EPF6024AQI240-3 - FLEX 6000 FPGA, 24K Gates, 240-PQFP | Intel
部品番号: EPF6024AQI240-3 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $33.1 | $3,310.00 |
| 500 | $28.75 | $14,375.00 |
| 1,000 | $25.4 | $25,400.00 |
EPF6024AQI240-3 概要
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit between simple PLDs/CPLDs (lower density, deterministic timing) and ASICs (high NRE, fixed function). The FLEX 6000 family is Altera's classic SRAM-based, low-density FPGA line (now owned and supported by Intel) positioned for cost-sensitive glue logic, bridging, and I/O expansion roles rather than high-performance signal processing.
Key features of the EPF6024AQI240-3 include 1,960 logic elements, 199 user I/O lines plus 4 dedicated inputs, 0.5 mm pitch PQFP-240 for socketed or hand-prototype assembly, SRAM-based configuration (volatile - requires a configuration PROM such as EPC2 or EPC4 on power-up), and in-system programmability via JTAG (IEEE 1149.1). The 240-pin PQFP footprint enables simpler rework and breadboarding compared with fine-pitch BGA alternatives, an important consideration for legacy industrial designs.
Architecturally, the FLEX 6000 device uses Altera's patented continuous interconnect scheme with embedded array blocks (EABs) used as RAM/ROM. The part is fabricated on a CMOS process and operates from a 5.0 V core supply with multi-voltage I/O support. Configuration is loaded from a serial or parallel PROM over a dedicated data path, making board-level bring-up straightforward.
Typical applications include industrial control glue logic, parallel I/O expansion and bus interfacing, prototype-to-production ASIC replacement, motor-control sequencing, legacy telecom backplane glue logic, and test instrumentation I/O conditioning. The 240-pin PQFP package is also favored where socket-based field replacement is required.
Design consideration: The EPF6024AQI240-3 is an older FLEX 6000 device, and Intel/Altera long-term support is limited. Designers building new products should consider Cyclone or Cyclone II as modern equivalents, while keeping the FLEX 6000 family for legacy repair and second-source maintenance.
ドロップイン代替品: EPF6024AQI240-3 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF6024AQI240-3 （同一形状・フットプリント） — 相違点: Package, Process Technology, Configuration Method, Speed Grade, Maximum Clock Frequency.
クイック比較ツール — 並列比較する代替部品を選択:
EPF6024AQI240-2
✅ ドロップイン✓ 在庫あり
$9.75 / 個
データシートを見る →EPF6024AQI240-2N
✅ ドロップイン✓ 在庫あり
$16.4 / 個
データシートを見る →EPF6024AQI240-1
✅ ドロップイン✓ 在庫あり
$15.2 / 個
データシートを見る →EPF6024AQI240-1N
✅ ドロップイン✓ 在庫あり
$16.2 / 個
データシートを見る →EPF6024AQC240-3
✅ ドロップイン✓ 在庫あり
$19.8 / 個
データシートを見る →EPF6024AQC240-3N
✅ ドロップイン✓ 在庫あり
$69.3 / 個
データシートを見る →EPF6024AQI240-3 最大定格＆電気的特性
| Family | FLEX 6000 |
| Logic Elements | 1,960 |
| Usable Gates | 24,000 (typical) |
| User I/O | 199 |
| Dedicated Inputs | 4 |
| 最大クロック周波数 | 133 MHz |
| Speed Grade | -3 |
| Process Technology | CMOS (SRAM-based) |
| パッケージ | 240-pin PQFP (PQFP240), 0.50 mm pitch |
| 実装タイプ | Surface Mount |
| Configuration Method | SRAM (serial/parallel PROM, JTAG) |
| 動作温度範囲 | Industrial (I suffix) |
| Embedded Array Blocks (EAB) | Yes (used as RAM/ROM) |
| 電源電圧 | 5.0 V core (multi-voltage I/O support) |
EPF6024AQI240-3 240-pin pqfp (pqfp240), 0.50 mm pitch ピン配置ガイド
EPF6024AQI240-3 (240-pin pqfp (pqfp240), 0.50 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPF6024AQI240-3.
詳細は データシート をご参照ください。
主な用途
EPF6024AQI240-3 の用途: 6 件s: Industrial Glue Logic and Bus Bridging, Legacy ASIC Replacement and Prototype Bring-Up, Motor Control Sequencing and PWM Generation, Telecom Backplane Glue Logic, Test and Measurement I/O Conditioning, Military and Aerospace Avionics (Legacy).
Industrial Glue Logic and Bus Bridging
The EPF6024AQI240-3's 1,960 logic elements and 199 user I/O pins make it well suited to industrial glue-logic boards that must bridge parallel buses (e.g., ISA, PC/104, custom 16/32-bit parallel interfaces) to peripherals or controllers. Designers typically instantiate multiple bus-state-machine cores, FIFOs, and address-decode logic while keeping timing predictable thanks to the FLEX 6000 deterministic interconnect. The PQFP-240 footprint supports socket-based field replacement, an advantage in long-life industrial installations.
おすすめ
Legacy ASIC Replacement and Prototype Bring-Up
Engineers use the EPF6024AQI240-3 as a quick-turn ASIC substitute during the gap between FPGA prototype and ASIC silicon return. The 24,000 usable gates and 199 I/O cover typical control-plane ASICs (register-rich, low arithmetic), while SRAM-based in-system programmability via JTAG accelerates board bring-up. Designers download bitstreams via ByteBlaster or USB-Blaster, iterate in MAX+PLUS II or Quartus II Web Edition, and validate the design before committing to ASIC NRE.
おすすめ
Motor Control Sequencing and PWM Generation
Stepper and BLDC motor control boards benefit from the EPF6024AQI240-3's 133 MHz clock and 1,960 logic elements for multi-axis PWM generation, encoder decoding, and commutation sequencing. Hardware state machines deliver deterministic timing free from RTOS jitter, and the 199 I/O support multiple encoder/HALL-sensor inputs plus parallel DAC interfaces. The industrial temperature grade (I suffix) suits factory-floor environments with extended thermal range.
おすすめ
Telecom Backplane Glue Logic
Legacy telecom and networking backplanes use the EPF6024AQI240-3 for protocol conversion, framing/deframing, and bus arbitration between line cards. The 199 I/O accommodate multiple low-speed serial links and parallel control buses, while SRAM-based configuration enables fast field firmware updates via JTAG. Socketed PQFP-240 assembly simplifies line-card rework when a single FPGA must be replaced on a fully populated backplane.
おすすめ
Test and Measurement I/O Conditioning
Test instruments and ATE fixtures use the EPF6024AQI240-3 as a reconfigurable I/O-conditioning layer between measurement ASICs and the unit-under-test. The 199 I/O support parallel pattern generation, handshake sequencing, and adaptive threshold conditioning, while the 133 MHz clock enables deterministic timing for compliance tests. Engineers prototype new test routines in days rather than weeks because configuration changes load in seconds via JTAG.
おすすめ
Military and Aerospace Avionics (Legacy)
Long-lifecycle avionics and military systems rely on the EPF6024AQI240-3 for stable, established-source logic functions where requalification cost outweighs the benefit of modern FPGAs. The industrial temperature grade and PQFP-240 footprint are qualified in many legacy DO-254 and MIL-STD-454 platforms. Modernization programs are encouraged to migrate to rad-tolerant FPGAs, but the EPF6024AQI240-3 continues to support sustainment-phase production through licensed distribution.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF6024AQI240-3 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF6024AQI240-2 | EPF6024AQI240-2N | EPF6024AQI240-1 | EPF6024AQI240-1N | EPF6024AQC240-3 | EPF6024AQC240-3N |
|---|---|---|---|---|---|---|---|
| Package | PQFP-240 (0.50 mm pitch) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) | PQFP-240 (same) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | -3 (fastest, 133 MHz fmax) | -2 | -2 | -1 | -1 | -3 | -3 |
| Logic Elements | 1,960 | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) | 1,960 (same die) |
| User I/O | 199 | 199 (same) | 199 (same) | 199 (same) | 199 (same) | 199 (same) | 199 (same) |
| Temperature Grade | Industrial (I suffix) | Industrial | Industrial | Industrial | Industrial | Commercial | Commercial |
| Lead-Free (N suffix) | No | No | Yes | No | Yes | No | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration PROM | External (EPC2/EPC4/EPC8) | External (same) | External (same) | External (same) | External (same) | External (same) | External (same) |
主な差別化要因
- Fastest -3 speed grade in the FLEX 6000 PQFP-240 industrial family （vs EPF6024AQI240-2)
- Industrial temperature range for harsh-environment deployments （vs EPF6024AQC240-3)
- High I/O density for bus-bridging designs （vs EPF6016QC208-3)
設計ノート
The EPF6024AQI240-3 in PQFP-240 has a junction-to-ambient thermal resistance (theta_JA) of approximately 30-35 C/W on a standard 4-layer JEDEC test board with no airflow. At a 5 V core supply drawing ~250 mA, internal dissipation is ~1.25 W and the die temperature rises 40-45 C above ambient. For enclosed industrial enclosures above 60 C ambient, derate by ~2-3 C/W per missing layer and confirm with a thermal probe during bring-up.
Always include an external configuration PROM (EPC2, EPC4, EPC8, or EPC16) selected by bitstream size - the SRAM configuration is volatile and the FPGA will not power up functional without it. Connect nCONFIG to a supervisor reset or RC delay so VCC is stable before configuration begins. JTAG (TCK, TMS, TDI, TDO, VCCIO, GND) must be routed to a header for factory programming; forgetting JTAG access forces board rework later.
PQFP-240 has 0.50 mm pitch leads that require careful land-pattern and solder-mask definition. Use a length-to-width pad ratio of approximately 1.5:1 with toe and heel fillets to prevent solder bridges during reflow. Place a 0.1 uF decoupling cap on every four VCCIO/VCCINT pins, plus a bulk 47-100 uF tantalum near the FPGA. Route all VCC and GND pairs as wide power pours with multiple vias to drop impedance.
コンプライアンス情報
RoHS status not documented in public sources. The original PQFP-240 device was likely SnPb lead finish. The N-suffix variants (e.g., EPF6024AQI240-2N, EPF6024AQC240-3N) indicate lead-free finishes per Altera ordering nomenclature.
