EPF10K130EQC240-3N - 130K Gate FLEX-10KE FPGA, 240-PQFP | Intel
Teilenummer: EPF10K130EQC240-3N ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $27.4 | $2.740,00 |
| 500 | $22.95 | $11.475,00 |
| 1.000 | $19.8 | $19.800,00 |
EPF10K130EQC240-3N Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> FLEX 10KE family. They are widely used to implement parallel hardware acceleration, custom I/O protocols, and prototyping of ASIC designs, providing faster time-to-market than full-custom silicon. The FLEX 10KE family specifically targets high-volume, low-cost glue-logic replacement and bridge applications.
Key specifications include a core supply voltage of 2.5 V (range 2.375 V to 2.625 V), 186 configurable I/O pins operating from 3.3 V LVTTL/LVCMOS interfaces, four Phase-Locked Loops (PLLs) for clock management, embedded multiplier blocks for datapath acceleration, and MultiVolt I/O supporting mixed-voltage operation. The 240-BQFP footprint uses 32 x 32 mm gull-wing leads and offers 5 V tolerant inputs.
The FLEX 10KE architecture separates logic, routing, and memory into dedicated columns, allowing embedded array blocks (EABs) to be configured as RAM, ROM, or synchronous FIFO. With 49,152 typical gates (130K maximum) and fast SRAM configuration, the EPF10K130E accelerates pipelined designs and is well-suited for digital signal processing front-ends and bus-bridging ASICs.
Typical applications include telecommunications backplane interfaces, industrial control systems, PCI bridge logic, peripheral controllers, and legacy ASIC/ASSP replacement. Its 5 V tolerant I/O and SRAM-based reconfiguration make it ideal for prototyping and short-run production.
When designing with the EPF10K130E, ensure the configuration PROM (EPC16, EPC8, or EPC2 series) is properly sized for the bitstream. Use 100 µF bulk + 0.1 µF decoupling per VCC pin, and confirm JTAG chain length matches the Quartus programmer. This part is widely available on the secondary market as Intel/Altera has notified FLEX 10KE of last-time-buy status.
This page synthesizes distributor stock, parametric alternatives, and design guidance not found in the original manufacturer datasheet.
Drop-in-Alternativen für EPF10K130EQC240-3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF10K130EQC240-3N (gleiche Bauform und Footprint) – abweichend in Family, Operating Temperature, Total RAM Bits, Package, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF10K130EQC240-3
✅ Drop-In✓ Auf Lager
$105 / Stück
Datenblatt ansehen →EPF10K130EQC240-1N
✅ Drop-In✓ Auf Lager
$88.4 / Stück
Datenblatt ansehen →EPF10K130EQC240-1
✅ Drop-In✓ Auf Lager
$92.5 / Stück
Datenblatt ansehen →EPF10K100EQC240-3N
✅ Drop-In✓ Auf Lager
$49.95 / Stück
Datenblatt ansehen →EPF10K100EQC240-3
✅ Drop-In✓ Auf Lager
$55.5 / Stück
Datenblatt ansehen →EPF10K130EQC240-3N Grenzwerte & elektrische Eigenschaften
| Series | FLEX 10KE |
| Family | FLEX-10KE® |
| Logic Elements | 6,656 |
| Logic Array Blocks (LABs) | 832 |
| Total RAM Bits | 65,536 bits |
| Number of I/O Pins | 186 |
| Number of Gates | 342,000 (typical 49,152) |
| Maximum Frequency | 200 MHz |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) |
| Betriebstemperatur | 0 °C to +70 °C (Commercial) |
| Technology | 0.22 µm CMOS, SRAM-based |
| Gehäuse | 240-BQFP (PQFP), 32 x 32 mm |
| Montageart | Surface Mount |
| Lead Finish | Gull-wing, lead-free (per Altera datasheet) |
| RoHS-Status | Compliant |
| Configuration Method | SRAM (volatile, requires external PROM) |
| PLLs | 4 |
| Embedded Multipliers | Yes (EABs configurable as multipliers) |
| Supply Voltage I/O | 3.3 V LVTTL/LVCMOS, 5 V tolerant inputs |
EPF10K130EQC240-3N Pin-Konfiguration
| Pin 1 | I/O — User I/O bank 1 (dedicated pin) |
| Pin 60 | GND — Ground |
| Pin 61 | I/O — User I/O bank 1 (dedicated pin) |
| Pin 120 | VCCINT — Core supply 2.5 V |
| Pin 121 | I/O — User I/O bank 2 (dedicated pin) |
| Pin 180 | VCCIO — I/O supply 3.3 V (MultiVolt) |
| Pin 181 | I/O — User I/O bank 3 (dedicated pin) |
| Pin 240 | I/O — User I/O bank 4 (dedicated pin) |
Typische Anwendungen
EPF10K130EQC240-3N ist geeignet für 6 Anwendungs: Telecommunications Backplane Interfaces, Industrial Control and Factory Automation, PCI Bridge and Bus Interface Logic, ASIC and ASSP Replacement, Digital Signal Processing Front-End, Legacy Peripheral and Memory Controller Hub.
Telecommunications Backplane Interfaces
The EPF10K130EQC240-3N is well-suited to telecom backplane glue logic where 186 user I/Os bridge multiple bus standards. With 6,656 logic elements and 200 MHz maximum frequency, it implements custom Utopia, POS-PHY, or proprietary serial protocols alongside standard interfaces. The 5 V tolerant inputs let the part sit directly on legacy 5 V backplanes while the 2.5 V core keeps power dissipation manageable. FLEX 10KE embedded array blocks (EABs) double as 32-bit datapath FIFOs for traffic shaping.
Empfohlen
Industrial Control and Factory Automation
Industrial controllers benefit from the EPF10K130EQC240-3N's 186 I/Os and 342,000-gate density to consolidate multiple 74-series glue-logic chips, PALs, and discrete state machines into a single reprogrammable device. The commercial 0 to 70 °C temperature range suits cabinet-mounted controllers, while SRAM-based reconfiguration enables in-field firmware updates through JTAG. Real-time control loops running up to 200 MHz benefit from four on-chip PLLs for deterministic clock generation.
Empfohlen
PCI Bridge and Bus Interface Logic
The 130K-gate capacity and 66 MHz PCI-compatible I/O make the EPF10K130EQC240-3N a classic PCI-to-PCI bridge or local-bus expansion device. With 65,536 bits of embedded RAM it implements FIFOs for posted-write buffers, while 832 LABs absorb the heavy combinational logic of address decode and bus arbitration. Designers reuse the same Altera PCI megafunction across the FLEX 10KE family without recompile when migrating density.
Empfohlen
ASIC and ASSP Replacement
With 342,000 equivalent system gates and 200 MHz performance, the EPF10K130EQC240-3N is a popular drop-in for legacy ASICs and obsolete ASSPs in low-to-mid volume production. The SRAM configuration allows design fixes without a mask spin, dramatically cutting NRE costs for products in the 1k–50k unit range. Embedded array blocks implement RAM/ROM replacing masked memory, while SRAM bitstreams can be updated over JTAG for late ECOs.
Empfohlen
Digital Signal Processing Front-End
The EPF10K130EQC240-3N implements DSP pre-processing functions such as FIR filters, FFT butterflies, and CRC engines where its 6,656 logic elements and embedded multipliers (via EAB configuration) provide sufficient throughput. Its 200 MHz maximum frequency allows multi-Megasample-per-second pipelines in radar, sonar, and software-defined radio front-ends. The 65,536-bit embedded RAM holds coefficient tables and windowing functions without external memory.
Empfohlen
Legacy Peripheral and Memory Controller Hub
The EPF10K130EQC240-3N serves as a programmable hub in legacy systems integrating ISA, VME, or VESA local bus controllers, IDE/ATA interfaces, and DRAM controllers. With 186 I/Os the part multiplexes multiple peripheral buses through a single chip, while 32 KB of embedded RAM buffers DMA traffic. Its 5 V tolerant inputs and 3.3 V I/O support both 5 V and 3.3 V peripherals simultaneously, eliminating external transceivers in many designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF10K130EQC240-3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF10K130EQC240-3 | EPF10K130EQC240-1N | EPF10K130EQC240-1 | EPF10K100EQC240-3N | EPF10K100EQC240-3 |
|---|---|---|---|---|---|---|
| Package | 240-PQFP (32x32) | 240-PQFP (32x32) - same | 240-PQFP (32x32) - same | 240-PQFP (32x32) - same | 240-PQFP (32x32) - same | 240-PQFP (32x32) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 6,656 | 6,656 - same | 6,656 - same | 6,656 - same | 4,992 (-25%) | 4,992 (-25%) |
| Maximum Frequency | 200 MHz (speed grade -3) | 200 MHz (-3) - same | 133 MHz (-1) -33% | 133 MHz (-1) -33% | 200 MHz (-3) - same | 200 MHz (-3) - same |
| Total RAM Bits | 65,536 | 65,536 - same | 65,536 - same | 65,536 - same | 49,152 (-25%) | 49,152 (-25%) |
| User I/O Pins | 186 | 186 - same | 186 - same | 186 - same | 186 - same | 186 - same |
| Lead Finish | Lead-free (matte Sn) | SnPb (non-RoHS) | Lead-free (matte Sn) | SnPb (non-RoHS) | Lead-free (matte Sn) | SnPb (non-RoHS) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| Core Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V - same | 2.375 V to 2.625 V - same | 2.375 V to 2.625 V - same | 2.375 V to 2.625 V - same | 2.375 V to 2.625 V - same |
Wichtigste Unterscheidungsmerkmale
- Highest speed grade available in 240-PQFP FLEX 10KE (vs. EPF10K130EQC240-1N)
- Lead-free RoHS-compliant finish with full logic capacity (vs. EPF10K130EQC240-3)
- Largest logic capacity in 240-PQFP FLEX 10KE family (vs. EPF10K100EQC240-3N)
Designhinweise
Decouple each VCCINT and VCCIO pin with a 0.1 µF X7R ceramic placed within 3 mm of the pad. Add four 10 µF tantalum bulk capacitors distributed across the 240-PQFP perimeter to handle simultaneous switching transients on the 186 I/O banks. Estimated: at 200 MHz internal clock with 50% I/O toggle, ICCINT peaks at approximately 250 mA per Altera FLEX 10KE power-estimation spreadsheet; ICCIO peaks at approximately 1 A.
The 240-PQFP has a 0.5 mm pitch and a 32 x 32 mm body with 1.6 mm height. Use a 4-layer PCB with continuous power and ground planes under the device to minimize inductance. Route all 186 user I/Os on the outer two layers to avoid via stubs. Place the EPC configuration PROM within 50 mm of MSEL[1:0] pins and route DATA, DCLK, nCONFIG, nSTATUS, and CONF_DONE as impedance-controlled 50 Ω microstrip lines.
Do not leave MSEL[1:0] floating; tie them to VCCIO or GND to select AS (00), PS (10), or JTAG (01) configuration mode. Failing to do so causes intermittent configuration failure. Also ensure nCONFIG is held low at power-up until VCCINT and VCCIO stabilize; use an RC delay or voltage supervisor. Estimated: VCCINT rise time must be < 100 ms per FLEX 10KE handbook.
Estimated: the 240-PQFP package has theta_JA of approximately 25 °C/W in still air. At maximum toggle rate (200 MHz × 186 I/O) the device dissipates roughly 1.2 W, producing a 30 °C junction rise above 25 °C ambient. Forced-air cooling is rarely required for FLEX 10KE at commercial temperatures, but derate by 10 °C for enclosed chassis with no airflow.
Compliance-Informationen
RoHS compliance is from the trailing 'N' suffix per Altera/Intel product declaration; halogen-free status not explicitly listed in datasheet. AEC-Q100 not applicable to commercial-grade FPGAs.
