EP4CE30F23I8LN - Cyclone IV E FPGA, 28.8K LEs, 484-FBGA | Intel
MPN: EP4CE30F23I8LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.4 | $724.00 |
| 100 | $64.9 | $6,490.00 |
| 500 | $58.2 | $29,100.00 |
| 1,000 | $52.1 | $52,100.00 |
EP4CE30F23I8LN Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, interconnect, and I/O cells that can be re-programmed at the hardware level after manufacturing. Within the broader silicon taxonomy, FPGAs belong to programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Cyclone IV E sits in the low-power, high-volume segment of Intel's FPGA portfolio, optimized for cost-sensitive applications such as industrial control, video processing, and communications infrastructure.
Key features of this device include 4 PLLs, 66 embedded 18x18 multipliers (132 9x9 multipliers), and support for external memory interfaces including DDR, DDR2, SDR, and QDRII SRAM. The device operates from a 1.2V core supply with 2.5V/3.3V I/O bank supplies. The F23 package integrates 484 balls on a 1.0mm pitch in a 23x23mm body, providing ample routing density for high-pin-count designs while remaining compatible with conventional PCB assembly.
Typical applications span industrial machine vision, motor and motion control, low-cost ASIC prototyping, video bridging and processing, and embedded display controllers. The combination of low static power (typical Cyclone IV E family), abundant logic, and a mature Quartus II / Quartus Prime toolchain makes this part attractive for long-life industrial designs.
When designing with the EP4CE30F23I8LN, ensure the PCB has a proper 4-layer or better stack-up to support 1.0mm-pitch BGA fanout. The 484-FBGA demands either via-in-pad or dog-bone fanout; verify with your assembly house. Plan I/O bank partitioning early - each bank has its own VCCIO and reference voltage, and mixing multiple I/O standards (e.g., 1.8V LVCMOS and 3.3V LVTTL) requires careful VREF planning.
This page synthesizes distributor pricing, drop-in Cyclone IV E family alternatives in the same 484-FBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CE30F23I8LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE30F23I8LN (same form factor and footprint) — differing in Package, Speed Grade, Logic Elements, RoHS Status, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE30F23I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE30F23C8N
✅ Drop-In✓ In Stock
$22.4 / Unit
View Datasheet →EP4CE30F23I8LN
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP4CE30F29I7N
✅ Drop-In✓ In Stock
$47.85 / Unit
View Datasheet →EP4CE30F23I8LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 28,848 |
| Configurable Logic Blocks (CLBs) | 1803 |
| Embedded Memory Bits | 608,256 bits |
| Embedded Memory (Kbits) | 594 Kbits |
| Maximum User I/Os | 328 |
| Embedded 18x18 Multipliers | 66 |
| Embedded 9x9 Multipliers | 132 |
| PLLs | 4 |
| Core Voltage | 1.2 V |
| I/O Bank Supplies | 2.5 V / 3.3 V |
| Package | 484-FBGA (F23) |
| Pitch | 1.0 mm |
| Body Size | 23 x 23 mm |
| Operating Temperature (Industrial) | -40C to +100C (junction) |
| Speed Grade | 8 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (lead-free FBGA) |
EP4CE30F23I8LN 484-fbga (f23) Pin Configuration Guide
Pin configuration for EP4CE30F23I8LN (484-fbga (f23) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE30F23I8LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE30F23I8LN is suitable for 6 applications: Industrial Machine Vision, Motor and Motion Control, Video Bridging and Display Processing, Low-Cost ASIC Prototyping, Communications Infrastructure (Backplane Bridging), Embedded Display Controllers.
Industrial Machine Vision
The EP4CE30F23I8LN's 28,848 logic elements and 608 Kbits of embedded memory make it well-suited to mid-resolution machine vision pipelines. The device hosts Bayer-to-RGB conversion, Sobel edge detection, and histogram accumulation in a single fabric at 60-120 MHz pixel clock, while the 4 PLLs generate independent clock domains for camera sensor, memory interface, and Ethernet MAC. Compared with microcontrollers, the FPGA parallelizes pixel processing, and compared with DSPs, the F23 484-FBGA package exposes enough I/O (328 user pins) to drive parallel image sensors and LVDS displays simultaneously.
Recommended
Motor and Motion Control
The EP4CE30F23I8LN provides deterministic logic for multi-axis servo and stepper motor control, where its 66 embedded 18x18 multipliers accelerate Field-Oriented Control (FOC) Clarke/Park transforms and PID loop math. Industrial temperature grade (-40C to +100C junction) ensures reliable operation in cabinet environments, while the 328 user I/Os drive multiple encoder inputs, PWM outputs, and gate-driver enable signals without external logic. The F23 484-FBGA package offers the pin density needed for 6-axis systems with redundancy, and the 4 PLLs synchronize ADC sampling to PWM switching.
Recommended
Video Bridging and Display Processing
Video bridging designs use the EP4CE30F23I8LN to convert between DVI, HDMI, LVDS, MIPI CSI-2, and RGB parallel interfaces, where the fabric performs color-space conversion and frame-rate scaling. The DDR2 memory controller supports frame-buffer line-store operation, while the 132 9x9 multipliers handle bilinear scaling coefficients in real time. Compared with ASSPs, this FPGA adapts to custom timing requirements, and the F23 484-FBGA's 328 I/Os accept 24-bit RGB plus sync, clock, and auxiliary control signals without external muxing.
Recommended
Low-Cost ASIC Prototyping
For ASIC prototyping the EP4CE30F23I8LN offers a 28,848-LE fabric sufficient for partitioning and verifying mid-complexity ASIC RTL before tape-out. The Quartus Prime software flow supports ASIC-style synthesis constraints, and the F23 484-FBGA exposes JTAG, configuration, and clock pins identically to production Intel devices. Compared with emulation-grade FPGAs (Stratix), the Cyclone IV E cuts prototyping cost by 5-10x while still validating I/O protocols and memory controllers.
Recommended
Communications Infrastructure (Backplane Bridging)
Backplane bridging designs use the EP4CE30F23I8LN to translate between serial protocols (SFP, UART, SPI, I2C) and parallel buses, providing protocol-aware buffering in the 608 Kbits embedded memory. The 4 PLLs enable independent clock domains per link, and the 328 user I/Os support multi-drop parallel backplanes. Industrial temperature grade ensures reliable operation in telecom cabinets; the F23 484-FBGA's 1.0mm pitch simplifies thermal management with copper pours underneath.
Recommended
Embedded Display Controllers
The EP4CE30F23I8LN drives TFT LCD panels up to XGA resolution by generating HSYNC/VSYNC/DE timing, performing color-depth reduction, and overlaying on-screen graphics stored in the 608 Kbits embedded block RAM. Compared with fixed-function display controllers, the FPGA supports custom gamma curves and touch-screen arbitration. The F23 484-FBGA's 328 I/Os connect directly to 24-bit RGB panels without external drivers, and the 4 PLLs derive pixel clocks from any system reference.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE30F23I8LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE30F23I7N | EP4CE30F23C8N | EP4CE30F29I7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Speed Grade | 8 | 7 (faster) | 8 (same) | 7 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Commercial (0C to +85C) | Industrial (same) |
| Logic Elements | 28,848 | 28,848 | 28,848 | 28,848 |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
| Embedded Multipliers (18x18) | 66 | 66 | 66 | 66 |
| PLLs | 4 | 4 | 4 | 4 |
| Maximum User I/Os | 328 | 328 | 328 | 328 |
Key Differentiators
- Faster speed grade with identical footprint (vs EP4CE30F23I7N)
- Industrial temperature range (vs EP4CE30F23C8N)
- Mid-density Cyclone IV E with abundant multipliers (vs EP4CE6F17C8N)
Design Notes
Estimated: The 484-FBGA F23 package uses a 1.0 mm ball pitch. A 4-layer PCB with 0.2 mm via diameter supports via-in-pad assembly, but dog-bone fanout is generally more reliable on standard stack-ups. Plan for at least 6 layers if you need to route both high-speed differential pairs and DDR2 memory buses on the same board. Confirm with your assembly house whether they accept via-in-pad with filled/capped vias.
Cyclone IV E FPGAs have low static power, but dynamic power scales with toggle rate and clock frequency. Estimated: at 100% toggle rate on all 28,848 LEs at 200 MHz, junction temperature can rise 15-25C above ambient with no thermal relief. For fan-less enclosures, use a center thermal pad on the package and connect it to an inner copper pour with thermal vias to spread heat.
The EP4CE30F23I8LN requires three power rails: VCCINT 1.2V, VCCIO 2.5V or 3.3V per bank, and VCCAUX 2.5V. Place 0.1uF + 10uF decoupling within 5 mm of each supply pin pair. Use a sequencing controller if your system requires VCCIO to ramp before VCCINT, or vice versa, to avoid latch-up during power-up.
Configuration mode pin (MSEL[3:0]) must match the desired configuration scheme (AS, PS, JTAG, Fast Passive Parallel). A misconfigured MSEL results in the FPGA appearing 'dead' after power-up even though power and JTAG are correct. Also, do not leave the nCONFIG pin floating during operation - tie it to VCCIO through a 10k resistor for proper reset behavior.
Compliance Information
RoHS-compliant lead-free FBGA package per Altera/Intel product page. Not AEC-Q100 qualified (FPGA is not an automotive discrete). Halogen-free status not explicitly stated in retrieved web data.
