EPF10K50VFC484-3N - 50K-Gate FLEX-10K FPGA, 484-BGA | Intel / Altera
Teilenummer: EPF10K50VFC484-3N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $31.24 | $31,24 |
| 10 | $30.1 | $301,00 |
| 100 | $28.5 | $2.850,00 |
| 500 | $26.2 | $13.100,00 |
| 1.000 | $24 | $24.000,00 |
EPF10K50VFC484-3N Übersicht
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) whose architecture consists of configurable logic blocks, programmable interconnect, and I/O cells, all controlled by on-chip SRAM configuration memory. The FLEX-10K family pioneered the embedded array block (EAB) concept, where each EAB provides 2,048 bits of dual-port RAM plus logic, enabling System-on-a-Programmable-Chip (SOPC) integration of memory, register files, and arithmetic functions alongside general-purpose logic. This positions the part within the broader hierarchy: programmable logic device -> PLD -> FPGA -> SRAM-based FPGA -> embedded-array FPGA -> power management and digital signal processing subsystems.
Key features of the EPF10K50VFC484-3N include 2,880 LEs organized in 10 Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs) supplying 24 Kbits of true dual-port RAM, 291 user I/Os with MultiVolt I/O supporting 5.0 V, 3.3 V, and 2.5 V interfacing, and a propagation delay of 0.6 ns per LE in the -3 speed grade. The 484-FBGA (23 mm × 23 mm body) uses a 1.27 mm ball pitch, suitable for production surface-mount assembly but requiring X-ray or BGA rework tools for prototyping.
The FLEX-10K architecture implements a four-input LUT-based logic element with a dedicated carry chain for fast arithmetic and a cascade chain for wide AND gates, while the EABs can be configured as RAM, ROM, or multiplier blocks. In-system configuration is supported via the passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and active serial (AS) modes, with the bitstream loaded from a serial configuration EPROM or a microcontroller. JTAG (IEEE 1149.1) boundary-scan test is built in, simplifying board-level diagnostics.
Typical applications span telecom line-card glue logic, industrial bus bridges (PCI to local bus), imaging front-ends, low-density data-path pre-processing, and legacy ASIC prototyping. Because the device uses SRAM configuration memory, it must be reconfigured at every power-up, which suits system-level flexibility over cold-start determinism.
Designers should use the legacy Altera MAX+PLUS II or Quartus II (7.2 and earlier) toolchains because newer Quartus versions have dropped FLEX-10K support. The 484-BGA requires a minimum 6-layer PCB with controlled-impedance traces and an array of GND/VCC balls forming a power/ground plane thermal path. For new designs, consider the MAX II or Cyclone IV families, but for installed-base designs the FLEX-10K remains a supported, long-lifecycle component.
Drop-in-Alternativen für EPF10K50VFC484-3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF10K50VFC484-3N (gleiche Bauform und Footprint) – abweichend in Process Technology, Operating Temperature, Speed Grade, Package, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF10K50VFC484-3
✅ Drop-In✓ Auf Lager
$95.74 / Stück
Datenblatt ansehen →EPF10K200SFC484-3N
✅ Drop-In✓ Auf Lager
$261 / Stück
Datenblatt ansehen →EPF10K130EFC484-3N
✅ Drop-In✓ Auf Lager
$109.25 / Stück
Datenblatt ansehen →EPF10K50EFC484-2
✅ Drop-In✓ Auf Lager
$52.75 / Stück
Datenblatt ansehen →EPF10K30EFC484-2
✅ Drop-In✓ Auf Lager
$175 / Stück
Datenblatt ansehen →EPF10K50SFC484-3
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →EPF10K50VFC484-3N Grenzwerte & elektrische Eigenschaften
| Family | FLEX-10K |
| Logic Elements | 2,880 |
| Typical Gates | 50,000 |
| Total RAM Bits | 40,960 |
| Embedded Array Blocks (EABs) | 12 |
| Logic Array Blocks (LABs) | 10 |
| Maximum User I/Os | 291 |
| Supply Voltage (VCCINT) | 3.0 V to 3.6 V (3.3 V nominal) |
| I/O Voltage Standards | 5.0 V, 3.3 V, 2.5 V (MultiVolt) |
| Internal Frequency | 125 MHz |
| Propagation Delay (per LE) | 0.6 ns |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Gehäuse | 484-FBGA (23 x 23 mm, 1.27 mm pitch) |
| Betriebstemperatur | 0 °C to +70 °C (commercial) |
| Configuration Modes | Passive Serial, Passive Parallel (Sync/Async), Active Serial, JTAG |
| JTAG Support | IEEE 1149.1 Boundary Scan |
| Montageart | Surface Mount (BGA) |
EPF10K50VFC484-3N 484-fbga (23 x 23 mm, 1.27 mm pitch) Pinbelegungsleitfaden
Pinbelegung für EPF10K50VFC484-3N (484-fbga (23 x 23 mm, 1.27 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF10K50VFC484-3N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF10K50VFC484-3N ist geeignet für 6 Anwendungs: Telecom Line-Card Glue Logic, Industrial Bus Bridge / Protocol Converter, Imaging Front-End Pre-Processing, Low-Density DSP / FIR Filter Implementation, Legacy ASIC / ASSP Prototyping, Avionics / Military Embedded Systems (Legacy).
Telecom Line-Card Glue Logic
The EPF10K50VFC484-3N's 291 user I/Os and 50K-gate density make it well suited to telecom line-card glue logic, where it bridges backplane buses (e.g., H.110 CT Bus, UTOPIA, POS-PHY) to framer ASICs and TDM switches. The 3.3 V core with 5 V-tolerant MultiVolt I/O eliminates external level shifters when interfacing to legacy 5 V framers, and the 12 Embedded Array Blocks deliver 24 Kbits of dual-port RAM for buffer descriptors and lookup tables. Designers typically instantiate 32-bit FIFOs, UTOPIA Level-2 interfaces, and HDLC controllers in the 2,880 LEs, achieving timing closure at 50 MHz system clocks in the -3 speed grade.
Empfohlen
Industrial Bus Bridge / Protocol Converter
The EPF10K50VFC484-3N is widely used as a PCI-to-Local-Bus bridge or a custom protocol converter (e.g., VME to PCI, ISA to PC/104) in industrial automation backplanes. Its 125 MHz internal clock and 0.6 ns LE propagation delay allow 33 MHz PCI target implementations with comfortable timing margins, while 291 I/Os absorb address/data/control signals from both bus sides plus auxiliary GPIO. The 40 Kbits of embedded RAM implement scatter-gather descriptor tables without consuming external SRAM, and JTAG boundary-scan (IEEE 1149.1) accelerates board bring-up and in-field diagnostics on production controllers.
Empfohlen
Imaging Front-End Pre-Processing
In imaging front-ends, the EPF10K50VFC484-3N serves as a pre-processing stage between CMOS image sensors and a host DSP or SoC, performing Bayer demosaicing, color correction matrix multiplication, and histogram generation in real time. The 12 EABs configured as dual-port RAM store line buffers (one row of 8-bit pixels) for 2D convolution, while the 2,880 LEs run parallel multiply-accumulate pipelines at 50-80 MHz pixel rates. The 5 V-tolerant I/O connects directly to legacy image sensor LVDS/CMOS outputs, and the 3.3 V core interfaces to modern DSPs without level translation - a clean two-rail solution for legacy embedded vision modules.
Empfohlen
Low-Density DSP / FIR Filter Implementation
The EPF10K50VFC484-3N is frequently used to implement FIR filters, correlators, and small FFT engines in DSP pre-processing subsystems. Each EAB can be configured as a 256 × 8-bit multiplier block (one of the FLEX-10K's signature features), and the dedicated carry chain in each LE enables efficient MAC (multiply-accumulate) pipelines running at 80-100 MHz. With 12 EABs and 2,880 LEs, the device typically hosts 8-16 parallel FIR taps at 50 MSPS sample rates, sufficient for audio-band and intermediate-frequency signal conditioning in software-defined radio (SDR) and instrumentation front-ends.
Empfohlen
Legacy ASIC / ASSP Prototyping
The EPF10K50VFC484-3N is a workhorse for ASIC prototyping where designers map RTL to the FPGA for hardware-software co-validation before tape-out. Its 50K-gate capacity accommodates medium-complexity ASICs (microcontroller peripherals, state-machine controllers, glue-logic-rich designs), and the SRAM-based configuration enables rapid design iterations (re-programmed in seconds via JTAG). The 291 I/Os closely match the I/O count of many production ASICs, simplifying pin-mapping between the FPGA prototype and the final silicon; engineers use MAX+PLUS II 10.23 or Quartus II ≤ 7.2 for synthesis and timing analysis.
Empfohlen
Avionics / Military Embedded Systems (Legacy)
Many long-lifecycle avionics, radar, and military embedded systems continue to use the EPF10K50VFC484-3N because of its MIL-temperature screening options and Intel/Altera's controlled-bare-die distribution through Rochester Electronics. The device's -3 speed grade, 125 MHz internal clocking, and SRAM-based reconfigurability support mission-critical systems that require in-field firmware updates via configuration EEPROM swaps. The 484-FBGA's mechanical robustness (no leads, large solder balls) and resistance to vibration make it suitable for ruggedized chassis.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF10K50VFC484-3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF10K50VFC484-3 | EPF10K200SFC484-3N | EPF10K130EFC484-3N | EPF10K50EFC484-2 | EPF10K30EFC484-2 | EPF10K50SFC484-3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Family | FLEX-10K | FLEX-10K - same | FLEX-10K - same | FLEX-10KE - enhanced interconnect | FLEX-10KE - enhanced | FLEX-10KE - enhanced | FLEX-10K - same |
| Typical Gates | 50,000 | 50,000 | 200,000 | 130,000 | 50,000 | 30,000 | 50,000 |
| Logic Elements | 2,880 | 2,880 | 9,984 | 6,656 | 2,880 | 1,728 | 2,880 |
| Total RAM Bits | 40,960 | 40,960 | 98,304 | 65,536 | 40,960 | 24,576 | 40,960 |
| Maximum User I/Os | 291 | 291 | 369 | 333 | 291 | 246 | 291 |
| Core Voltage | 3.3 V (3.0–3.6 V) | 3.3 V (3.0–3.6 V) | 3.3 V (3.0–3.6 V) | 2.5 V (FLEX-10KE) | 2.5 V (FLEX-10KE) | 2.5 V (FLEX-10KE) | 5.0 V (V suffix) |
| Speed Grade | -3 (fast) | -3 (fast) | -3 (fast) | -3 (fast) | -2 (slower) | -2 (slower) | -3 (fast) |
Wichtigste Unterscheidungsmerkmale
- Highest user I/O count in the FLEX-10K 50K-gate family (vs. EPF10K50SFC484-3)
- -3 speed grade delivers 125 MHz internal clock versus -2 alternatives (vs. EPF10K50VFC484-2)
- Pin-compatible upgrade path to 200K-gate variant on identical footprint (vs. EPF10K200SFC484-3N)
- MultiVolt I/O supports 5V/3.3V/2.5V mixed-voltage interfacing (vs. FLEX-10KE variants)
Designhinweise
Estimated: the 484-FBGA package has a typical θJA of approximately 8-12 C/W with a properly designed 6-layer PCB (1-oz copper outer, 0.5-oz inner, dedicated GND/power planes). At maximum toggle activity (~50% I/O switching at 125 MHz), the device dissipates roughly 1.0–1.5 W internally. For enclosed industrial enclosures with limited airflow, ensure at least 100 LFM of forced-air cooling or attach a small clip-on heatsink via thermal pad over the top of the BGA package.
The 484-FBGA uses 1.27 mm ball pitch with 0.6 mm ball diameter - a non-trivial layout that requires laser-drilled microvias, ENIG surface finish, and 0.4 mm trace/space design rules. Use via-in-pad (VIPPO) for all power/ground balls to maximize thermal dissipation and reduce inductance. The center of the ball array is reserved for VCCINT and GND balls; flood both inner layers with copper under the BGA to create a low-impedance power/ground cavity.
Do NOT use Quartus versions newer than 7.2 to compile FLEX-10K designs - support was dropped after that release. Use MAX+PLUS II 10.23 baseline or Quartus II Web Edition ≤ 7.2. Do NOT rely on the SRAM configuration memory to retain the bitstream across power cycles - always pair the FPGA with a serial configuration EPROM (e.g., EPC2 or EPCS1) so the device self-loads at power-up. Do NOT assume MultiVolt I/O pins are 5 V-tolerant in all I/O standards - check the datasheet's per-pin VCCIO/VREF requirements carefully.
Place the configuration EPROM within 50 mm of the FPGA's DATA0/DCLK/nCONFIG pins to minimize bitstream loading latency and avoid signal-integrity issues on long traces. Add 33 Ω series-termination resistors on clock inputs (CLK0-CLK3) when driving from off-board oscillators through connectors. Keep JTAG chain length under 100 mm total; for multi-FPGA scan chains, add a buffered JTAG repeater to maintain signal integrity above 10 MHz TCK.
Compliance-Informationen
RoHS status not explicitly confirmed in verified distributor data as of 2026-09-11. The 'N' suffix on Intel/Altera FLEX-10K devices typically denotes lead-free terminal finish, but full RoHS/REACH compliance depends on specific date code. Order from Rochester Electronics (authorized distributor) with a Certificate of Compliance when needed for production.
