EPM2210F324C3N - 2210 LE MAX II CPLD, 7ns, 324-FBGA | Intel
MPN: EPM2210F324C3N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $101.47 | $101.47 |
| 10 | $92.5 | $925.00 |
| 100 | $78.3 | $7,830.00 |
| 250 | $71.8 | $17,950.00 |
| 500 | $65.2 | $32,600.00 |
Drop-in alternatives for EPM2210F324C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM2210F324C4N
β Drop-Inπ Reference alternative (not in catalog)
EPM2210F324C5N
β Drop-Inπ Reference alternative (not in catalog)
EPM2210F324C3
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPM2210F324I5N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPM2210F324C3N Maximum Ratings & Electrical Characteristics
| Device Family | MAX II |
| Logic Elements (LE) | 2,210 |
| Equivalent Macrocells | 1,700 |
| User Flash Memory (UFM) | 8 Kbits |
| Maximum User I/Os | 272 |
| Pin-to-Pin Delay (tPD1) | 7 ns (commercial speed grade) |
| Global Clock Networks | 4 |
| Core Voltage | 1.8 V |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Package | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Programming Interface | JTAG 1149.1 (in-system programmable, ISP) |
| Operating Temperature | 0C to +85C (commercial) |
| Process Technology | 6-layer-metal CMOS, flash-based |
| RoHS Status | Lead-free (per datasheet) |
| Design Software | Quartus II / Quartus Prime (Intel FPGA) |
EPM2210F324C3N fbga-324 (324-ball fineline bga, 19 x 19 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EPM2210F324C3N (fbga-324 (324-ball fineline bga, 19 x 19 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM2210F324C3N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM2210F324C3N is suitable for 6 applications: Bus Interface Bridging and Glue Logic, Power-Up Sequence Controller, I/O Expansion and Address Decode for ASSPs, LED Display Multiplexing and Scan Controllers, Configuration EEPROM Replacement, Industrial Control and Factory Automation.
Bus Interface Bridging and Glue Logic
The EPM2210F324C3N's 7 ns tPD1 propagation delay and 272 user I/Os make it ideal for bridging asynchronous bus widths (e.g., 8-bit MCU to 16/32-bit ASIC or memory) in industrial control and embedded systems. The 2210 logic elements provide ample capacity for address decoding, wait-state generation, and interrupt steering that would otherwise require multiple 74-series TTL packages, while the on-chip flash UFM (8 Kbits) stores non-volatile configuration or board-identity parameters. Placed near the bus connectors, the FBGA-324 footprint routes cleanly to dense pin arrays. Unlike FPGAs, instant-on non-volatile configuration means no boot PROM and no warm-up delay, critical for fail-safe industrial applications.
Recommended
Power-Up Sequence Controller
The EPM2210F324C3N is widely deployed as a multi-rail power-up sequencer in ATCA/uTCA backplanes, server motherboards, and FPGA-based add-in cards where deterministic timing of voltage rail enable signals is required. Its instant-on flash configuration and 4 global clock networks enable precise programmable delays between enables, while the MultiVolt I/O (1.5 V to 3.3 V) directly drives most PMBus-compatible supervisors without external level shifters. The 8 Kbit UFM block stores sequencing profiles, fault thresholds, and board revision codes. The C3 speed grade's 7 ns tPD keeps timing margin tight relative to FPGA-based sequencing, which typically adds tens of nanoseconds of boot latency.
Recommended
I/O Expansion and Address Decode for ASSPs
The EPM2210F324C3N adds chip-select decode, interrupt steering, and bus-multiplexing to ASSPs and microcontrollers that lack sufficient native I/O. In set-top boxes, point-of-sale terminals, and industrial HMIs, it expands 32 GPIO to 100+ via I2C/SPI-to-parallel bridge logic, offloading main CPU cycles. The 272 user I/Os accommodate multiple peripheral banks simultaneously, and the JTAG 1149.1 interface simplifies board-level boundary-scan test coverage. Quartus Prime synthesis supports Verilog, VHDL, and schematic entry, allowing rapid port from 74HC logic schematics into a single chip.
Recommended
LED Display Multiplexing and Scan Controllers
The EPM2210F324C3N drives large multi-segment LED matrix displays in scoreboards, traffic signage, and instrumentation front panels by providing high-current row/column scanning with precise timing. Its 272 user I/Os handle row enables and column data for displays up to 16 rows x 16 columns directly, while the deterministic 7 ns timing supports PWM dimming without flicker artifacts. The on-chip flash UFM stores display fonts, animation patterns, and brightness curves that survive power cycles. MultiVolt I/O allows direct interfacing with 3.3 V LED driver shift registers without level translation.
Recommended
Configuration EEPROM Replacement
The EPM2210F324C3N's 8 Kbit User Flash Memory (UFM) block replaces external serial EEPROMs used for storing board identification, calibration constants, and user preferences in industrial and embedded designs. Accessible via JTAG or a dedicated 4-wire serial interface (SCLK, SDIN, SDOUT, CS), the UFM supports up to 100,000 erase/program cycles and 100 years of data retention. Combined with the CPLD's programmable logic, this provides a single-chip solution for boards that would otherwise need a CPLD plus a 24LC-series EEPROM, reducing BOM cost and PCB area.
Recommended
Industrial Control and Factory Automation
The EPM2210F324C3N's deterministic timing, instant-on non-volatile configuration, and 272 I/Os suit factory automation controllers, PLC I/O modules, and motor-control interfaces where reliability and predictable latency are paramount. Its commercial temperature range (0C to +85C) covers most factory-floor environments, and the FBGA-324 package withstands high-vibration mounting when properly board-attached. The MAX II architecture resists single-event upsets better than SRAM-based FPGAs, making it preferable for industrial PLC applications where configuration corruption cannot be tolerated. Quartus Prime supports industrial-grade IP libraries for motor-control PWM generation and encoder decoding.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210F324C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210F324C4N | EPM2210F324C5N | EPM2210F324C3 | EPM2210F324I5N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-324 (19x19 mm, 1.0 mm pitch) | FBGA-324 (19x19 mm, 1.0 mm pitch) - same | FBGA-324 (19x19 mm, 1.0 mm pitch) - same | FBGA-324 (19x19 mm, 1.0 mm pitch) - same | FBGA-324 (19x19 mm, 1.0 mm pitch) - same |
| Logic Elements | 2,210 | 2,210 | 2,210 | 2,210 | 2,210 |
| Pin-to-Pin Delay (tPD1) | 7 ns | ~8 ns (+14%) | 9.1 ns (+30%) | 7 ns (same) | 9.1 ns (+30%) |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Maximum User I/Os | 272 | 272 | 272 | 272 | 272 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lead-Free / RoHS | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free (N suffix) | Non-lead-free (no N suffix) | Lead-free (N suffix) |
| Unit Price (qty 1) | ~$101.47 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Fastest speed grade in MAX II family at this density (vs EPM2210F324C4N / EPM2210F324C5N)
- Highest I/O count in the MAX II CPLD family (vs EPM2210F256C3N)
- Commercial temperature grade with lowest cost in this speed tier (vs EPM2210F324I5N)
Design Notes
The FBGA-324 package uses 1.0 mm ball pitch and 19 x 19 mm body - require PCB fabrication capability for 0.4 mm via-pad microvias or via-in-pad (VIPPO) technology. Standard 1.6 mm FR-4 with 1 oz copper and 0.2 mm laser-drilled vias is the typical baseline. Always include a 4 to 6 mil soldermask dam between adjacent BGA balls and route escape traces on inner layers with microvia stacks. Estimated: a 4-layer stack-up with 0.2 mm microvias is sufficient for the 1.0 mm pitch; 1.0 mm standard through-vias cannot escape an FBGA at this pitch without dog-bone fanout.
Decouple each VCCINT (1.8 V core) and VCCIO (I/O bank) ball with a 0.1 uF X7R ceramic capacitor placed within 2 mm of the respective ball, plus a bulk 10 uF tantalum or ceramic per voltage rail. The MAX II datasheet specifies 8 to 16 decoupling capacitors depending on utilization rate. Add a ferrite bead on each supply rail if the source is a switching regulator; the CPLD's 272 outputs can inject significant switching noise into the power plane during simultaneous toggling.
For designs using all 272 I/Os at high toggle rates, route clock signals on inner stripline layers with controlled impedance (50 ohm single-ended or 90 ohm differential per LVDS). Use the 4 global clock networks for high-fanout signals to minimize skew; local routing is acceptable for low-frequency signals. Estimated: at 100 MHz LVCMOS output, expect approximately 25 mA peak current per switching I/O and budget the power plane accordingly to avoid IR-drop-induced timing violations.
Do not assume the EPM2210F324C3N and EPM2210F324C5N have identical JTAG IDs - while both are in-system programmable, the silicon revision differs between speed grades and Quartus II may flag a mismatch during download. Verify the design's timing constraints are met when substituting between C3, C4, and C5 grades, as tPD scales from 7 ns to 9.1 ns. The UFM block supports only 100,000 write cycles - do not use it for high-update-rate data logging without external wear-leveling logic.
Compliance Information
Lead-free per N-suffix nomenclature; RoHS and REACH compliance per Intel product page. Not AEC-Q100 qualified - automotive applications should use the EPM2210F256A5NGA variant from the same MAX II family.
