EP4CE6F17C6 vs EP4CE6F17C8 Vergleich
Detaillierter Direktvergleich von EP4CE6F17C6 von Intel und EP4CE6F17C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6F17C6 | EP4CE6F17C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,10 | $19,85 |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 6,272 | — |
| Configurable Logic Blocks (CLB) | 392 | — |
| Embedded Memory | 276,480 bits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 2 | 2 |
| Maximum User I/O | 179 | — |
| Gehäuse | 256-FBGA 17x17 mm, 1.0 mm pitch | 256-ball FBGA (F17), 1.0 mm pitch, 17 x 17 mm |
| Speed Grade | C6 (commercial) | C8 |
| Betriebs-Sperrschichttemperatur | 0°C to 85°C | — |
| Core Voltage VCCINT | 1.2 V (typical) | — |
| Process Node | 60 nm low-power | — |
| I/O Banks | 8 | — |
| Memory Blocks | M9K (30 blocks) | — |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (FBGA) | — |
| MSL-Level | 3 (168 hours) | — |
| Device Family | — | Cyclone IV E |
| Logic Elements (LEs) | — | 6,272 |
| Logic Array Blocks (LABs) | — | 392 |
| Embedded Memory Bits | — | 276,480 |
| M9K Memory Blocks | — | 30 |
| Embedded 18 x 18 Multipliers | — | 15 |
| Global Clock Networks | — | 10 |
| Maximum User I/Os | — | 179 |
| Process Technology | — | 60 nm low-power SRAM |
| Core Supply Voltage | — | 1.0 V to 1.2 V |
| Betriebstemperatur | — | 0 C to 85 C (commercial, C8 speed grade) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |