA's 328 I/Os connect directly to 24-bit RGB panels without external drivers, and the 4 PLLs derive pixel clocks from any system reference.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CE30F23I8LN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CE30F23I7N | EP4CE30F23C8N | EP4CE30F29I7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Speed Grade | 8 | 7 (faster) | 8 (same) | 7 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Commercial (0C to +85C) | Industrial (same) |
| Logic Elements | 28,848 | 28,848 | 28,848 | 28,848 |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
| Embedded Multipliers (18x18) | 66 | 66 | 66 | 66 |
| PLLs | 4 | 4 | 4 | 4 |
| Maximum User I/Os | 328 | 328 | 328 | 328 |
Wichtigste Unterscheidungsmerkmale
- Faster speed grade with identical footprint (vs. EP4CE30F23I7N)
- Industrial temperature range (vs. EP4CE30F23C8N)
- Mid-density Cyclone IV E with abundant multipliers (vs. EP4CE6F17C8N)
Designhinweise
Estimated: The 484-FBGA F23 package uses a 1.0 mm ball pitch. A 4-layer PCB with 0.2 mm via diameter supports via-in-pad assembly, but dog-bone fanout is generally more reliable on standard stack-ups. Plan for at least 6 layers if you need to route both high-speed differential pairs and DDR2 memory buses on the same board. Confirm with your assembly house whether they accept via-in-pad with filled/capped vias.
Cyclone IV E FPGAs have low static power, but dynamic power scales with toggle rate and clock frequency. Estimated: at 100% toggle rate on all 28,848 LEs at 200 MHz, junction temperature can rise 15-25C above ambient with no thermal relief. For fan-less enclosures, use a center thermal pad on the package and connect it to an inner copper pour with thermal vias to spread heat.
The EP4CE30F23I8LN requires three power rails: VCCINT 1.2V, VCCIO 2.5V or 3.3V per bank, and VCCAUX 2.5V. Place 0.1uF + 10uF decoupling within 5 mm of each supply pin pair. Use a sequencing controller if your system requires VCCIO to ramp before VCCINT, or vice versa, to avoid latch-up during power-up.
Configuration mode pin (MSEL[3:0]) must match the desired configuration scheme (AS, PS, JTAG, Fast Passive Parallel). A misconfigured MSEL results in the FPGA appearing 'dead' after power-up even though power and JTAG are correct. Also, do not leave the nCONFIG pin floating during operation - tie it to VCCIO through a 10k resistor for proper reset behavior.
Compliance-Informationen
RoHS-compliant lead-free FBGA package per Altera/Intel product page. Not AEC-Q100 qualified (FPGA is not an automotive discrete). Halogen-free status not explicitly stated in retrieved web data.
