EPF6024AQI240-3 - FLEX 6000 FPGA, 24K Gates, 240-PQFP | Intel
Teilenummer: EPF6024AQI240-3 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $33.1 | $3.310,00 |
| 500 | $28.75 | $14.375,00 |
| 1.000 | $25.4 | $25.400,00 |
EPF6024AQI240-3 Übersicht
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit between simple PLDs/CPLDs (lower density, deterministic timing) and ASICs (high NRE, fixed function). The FLEX 6000 family is Altera's classic SRAM-based, low-density FPGA line (now owned and supported by Intel) positioned for cost-sensitive glue logic, bridging, and I/O expansion roles rather than high-performance signal processing.
Key features of the EPF6024AQI240-3 include 1,960 logic elements, 199 user I/O lines plus 4 dedicated inputs, 0.5 mm pitch PQFP-240 for socketed or hand-prototype assembly, SRAM-based configuration (volatile - requires a configuration PROM such as EPC2 or EPC4 on power-up), and in-system programmability via JTAG (IEEE 1149.1). The 240-pin PQFP footprint enables simpler rework and breadboarding compared with fine-pitch BGA alternatives, an important consideration for legacy industrial designs.
Architecturally, the FLEX 6000 device uses Altera's patented continuous interconnect scheme with embedded array blocks (EABs) used as RAM/ROM. The part is fabricated on a CMOS process and operates from a 5.0 V core supply with multi-voltage I/O support. Configuration is loaded from a serial or parallel PROM over a dedicated data path, making board-level bring-up straightforward.
Typical applications include industrial control glue logic, parallel I/O expansion and bus interfacing, prototype-to-production ASIC replacement, motor-control sequencing, legacy telecom backplane glue logic, and test instrumentation I/O conditioning. The 240-pin PQFP package is also favored where socket-based field replacement is required.
Design consideration: The EPF6024AQI240-3 is an older FLEX 6000 device, and Intel/Altera long-term support is limited. Designers building new products should consider Cyclone or Cyclone II as modern equivalents, while keeping the FLEX 6000 family for legacy repair and second-source maintenance.
Drop-in-Alternativen für EPF6024AQI240-3 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF6024AQI240-3 (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Configuration Method, Speed Grade, Maximum Clock Frequency.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF6024AQI240-2
✅ Drop-In✓ Auf Lager
$9.75 / Stück
Datenblatt ansehen →EPF6024AQI240-2N
✅ Drop-In✓ Auf Lager
$16.4 / Stück
Datenblatt ansehen →EPF6024AQI240-1
✅ Drop-In✓ Auf Lager
$15.2 / Stück
Datenblatt ansehen →EPF6024AQI240-1N
✅ Drop-In✓ Auf Lager
$16.2 / Stück
Datenblatt ansehen →EPF6024AQC240-3
✅ Drop-In✓ Auf Lager
$19.8 / Stück
Datenblatt ansehen →EPF6024AQC240-3N
✅ Drop-In✓ Auf Lager
$69.3 / Stück
Datenblatt ansehen →EPF6024AQI240-3 Grenzwerte & elektrische Eigenschaften
| Family | FLEX 6000 |
| Logic Elements | 1,960 |
| Usable Gates | 24,000 (typical) |
| User I/O | 199 |
| Dedicated Inputs | 4 |
| Maximale Taktfrequenz | 133 MHz |
| Speed Grade | -3 |
| Process Technology | CMOS (SRAM-based) |
| Gehäuse | 240-pin PQFP (PQFP240), 0.50 mm pitch |
| Montageart | Surface Mount |
| Configuration Method | SRAM (serial/parallel PROM, JTAG) |
| Betriebstemperaturbereich | Industrial (I suffix) |
| Embedded Array Blocks (EAB) | Yes (used as RAM/ROM) |
| Versorgungsspannung | 5.0 V core (multi-voltage I/O support) |
EPF6024AQI240-3 240-pin pqfp (pqfp240), 0.50 mm pitch Pinbelegungsleitfaden
Pinbelegung für EPF6024AQI240-3 (240-pin pqfp (pqfp240), 0.50 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF6024AQI240-3.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF6024AQI240-3 ist geeignet für 6 Anwendungs: Industrial Glue Logic and Bus Bridging, Legacy ASIC Replacement and Prototype Bring-Up, Motor Control Sequencing and PWM Generation, Telecom Backplane Glue Logic, Test and Measurement I/O Conditioning, Military and Aerospace Avionics (Legacy).
Industrial Glue Logic and Bus Bridging
The EPF6024AQI240-3's 1,960 logic elements and 199 user I/O pins make it well suited to industrial glue-logic boards that must bridge parallel buses (e.g., ISA, PC/104, custom 16/32-bit parallel interfaces) to peripherals or controllers. Designers typically instantiate multiple bus-state-machine cores, FIFOs, and address-decode logic while keeping timing predictable thanks to the FLEX 6000 deterministic interconnect. The PQFP-240 footprint supports socket-based field replacement, an advantage in long-life industrial installations.
Empfohlen
Legacy ASIC Replacement and Prototype Bring-Up
Engineers use the EPF6024AQI240-3 as a quick-turn ASIC substitute during the gap between FPGA prototype and ASIC silicon return. The 24,000 usable gates and 199 I/O cover typical control-plane ASICs (register-rich, low arithmetic), while SRAM-based in-system programmability via JTAG accelerates board bring-up. Designers download bitstreams via ByteBlaster or USB-Blaster, iterate in MAX+PLUS II or Quartus II Web Edition, and validate the design before committing to ASIC NRE.
Empfohlen
Motor Control Sequencing and PWM Generation
Stepper and BLDC motor control boards benefit from the EPF6024AQI240-3's 133 MHz clock and 1,960 logic elements for multi-axis PWM generation, encoder decoding, and commutation sequencing. Hardware state machines deliver deterministic timing free from RTOS jitter, and the 199 I/O support multiple encoder/HALL-sensor inputs plus parallel DAC interfaces. The industrial temperature grade (I suffix) suits factory-floor environments with extended thermal range.
Empfohlen
Telecom Backplane Glue Logic
Legacy telecom and networking backplanes use the EPF6024AQI240-3 for protocol conversion, framing/deframing, and bus arbitration between line cards. The 199 I/O accommodate multiple low-speed serial links and parallel control buses, while SRAM-based configuration enables fast field firmware updates via JTAG. Socketed PQFP-240 assembly simplifies line-card rework when a single FPGA must be replaced on a fully populated backplane.
Empfohlen
Test and Measurement I/O Conditioning
Test instruments and ATE fixtures use the EPF6024AQI240-3 as a reconfigurable I/O-conditioning layer between measurement ASICs and the unit-under-test. The 199 I/O support parallel pattern generation, handshake sequencing, and adaptive threshold conditioning, while the 133 MHz clock enables deterministic timing for compliance tests. Engineers prototype new test routines in days rather than weeks because configuration changes load in seconds via JTAG.
Empfohlen
Military and Aerospace Avionics (Legacy)
Long-lifecycle avionics and military systems rely on the EPF6024AQI240-3 for stable, established-source logic functions where requalification cost outweighs the benefit of modern FPGAs. The industrial temperature grade and PQFP-240 footprint are qualified in many legacy DO-254 and MIL-STD-454 platforms. Modernization programs are encouraged to migrate to rad-tolerant FPGAs, but the EPF6024AQI240-3 continues to support sustainment-phase production through licensed distribution.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF6024AQI240-3 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF6024AQI240-2 | EPF6024AQI240-2N | EPF6024AQI240-1 | EPF6024AQI240-1N | EPF6024AQC240-3 | EPF6024AQC240-3N |
|---|---|---|---|---|---|---|---|
| Package | PQFP-240 (0.50 mm pitch) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | -3 (fastest, 133 MHz fmax) | -2 | -2 | -1 | -1 | -3 | -3 |
| Logic Elements | 1,960 | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) |
| User I/O | 199 | 199 (same) | 199 (same) | 199 (same) | 199 (same) | 199 (same) | 199 (same) |
| Temperature Grade | Industrial (I suffix) | Industrial | Industrial | Industrial | Industrial | Commercial | Commercial |
| Lead-Free (N suffix) | No | No | Yes | No | Yes | No | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration PROM | External (EPC2/EPC4/EPC8) | External (same) | External (same) | External (same) | External (same) | External (same) | External (same) |
Wichtigste Unterscheidungsmerkmale
- Fastest -3 speed grade in the FLEX 6000 PQFP-240 industrial family (vs. EPF6024AQI240-2)
- Industrial temperature range for harsh-environment deployments (vs. EPF6024AQC240-3)
- High I/O density for bus-bridging designs (vs. EPF6016QC208-3)
Designhinweise
The EPF6024AQI240-3 in PQFP-240 has a junction-to-ambient thermal resistance (theta_JA) of approximately 30-35 C/W on a standard 4-layer JEDEC test board with no airflow. At a 5 V core supply drawing ~250 mA, internal dissipation is ~1.25 W and the die temperature rises 40-45 C above ambient. For enclosed industrial enclosures above 60 C ambient, derate by ~2-3 C/W per missing layer and confirm with a thermal probe during bring-up.
Always include an external configuration PROM (EPC2, EPC4, EPC8, or EPC16) selected by bitstream size - the SRAM configuration is volatile and the FPGA will not power up functional without it. Connect nCONFIG to a supervisor reset or RC delay so VCC is stable before configuration begins. JTAG (TCK, TMS, TDI, TDO, VCCIO, GND) must be routed to a header for factory programming; forgetting JTAG access forces board rework later.
PQFP-240 has 0.50 mm pitch leads that require careful land-pattern and solder-mask definition. Use a length-to-width pad ratio of approximately 1.5:1 with toe and heel fillets to prevent solder bridges during reflow. Place a 0.1 uF decoupling cap on every four VCCIO/VCCINT pins, plus a bulk 47-100 uF tantalum near the FPGA. Route all VCC and GND pairs as wide power pours with multiple vias to drop impedance.
Compliance-Informationen
RoHS status not documented in public sources. The original PQFP-240 device was likely SnPb lead finish. The N-suffix variants (e.g., EPF6024AQI240-2N, EPF6024AQC240-3N) indicate lead-free finishes per Altera ordering nomenclature.
