EPF10K50VFC484-3N - 50K-Gate FLEX-10K FPGA, 484-BGA | Intel / Altera
Référence : EPF10K50VFC484-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $31.24 | $31,24 |
| 10 | $30.1 | $301,00 |
| 100 | $28.5 | $2 850,00 |
| 500 | $26.2 | $13 100,00 |
| 1 000 | $24 | $24 000,00 |
EPF10K50VFC484-3N Présentation
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) whose architecture consists of configurable logic blocks, programmable interconnect, and I/O cells, all controlled by on-chip SRAM configuration memory. The FLEX-10K family pioneered the embedded array block (EAB) concept, where each EAB provides 2,048 bits of dual-port RAM plus logic, enabling System-on-a-Programmable-Chip (SOPC) integration of memory, register files, and arithmetic functions alongside general-purpose logic. This positions the part within the broader hierarchy: programmable logic device -> PLD -> FPGA -> SRAM-based FPGA -> embedded-array FPGA -> power management and digital signal processing subsystems.
Key features of the EPF10K50VFC484-3N include 2,880 LEs organized in 10 Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs) supplying 24 Kbits of true dual-port RAM, 291 user I/Os with MultiVolt I/O supporting 5.0 V, 3.3 V, and 2.5 V interfacing, and a propagation delay of 0.6 ns per LE in the -3 speed grade. The 484-FBGA (23 mm × 23 mm body) uses a 1.27 mm ball pitch, suitable for production surface-mount assembly but requiring X-ray or BGA rework tools for prototyping.
The FLEX-10K architecture implements a four-input LUT-based logic element with a dedicated carry chain for fast arithmetic and a cascade chain for wide AND gates, while the EABs can be configured as RAM, ROM, or multiplier blocks. In-system configuration is supported via the passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and active serial (AS) modes, with the bitstream loaded from a serial configuration EPROM or a microcontroller. JTAG (IEEE 1149.1) boundary-scan test is built in, simplifying board-level diagnostics.
Typical applications span telecom line-card glue logic, industrial bus bridges (PCI to local bus), imaging front-ends, low-density data-path pre-processing, and legacy ASIC prototyping. Because the device uses SRAM configuration memory, it must be reconfigured at every power-up, which suits system-level flexibility over cold-start determinism.
Designers should use the legacy Altera MAX+PLUS II or Quartus II (7.2 and earlier) toolchains because newer Quartus versions have dropped FLEX-10K support. The 484-BGA requires a minimum 6-layer PCB with controlled-impedance traces and an array of GND/VCC balls forming a power/ground plane thermal path. For new designs, consider the MAX II or Cyclone IV families, but for installed-base designs the FLEX-10K remains a supported, long-lifecycle component.
Alternatives de remplacement direct pour EPF10K50VFC484-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K50VFC484-3N (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Speed Grade, Package, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K50VFC484-3
✅ Remplacement direct✓ En stock
$95.74 / unité
Voir la fiche technique →EPF10K200SFC484-3N
✅ Remplacement direct✓ En stock
$261 / unité
Voir la fiche technique →EPF10K130EFC484-3N
✅ Remplacement direct✓ En stock
$109.25 / unité
Voir la fiche technique →EPF10K50EFC484-2
✅ Remplacement direct✓ En stock
$52.75 / unité
Voir la fiche technique →EPF10K30EFC484-2
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EPF10K50SFC484-3
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EPF10K50VFC484-3N Valeurs maximales et caractéristiques électriques
| Family | FLEX-10K |
| Logic Elements | 2,880 |
| Typical Gates | 50,000 |
| Total RAM Bits | 40,960 |
| Embedded Array Blocks (EABs) | 12 |
| Logic Array Blocks (LABs) | 10 |
| Maximum User I/Os | 291 |
| Supply Voltage (VCCINT) | 3.0 V to 3.6 V (3.3 V nominal) |
| I/O Voltage Standards | 5.0 V, 3.3 V, 2.5 V (MultiVolt) |
| Internal Frequency | 125 MHz |
| Propagation Delay (per LE) | 0.6 ns |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Boîtier | 484-FBGA (23 x 23 mm, 1.27 mm pitch) |
| Température de fonctionnement | 0 °C to +70 °C (commercial) |
| Configuration Modes | Passive Serial, Passive Parallel (Sync/Async), Active Serial, JTAG |
| JTAG Support | IEEE 1149.1 Boundary Scan |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du EPF10K50VFC484-3N 484-fbga (23 x 23 mm, 1.27 mm pitch)
Configuration des broches du EPF10K50VFC484-3N (boîtier 484-fbga (23 x 23 mm, 1.27 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPF10K50VFC484-3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPF10K50VFC484-3N convient pour 6 applications: Telecom Line-Card Glue Logic, Industrial Bus Bridge / Protocol Converter, Imaging Front-End Pre-Processing, Low-Density DSP / FIR Filter Implementation, Legacy ASIC / ASSP Prototyping, Avionics / Military Embedded Systems (Legacy).
Telecom Line-Card Glue Logic
The EPF10K50VFC484-3N's 291 user I/Os and 50K-gate density make it well suited to telecom line-card glue logic, where it bridges backplane buses (e.g., H.110 CT Bus, UTOPIA, POS-PHY) to framer ASICs and TDM switches. The 3.3 V core with 5 V-tolerant MultiVolt I/O eliminates external level shifters when interfacing to legacy 5 V framers, and the 12 Embedded Array Blocks deliver 24 Kbits of dual-port RAM for buffer descriptors and lookup tables. Designers typically instantiate 32-bit FIFOs, UTOPIA Level-2 interfaces, and HDLC controllers in the 2,880 LEs, achieving timing closure at 50 MHz system clocks in the -3 speed grade.
Recommandé
Industrial Bus Bridge / Protocol Converter
The EPF10K50VFC484-3N is widely used as a PCI-to-Local-Bus bridge or a custom protocol converter (e.g., VME to PCI, ISA to PC/104) in industrial automation backplanes. Its 125 MHz internal clock and 0.6 ns LE propagation delay allow 33 MHz PCI target implementations with comfortable timing margins, while 291 I/Os absorb address/data/control signals from both bus sides plus auxiliary GPIO. The 40 Kbits of embedded RAM implement scatter-gather descriptor tables without consuming external SRAM, and JTAG boundary-scan (IEEE 1149.1) accelerates board bring-up and in-field diagnostics on production controllers.
Recommandé
Imaging Front-End Pre-Processing
In imaging front-ends, the EPF10K50VFC484-3N serves as a pre-processing stage between CMOS image sensors and a host DSP or SoC, performing Bayer demosaicing, color correction matrix multiplication, and histogram generation in real time. The 12 EABs configured as dual-port RAM store line buffers (one row of 8-bit pixels) for 2D convolution, while the 2,880 LEs run parallel multiply-accumulate pipelines at 50-80 MHz pixel rates. The 5 V-tolerant I/O connects directly to legacy image sensor LVDS/CMOS outputs, and the 3.3 V core interfaces to modern DSPs without level translation - a clean two-rail solution for legacy embedded vision modules.
Recommandé
Low-Density DSP / FIR Filter Implementation
The EPF10K50VFC484-3N is frequently used to implement FIR filters, correlators, and small FFT engines in DSP pre-processing subsystems. Each EAB can be configured as a 256 × 8-bit multiplier block (one of the FLEX-10K's signature features), and the dedicated carry chain in each LE enables efficient MAC (multiply-accumulate) pipelines running at 80-100 MHz. With 12 EABs and 2,880 LEs, the device typically hosts 8-16 parallel FIR taps at 50 MSPS sample rates, sufficient for audio-band and intermediate-frequency signal conditioning in software-defined radio (SDR) and instrumentation front-ends.
Recommandé
Legacy ASIC / ASSP Prototyping
The EPF10K50VFC484-3N is a workhorse for ASIC prototyping where designers map RTL to the FPGA for hardware-software co-validation before tape-out. Its 50K-gate capacity accommodates medium-complexity ASICs (microcontroller peripherals, state-machine controllers, glue-logic-rich designs), and the SRAM-based configuration enables rapid design iterations (re-programmed in seconds via JTAG). The 291 I/Os closely match the I/O count of many production ASICs, simplifying pin-mapping between the FPGA prototype and the final silicon; engineers use MAX+PLUS II 10.23 or Quartus II ≤ 7.2 for synthesis and timing analysis.
Recommandé
Avionics / Military Embedded Systems (Legacy)
Many long-lifecycle avionics, radar, and military embedded systems continue to use the EPF10K50VFC484-3N because of its MIL-temperature screening options and Intel/Altera's controlled-bare-die distribution through Rochester Electronics. The device's -3 speed grade, 125 MHz internal clocking, and SRAM-based reconfigurability support mission-critical systems that require in-field firmware updates via configuration EEPROM swaps. The 484-FBGA's mechanical robustness (no leads, large solder balls) and resistance to vibration make it suitable for ruggedized chassis.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K50VFC484-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K50VFC484-3 | EPF10K200SFC484-3N | EPF10K130EFC484-3N | EPF10K50EFC484-2 | EPF10K30EFC484-2 | EPF10K50SFC484-3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Family | FLEX-10K | FLEX-10K - same | FLEX-10K - same | FLEX-10KE - enhanced interconnect | FLEX-10KE - enhanced | FLEX-10KE - enhanced | FLEX-10K - same |
| Typical Gates | 50,000 | 50,000 | 200,000 | 130,000 | 50,000 | 30,000 | 50,000 |
| Logic Elements | 2,880 | 2,880 | 9,984 | 6,656 | 2,880 | 1,728 | 2,880 |
| Total RAM Bits | 40,960 | 40,960 | 98,304 | 65,536 | 40,960 | 24,576 | 40,960 |
| Maximum User I/Os | 291 | 291 | 369 | 333 | 291 | 246 | 291 |
| Core Voltage | 3.3 V (3.0–3.6 V) | 3.3 V (3.0–3.6 V) | 3.3 V (3.0–3.6 V) | 2.5 V (FLEX-10KE) | 2.5 V (FLEX-10KE) | 2.5 V (FLEX-10KE) | 5.0 V (V suffix) |
| Speed Grade | -3 (fast) | -3 (fast) | -3 (fast) | -3 (fast) | -2 (slower) | -2 (slower) | -3 (fast) |
Principaux différenciateurs
- Highest user I/O count in the FLEX-10K 50K-gate family (vs EPF10K50SFC484-3)
- -3 speed grade delivers 125 MHz internal clock versus -2 alternatives (vs EPF10K50VFC484-2)
- Pin-compatible upgrade path to 200K-gate variant on identical footprint (vs EPF10K200SFC484-3N)
- MultiVolt I/O supports 5V/3.3V/2.5V mixed-voltage interfacing (vs FLEX-10KE variants)
Notes de conception
Estimated: the 484-FBGA package has a typical θJA of approximately 8-12 C/W with a properly designed 6-layer PCB (1-oz copper outer, 0.5-oz inner, dedicated GND/power planes). At maximum toggle activity (~50% I/O switching at 125 MHz), the device dissipates roughly 1.0–1.5 W internally. For enclosed industrial enclosures with limited airflow, ensure at least 100 LFM of forced-air cooling or attach a small clip-on heatsink via thermal pad over the top of the BGA package.
The 484-FBGA uses 1.27 mm ball pitch with 0.6 mm ball diameter - a non-trivial layout that requires laser-drilled microvias, ENIG surface finish, and 0.4 mm trace/space design rules. Use via-in-pad (VIPPO) for all power/ground balls to maximize thermal dissipation and reduce inductance. The center of the ball array is reserved for VCCINT and GND balls; flood both inner layers with copper under the BGA to create a low-impedance power/ground cavity.
Do NOT use Quartus versions newer than 7.2 to compile FLEX-10K designs - support was dropped after that release. Use MAX+PLUS II 10.23 baseline or Quartus II Web Edition ≤ 7.2. Do NOT rely on the SRAM configuration memory to retain the bitstream across power cycles - always pair the FPGA with a serial configuration EPROM (e.g., EPC2 or EPCS1) so the device self-loads at power-up. Do NOT assume MultiVolt I/O pins are 5 V-tolerant in all I/O standards - check the datasheet's per-pin VCCIO/VREF requirements carefully.
Place the configuration EPROM within 50 mm of the FPGA's DATA0/DCLK/nCONFIG pins to minimize bitstream loading latency and avoid signal-integrity issues on long traces. Add 33 Ω series-termination resistors on clock inputs (CLK0-CLK3) when driving from off-board oscillators through connectors. Keep JTAG chain length under 100 mm total; for multi-FPGA scan chains, add a buffered JTAG repeater to maintain signal integrity above 10 MHz TCK.
Informations de conformité
RoHS status not explicitly confirmed in verified distributor data as of 2026-09-11. The 'N' suffix on Intel/Altera FLEX-10K devices typically denotes lead-free terminal finish, but full RoHS/REACH compliance depends on specific date code. Order from Rochester Electronics (authorized distributor) with a Certificate of Compliance when needed for production.
