EP4CE6F17C6 - Cyclone IV E FPGA 6K LEs 256-FBGA | Intel
Teilenummer: EP4CE6F17C6 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $19.85 | $198,50 |
| 100 | $16.4 | $1.640,00 |
| 500 | $13.95 | $6.975,00 |
| 1.000 | $12.1 | $12.100,00 |
EP4CE6F17C6 Übersicht
An FPGA (field-programmable gate array) is a class of programmable logic device that lets engineers implement arbitrary digital logic through a configuration bitstream loaded into on-chip SRAM. Within the broader semiconductor taxonomy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as reconfigurable digital ICs used for glue logic, protocol bridging, image processing, and parallel DSP. The Cyclone IV E family specifically targets low total cost of ownership through die-size optimization, integrated transceivers-free architecture, and free Quartus Prime Lite development tools.
Key features of the EP4CE6F17C6 include 15 embedded 18x18 multipliers supporting DSP functions up to ~148 MHz, two PLLs providing robust clock management, and Nios II soft-core processor compatibility for embedded control. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards across eight I/O banks with per-bank reference voltages, enabling direct interface to DDR/DDR2 SDRAM, QDR II SRAM, and standard parallel buses.
Architecturally, the Cyclone IV E fabric uses a 4-input LUT-based logic element with adjacent register, 9-Kbit M9K memory blocks, and dedicated multiplier/adder chains. The 60 nm process node balances static leakage and dynamic power, and Quartus PowerPlay estimates typical core consumption below 200 mW for representative designs. This combination suits high-volume cost-driven applications requiring deterministic logic and parallel processing.
Typical applications include industrial motor control, video bridging and image aggregation, factory automation I/O expansion, low-cost software-defined radio (SDR) front ends, LED display controllers, and educational/developer platforms. The 256-FBGA 17x17 mm 1.0 mm pitch package is compatible with mainstream PCB assembly lines.
When designing with this FPGA, plan power sequencing on VCCINT (1.2 V core) and VCCA (2.5 V PLL analog) before VCCIO banks come up, otherwise latch-up can occur. Use at least four PCB decoupling layers and a 4-layer stack-up to keep the PLL supplies quiet.
This page synthesizes distributor pricing, drop-in alternatives across the Cyclone IV E family, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für EP4CE6F17C6 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4CE6F17C6 (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Mounting Type, Process Technology, Embedded Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4CE6F17C7
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$17.49 / Stück
Datenblatt ansehen →EP4CE6F17C8N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$13.75 / Stück
Datenblatt ansehen →EP4CE6F17I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$15.1 / Stück
Datenblatt ansehen →EP4CE10F17C8N
✅ Drop-In✓ Auf Lager
$17.95 / Stück
Datenblatt ansehen →EP4CE10F17C6
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP4CE6F17C6 Grenzwerte & elektrische Eigenschaften
| Family | Cyclone IV E |
| Logic Elements (LE) | 6,272 |
| Configurable Logic Blocks (CLB) | 392 |
| Embedded Memory | 276,480 bits |
| Embedded 18x18 Multipliers | 15 |
| PLLs | 2 |
| Maximum User I/O | 179 |
| Gehäuse | 256-FBGA 17x17 mm, 1.0 mm pitch |
| Speed Grade | C6 (commercial) |
| Betriebs-Sperrschichttemperatur | 0°C to 85°C |
| Core Voltage VCCINT | 1.2 V (typical) |
| Process Node | 60 nm low-power |
| I/O Banks | 8 |
| Memory Blocks | M9K (30 blocks) |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (FBGA) |
| MSL-Level | 3 (168 hours) |
EP4CE6F17C6 256-fbga 17x17 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP4CE6F17C6 (256-fbga 17x17 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CE6F17C6.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CE6F17C6 ist geeignet für 6 Anwendungs: Industrial Motor Control, Video Bridge and Image Aggregation, Factory Automation I/O Expansion, Software Defined Radio (SDR) Front End, LED Display and Lighting Controllers, Educational and Developer Platforms.
Industrial Motor Control
The EP4CE6F17C6 fits industrial motor control because its 15 embedded 18x18 multipliers execute field-oriented control (FOC) math, Clarke/Park transforms, and space-vector PWM modulators with deterministic latency. Its two PLLs generate the high-resolution PWM carriers and quadrature-encoder sample clocks needed for closed-loop current and position loops on BLDC and PMSM motors. The 179 user I/Os handle 3-phase gate drivers, Hall/encoder feedback, and isolated comm buses. Compared with microcontrollers, the FPGA parallelises the control loop and ADC post-processing for higher switching frequencies. Engineers typically pair this device with external gate drivers and isolated current shunts for 1-5 kW drives. The 256-FBGA F17 footprint and 0-85C junction range support compact industrial inverter PCBs.
Empfohlen
Video Bridge and Image Aggregation
The EP4CE6F17C6 is well-matched to video format conversion, image aggregation, and LCD/LVDS panel bridging because its 179 LVDS-capable I/Os can directly drive or receive high-speed parallel video at up to several hundred MHz. The 276 Kbit embedded M9K memory serves as line buffers and color-space conversion FIFOs, while the 15 DSP blocks accelerate image scaling, gamma correction, and chroma keying operations. Compared with discrete video ASSPs, this FPGA gives designers freedom to support multiple input/output formats (RGB, YCbCr, MIPI-CSI via soft IP) on one BOM. Reference designs from Intel demonstrate 720p60 aggregation on this device family. The 1.0 mm pitch FBGA is suitable for HDMI-to-LVDS bridges and multi-camera surveillance recorders.
Empfohlen
Factory Automation I/O Expansion
The EP4CE6F17C6 is widely deployed as a programmable logic controller (PLC) I/O expander and protocol bridge in factory automation because it can aggregate dozens of digital inputs, quadrature counters, and serial field-bus interfaces while translating between industrial protocols. The eight I/O banks with per-bank VCCIO allow direct interfacing to 3.3 V, 2.5 V, and 1.8 V peripherals without level shifters. Its two PLLs generate isolated timing domains for Profibus, RS-485, CAN, and EtherCAT soft-IP implementations. Compared with discrete glue logic, this FPGA reduces BOM and board area while adding firmware-defined flexibility. Typical use cases include robotic arm controllers, conveyor sorters, and CNC machine I/O hubs running 24V industrial buses.
Empfohlen
Software Defined Radio (SDR) Front End
The EP4CE6F17C6 suits entry-level SDR front ends because its 15 DSP blocks run FIR filters, FFTs, and DDC/DUC chains at baseband sample rates up to ~80 MSPS. The high-speed LVDS I/Os interface directly to ADC and DAC converters such as the AD9226 or AD9707, while the embedded M9K memory blocks store FFT windows and overlap-save buffers. The two PLLs derive clean ADC sampling clocks and DAC interpolation clocks from a single external reference. Compared with discrete DSPs, the FPGA offers parallel processing for multi-channel or wide-bandwidth SDR designs. Engineers use this device for ham radio transceivers, signal intelligence prototypes, and academic teaching platforms.
Empfohlen
LED Display and Lighting Controllers
The EP4CE6F17C6 is a strong fit for large LED video walls and architectural lighting controllers because its 179 user I/Os can drive hundreds of PWM channels in parallel through external LED drivers. The 15 embedded multipliers compute per-pixel gamma correction and color-temperature mixing in real time, and the two PLLs generate the high-multiplex-rate clocks required for refresh without flicker. Compared with microcontroller-based LED drivers, the FPGA can scan thousands of LEDs per panel with deterministic timing. Typical deployments include stadium perimeter displays, retail digital signage, and stage lighting consoles.
Empfohlen
Educational and Developer Platforms
The EP4CE6F17C6 is popular in university FPGA courses and open-source developer boards because its 6,272 LEs offer enough capacity to teach processor design (Nios II soft core), DSP concepts, and hardware description languages without overwhelming students. The free Quartus Prime Lite toolchain fully supports this device, and the 256-FBGA package is exposed on common DE0-Nano and Cyclone IV GX starter boards. Compared with smaller FPGAs, this part provides meaningful logic and memory headroom for capstone projects involving RISC-V cores, custom peripherals, and HDMI passthrough. Educational labs use it for digital logic, computer architecture, and embedded systems courses.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CE6F17C6 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CE6F17C7 | EP4CE6F17C8N | EP4CE6F17I7N | EP4CE10F17C8N | EP4CE10F17C6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (F17) 17x17 mm | 256-FBGA (F17) 17x17 mm - same | 256-FBGA (F17) 17x17 mm - same | 256-FBGA (F17) 17x17 mm - same | 256-FBGA (F17) 17x17 mm - same | 256-FBGA (F17) 17x17 mm - same |
| Logic Elements (LE) | 6,272 | 6,272 | 6,272 | 6,272 | 10,320 | 10,320 |
| Speed Grade | C6 (commercial) | C7 (faster) | C8 (fastest) | I7 (industrial temp) | C8 (faster) | C6 (commercial) |
| Embedded Memory | 276,480 bits | 276,480 bits | 276,480 bits | 276,480 bits | 423,936 bits | 423,936 bits |
| 18x18 Multipliers | 15 | 15 | 15 | 15 | 23 | 23 |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 |
| Maximum User I/O | 179 | 179 | 179 | 179 | 179 | 179 |
| Operating Temperature | 0°C to 85°C (commercial) | 0°C to 85°C (commercial) | 0°C to 85°C (commercial) | -40°C to 100°C (industrial) | 0°C to 85°C (commercial) | 0°C to 85°C (commercial) |
Wichtigste Unterscheidungsmerkmale
- Direct 256-FBGA F17 drop-in headroom to 10K-LE device (vs. EP4CE10F17C8N)
- Cost-optimized 6K-LE density with full Cyclone IV E feature set (vs. EP4CE10F17C6)
- Industrial-temperature variant available in same footprint (vs. EP4CE6F17I7N)
Designhinweise
Power sequencing is critical for Cyclone IV E devices. Apply VCCINT (1.2 V core) and VCCA (2.5 V PLL analog) first or simultaneously, then ramp VCCIO banks. Reverse sequencing or simultaneous ramp without proper monotonicity can trigger latch-up and permanently damage the device. Intel recommends using a multi-rail power management IC such as the LTC3566 or EN5339 with Power-On-Reset sequencing. Decouple each VCC pin with a 0.1 µF and 10 µF capacitor pair placed within 5 mm of the ball, and keep the VCCA trace short and isolated from digital switching currents.
The 256-FBGA F17 package uses 1.0 mm ball pitch, requiring 4-layer minimum PCB stack-up with microvia or 0.4 mm via-in-pad for inner-row ball breakout. Plan at least 4 PCB layers: signal on top and bottom, two internal solid ground and power planes. Use Intel's Cyclone IV E pin connection guidelines to escape the inner balls. Matched-length routing on high-speed LVDS pairs is required for >400 Mbps interfaces; expect to use serpentine tuning on the inner-layer routing. The 17x17 mm package footprint leaves adequate room for thermal vias under the die for moderate-power designs.
Three common pitfalls: (1) Leaving JTAG TCK floating - tie to GND through 10 kΩ if unused. (2) Driving configuration DONE pin before the configuration bitstream finishes - add 4.7 kΩ pull-up to VCCIO of the CONF bank. (3) Exceeding absolute maximum I/O voltage on a bank when 3.3 V peripherals are connected to a bank set to 2.5 V VCCIO - per-bank voltage selection must match all signals on that bank. Estimated: typical quiescent current for EP4CE6 is 50-150 mA core + I/O bank contribution; verify with PowerPlay early in design.
Compliance-Informationen
RoHS and REACH compliance per Intel/Altera product declaration. Not AEC-Q100 qualified - choose automotive-grade Cyclone IV variants for automotive applications. Lead-free finish on FBGA balls per JEDEC J-STD-020.
