EP4CE30F23I8LN - Cyclone IV E FPGA, 28.8K LEs, 484-FBGA | Intel
Référence : EP4CE30F23I8LN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.4 | $724,00 |
| 100 | $64.9 | $6 490,00 |
| 500 | $58.2 | $29 100,00 |
| 1 000 | $52.1 | $52 100,00 |
EP4CE30F23I8LN Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, interconnect, and I/O cells that can be re-programmed at the hardware level after manufacturing. Within the broader silicon taxonomy, FPGAs belong to programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Cyclone IV E sits in the low-power, high-volume segment of Intel's FPGA portfolio, optimized for cost-sensitive applications such as industrial control, video processing, and communications infrastructure.
Key features of this device include 4 PLLs, 66 embedded 18x18 multipliers (132 9x9 multipliers), and support for external memory interfaces including DDR, DDR2, SDR, and QDRII SRAM. The device operates from a 1.2V core supply with 2.5V/3.3V I/O bank supplies. The F23 package integrates 484 balls on a 1.0mm pitch in a 23x23mm body, providing ample routing density for high-pin-count designs while remaining compatible with conventional PCB assembly.
Typical applications span industrial machine vision, motor and motion control, low-cost ASIC prototyping, video bridging and processing, and embedded display controllers. The combination of low static power (typical Cyclone IV E family), abundant logic, and a mature Quartus II / Quartus Prime toolchain makes this part attractive for long-life industrial designs.
When designing with the EP4CE30F23I8LN, ensure the PCB has a proper 4-layer or better stack-up to support 1.0mm-pitch BGA fanout. The 484-FBGA demands either via-in-pad or dog-bone fanout; verify with your assembly house. Plan I/O bank partitioning early - each bank has its own VCCIO and reference voltage, and mixing multiple I/O standards (e.g., 1.8V LVCMOS and 3.3V LVTTL) requires careful VREF planning.
This page synthesizes distributor pricing, drop-in Cyclone IV E family alternatives in the same 484-FBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP4CE30F23I8LN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CE30F23I8LN (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Logic Elements, RoHS Status, Configuration Modes.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CE30F23I7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP4CE30F23C8N
✅ Remplacement direct✓ En stock
$22.4 / unité
Voir la fiche technique →EP4CE30F23I8LN
✅ Remplacement direct✓ En stock
$52.1 / unité
Voir la fiche technique →EP4CE30F29I7N
✅ Remplacement direct✓ En stock
$47.85 / unité
Voir la fiche technique →EP4CE30F23I8LN Valeurs maximales et caractéristiques électriques
| Family | Cyclone IV E |
| Logic Elements | 28,848 |
| Configurable Logic Blocks (CLBs) | 1803 |
| Embedded Memory Bits | 608,256 bits |
| Embedded Memory (Kbits) | 594 Kbits |
| Maximum User I/Os | 328 |
| Embedded 18x18 Multipliers | 66 |
| Embedded 9x9 Multipliers | 132 |
| PLLs | 4 |
| Core Voltage | 1.2 V |
| I/O Bank Supplies | 2.5 V / 3.3 V |
| Boîtier | 484-FBGA (F23) |
| Pitch | 1.0 mm |
| Body Size | 23 x 23 mm |
| Operating Temperature (Industrial) | -40C to +100C (junction) |
| Speed Grade | 8 |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (lead-free FBGA) |
Guide de configuration des broches du EP4CE30F23I8LN 484-fbga (f23)
Configuration des broches du EP4CE30F23I8LN (boîtier 484-fbga (f23)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CE30F23I8LN.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CE30F23I8LN convient pour 6 applications: Industrial Machine Vision, Motor and Motion Control, Video Bridging and Display Processing, Low-Cost ASIC Prototyping, Communications Infrastructure (Backplane Bridging), Embedded Display Controllers.
Industrial Machine Vision
The EP4CE30F23I8LN's 28,848 logic elements and 608 Kbits of embedded memory make it well-suited to mid-resolution machine vision pipelines. The device hosts Bayer-to-RGB conversion, Sobel edge detection, and histogram accumulation in a single fabric at 60-120 MHz pixel clock, while the 4 PLLs generate independent clock domains for camera sensor, memory interface, and Ethernet MAC. Compared with microcontrollers, the FPGA parallelizes pixel processing, and compared with DSPs, the F23 484-FBGA package exposes enough I/O (328 user pins) to drive parallel image sensors and LVDS displays simultaneously.
Recommandé
Motor and Motion Control
The EP4CE30F23I8LN provides deterministic logic for multi-axis servo and stepper motor control, where its 66 embedded 18x18 multipliers accelerate Field-Oriented Control (FOC) Clarke/Park transforms and PID loop math. Industrial temperature grade (-40C to +100C junction) ensures reliable operation in cabinet environments, while the 328 user I/Os drive multiple encoder inputs, PWM outputs, and gate-driver enable signals without external logic. The F23 484-FBGA package offers the pin density needed for 6-axis systems with redundancy, and the 4 PLLs synchronize ADC sampling to PWM switching.
Recommandé
Video Bridging and Display Processing
Video bridging designs use the EP4CE30F23I8LN to convert between DVI, HDMI, LVDS, MIPI CSI-2, and RGB parallel interfaces, where the fabric performs color-space conversion and frame-rate scaling. The DDR2 memory controller supports frame-buffer line-store operation, while the 132 9x9 multipliers handle bilinear scaling coefficients in real time. Compared with ASSPs, this FPGA adapts to custom timing requirements, and the F23 484-FBGA's 328 I/Os accept 24-bit RGB plus sync, clock, and auxiliary control signals without external muxing.
Recommandé
Low-Cost ASIC Prototyping
For ASIC prototyping the EP4CE30F23I8LN offers a 28,848-LE fabric sufficient for partitioning and verifying mid-complexity ASIC RTL before tape-out. The Quartus Prime software flow supports ASIC-style synthesis constraints, and the F23 484-FBGA exposes JTAG, configuration, and clock pins identically to production Intel devices. Compared with emulation-grade FPGAs (Stratix), the Cyclone IV E cuts prototyping cost by 5-10x while still validating I/O protocols and memory controllers.
Recommandé
Communications Infrastructure (Backplane Bridging)
Backplane bridging designs use the EP4CE30F23I8LN to translate between serial protocols (SFP, UART, SPI, I2C) and parallel buses, providing protocol-aware buffering in the 608 Kbits embedded memory. The 4 PLLs enable independent clock domains per link, and the 328 user I/Os support multi-drop parallel backplanes. Industrial temperature grade ensures reliable operation in telecom cabinets; the F23 484-FBGA's 1.0mm pitch simplifies thermal management with copper pours underneath.
Recommandé
Embedded Display Controllers
The EP4CE30F23I8LN drives TFT LCD panels up to XGA resolution by generating HSYNC/VSYNC/DE timing, performing color-depth reduction, and overlaying on-screen graphics stored in the 608 Kbits embedded block RAM. Compared with fixed-function display controllers, the FPGA supports custom gamma curves and touch-screen arbitration. The F23 484-FBGA's 328 I/Os connect directly to 24-bit RGB panels without external drivers, and the 4 PLLs derive pixel clocks from any system reference.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CE30F23I8LN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CE30F23I7N | EP4CE30F23C8N | EP4CE30F29I7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Speed Grade | 8 | 7 (faster) | 8 (same) | 7 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Commercial (0C to +85C) | Industrial (same) |
| Logic Elements | 28,848 | 28,848 | 28,848 | 28,848 |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
| Embedded Multipliers (18x18) | 66 | 66 | 66 | 66 |
| PLLs | 4 | 4 | 4 | 4 |
| Maximum User I/Os | 328 | 328 | 328 | 328 |
Principaux différenciateurs
- Faster speed grade with identical footprint (vs EP4CE30F23I7N)
- Industrial temperature range (vs EP4CE30F23C8N)
- Mid-density Cyclone IV E with abundant multipliers (vs EP4CE6F17C8N)
Notes de conception
Estimated: The 484-FBGA F23 package uses a 1.0 mm ball pitch. A 4-layer PCB with 0.2 mm via diameter supports via-in-pad assembly, but dog-bone fanout is generally more reliable on standard stack-ups. Plan for at least 6 layers if you need to route both high-speed differential pairs and DDR2 memory buses on the same board. Confirm with your assembly house whether they accept via-in-pad with filled/capped vias.
Cyclone IV E FPGAs have low static power, but dynamic power scales with toggle rate and clock frequency. Estimated: at 100% toggle rate on all 28,848 LEs at 200 MHz, junction temperature can rise 15-25C above ambient with no thermal relief. For fan-less enclosures, use a center thermal pad on the package and connect it to an inner copper pour with thermal vias to spread heat.
The EP4CE30F23I8LN requires three power rails: VCCINT 1.2V, VCCIO 2.5V or 3.3V per bank, and VCCAUX 2.5V. Place 0.1uF + 10uF decoupling within 5 mm of each supply pin pair. Use a sequencing controller if your system requires VCCIO to ramp before VCCINT, or vice versa, to avoid latch-up during power-up.
Configuration mode pin (MSEL[3:0]) must match the desired configuration scheme (AS, PS, JTAG, Fast Passive Parallel). A misconfigured MSEL results in the FPGA appearing 'dead' after power-up even though power and JTAG are correct. Also, do not leave the nCONFIG pin floating during operation - tie it to VCCIO through a 10k resistor for proper reset behavior.
Informations de conformité
RoHS-compliant lead-free FBGA package per Altera/Intel product page. Not AEC-Q100 qualified (FPGA is not an automotive discrete). Halogen-free status not explicitly stated in retrieved web data.
