EPM570GF256I5 - MAX II CPLD 570 LE 160 I/O FBGA-256 | Intel
Teilenummer: EPM570GF256I5 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $46.03 | $46,03 |
| 10 | $41.43 | $414,30 |
| 100 | $36.82 | $3.682,00 |
| 500 | $32.22 | $16.110,00 |
| 1.000 | $27.62 | $27.620,00 |
EPM570GF256I5 Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on behavior of traditional PAL/GAL architecture with modern flash-based configuration memory, occupying a tier between simple SPLDs and high-density FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital semiconductor). MAX II devices specifically target glue-logic, interface bridging, and power-sequencing roles where non-volatility, fast I/O, and deterministic timing matter more than raw logic density.
Key features of the EPM570GF256I5 include a 1.71 V to 1.89 V internal core supply (MultiVolt core supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V I/O standards), 8 Kbits of user flash memory (UFM) for parameter storage, 5.4 ns tPD, an industrial operating temperature range of -40 °C to 100 °C, and MultiVolt I/O support for mixed-voltage designs. The instant-on, non-volatile architecture eliminates external configuration memory, simplifying board layout and reducing BOM cost.
The EPM570GF256I5 uses a MultiVolt core combined with a flash-based configuration array that retains state across power cycles. Its 160 user I/Os are organized into multiple I/O banks supporting 1.5 V through 3.3 V LVCMOS/LVTTL interfaces, allowing direct connection to modern processors, ASICs, and memory without level shifters. The 256-ball FineLine BGA package supports high-density board routing while keeping the silicon footprint compact.
Typical applications include bus-interface bridging (e.g., parallel-to-LVDS glue logic), power-up/power-down sequencing for multi-rail systems, I/O expansion and protocol translation, control logic for industrial automation, and LED display drivers. The wide I/O count and fast tPD make it ideal for replacing multiple 74-series logic gates with a single programmable device.
When designing with the EPM570GF256I5, ensure that the FBGA-256 land pattern matches the Intel/Altera recommended footprint and that JTAG chain access is preserved for in-system programming. Decoupling capacitors should be placed close to each supply pin to suppress switching-induced noise on the internal core rail.
This page synthesizes distributor pricing, MAX II family cross-references, and practical design notes not consolidated on any single manufacturer or distributor page, making it a one-stop reference for engineers evaluating the EPM570GF256I5 against newer MAX V, MAX 10, or small-density Cyclone alternatives.
Drop-in-Alternativen für EPM570GF256I5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM570GF256I5 (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, RoHS Status, Programming Interface, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM570GF256C5N
✅ Drop-In✓ Auf Lager
$17.95 / Stück
Datenblatt ansehen →EPM570GF256C5
✅ Drop-In✓ Auf Lager
$18.95 / Stück
Datenblatt ansehen →EPM570GF256-5N
✅ Drop-In✓ Auf Lager
$31.2 / Stück
Datenblatt ansehen →EPM570F256I5N
✅ Drop-In✓ Auf Lager
$19.85 / Stück
Datenblatt ansehen →EPM570FGF256I5N
✅ Drop-In✓ Auf Lager
$19.8 / Stück
Datenblatt ansehen →EPM570GF256C4N
✅ Drop-In✓ Auf Lager
$9.45 / Stück
Datenblatt ansehen →EPM570GF256I5 Grenzwerte & elektrische Eigenschaften
| Family | MAX II |
| Device Type | CPLD - Complex Programmable Logic Device |
| Logic Elements | 570 |
| Equivalent Macrocells | 440 |
| Number of I/O | 160 |
| Propagation Delay tPD (max) | 5.4 ns |
| User Flash Memory (UFM) | 8 Kbits |
| Programmable Type | In System Programmable |
| Non-Volatile Memory | Yes (Flash-based) |
| Internal Supply Voltage | 1.71 V to 1.89 V |
| I/O Standards Supported | LVTTL, LVCMOS 1.5/1.8/2.5/3.3 V |
| Betriebstemperaturbereich | -40 °C to 100 °C (Industrial) |
| Gehäuse | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Montageart | Surface Mount |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Process Technology | 0.18 µm 6-layer-metal flash CMOS |
| RoHS-Status | Lead-free (per FindIC listing) |
EPM570GF256I5 256-ball fbga (fineline bga), 17 x 17 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EPM570GF256I5 (256-ball fbga (fineline bga), 17 x 17 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM570GF256I5.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM570GF256I5 ist geeignet für 6 Anwendungs: Bus Interface Bridging, Power-Up and Power-Down Sequencing, I/O Expansion and Protocol Translation, Industrial Control Logic, LED Display Driver / Multiplexer, Test and Measurement Front-End.
Bus Interface Bridging
The EPM570GF256I5 excels at bridging asynchronous bus interfaces - for example, an 8-bit parallel microcontroller bus to a 16-bit SDRAM, or a legacy 5 V peripheral bus to a modern 1.8 V processor. Its 160 user I/Os in a 256-ball FBGA package provide ample connections for both buses plus control and handshake signals, while the 5.4 ns tPD ensures no added wait-states. The non-volatile, instant-on flash architecture means no boot configuration time, so bridging logic is ready at power-up - critical for systems where the host CPU expects the bridge to be live before main code execution. MultiVolt I/O supports direct 1.5 V to 3.3 V interfacing without external level shifters, reducing BOM cost and board area.
Empfohlen
Power-Up and Power-Down Sequencing
Power-sequencing controllers built from discrete RC timers and logic gates are bulky, slow, and inflexible. The EPM570GF256I5 replaces this with a single non-volatile CPLD that monitors multiple voltage rails via comparators or simple ADC front-ends, asserting enable signals in a programmable order with millisecond-precision delays. The 8 Kbit User Flash Memory stores sequencing profiles (timing, thresholds, fault actions) across power cycles without external EEPROM. Industrial -40 to +100 C operation supports deployment in automotive under-hood, telecom base-station, and factory-floor DC/DC systems where cold-crank and thermal stress would corrupt a discrete analog sequencer.
Empfohlen
I/O Expansion and Protocol Translation
Microcontrollers and SoCs are often I/O-constrained; the EPM570GF256I5 expands a 32-pin MCU into 160 user I/Os while translating between protocols (SPI-to-parallel, I2C-to-GPIO, UART-to-LVDS). Its 5.4 ns tPD preserves deterministic timing required for high-speed SPI peripherals, and MultiVolt I/O banks allow direct connection to both 1.8 V MCUs and 3.3 V peripherals in the same design. The 570 logic elements support complex state machines for protocols like I2S, S/PDIF, or SMBus without external logic. JTAG boundary-scan testability simplifies production-board testing of complex I/O nets.
Empfohlen
Industrial Control Logic
Factory-automation controllers, PLCs, and motor-drive front-ends demand industrial-temperature, deterministic logic glue. The EPM570GF256I5's -40 to +100 C industrial rating and 5.4 ns tPD make it ideal for encoder decoding, limit-switch debouncing, PWM generation, and safety-interlock logic in industrial control cabinets. Its 160 user I/Os can absorb all front-panel buttons, LEDs, and field-bus signals in a mid-sized PLC, eliminating the multi-CPLD cascade common in legacy designs. The flash-based non-volatile configuration survives brown-outs and ESD events that would corrupt SRAM-based FPGAs.
Empfohlen
LED Display Driver / Multiplexer
Large LED matrix displays (scoreboards, transit signs, video walls) require fast row-multiplexing and constant-current PWM control. The EPM570GF256I5 drives 160 outputs simultaneously, scanning 16+ rows of LEDs with refresh rates exceeding 1 kHz to eliminate visible flicker. Its 570 LE accommodate gray-scale PWM generators, gamma-correction tables stored in UFM, and fault-detection state machines that watch for shorted or open LED columns. The instant-on characteristic means display startup is immediate, unlike FPGAs which wait for configuration download.
Empfohlen
Test and Measurement Front-End
Bench-top instruments - oscilloscopes, logic analyzers, programmable power supplies - need flexible front-end switching, attenuation, and signal conditioning. The EPM570GF256I5 provides 160 reconfigurable I/Os to multiplex relays, attenuators, and reference voltages under host control. The 8 Kbit UFM stores calibration tables, attenuator compensation coefficients, and instrument-state presets. Industrial temperature range supports use in outdoor field-test equipment. JTAG boundary-scan allows ATE integration for production test.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM570GF256I5 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM570GF256C5N | EPM570GF256C5 | EPM570GF256-5N | EPM570F256I5N | EPM570FGF256I5N | EPM570GF256C4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FBGA (17 x 17 mm, 1.0 mm pitch) | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Equivalent Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/Os | 160 | 160 | 160 | 160 | 160 | 160 | 160 |
| tPD (max) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 7.0 ns (speed grade -4) |
| Operating Temperature | -40 to +100 C (Industrial) | 0 to +85 C (Commercial) | 0 to +85 C (Commercial) | Generic (verify) | -40 to +100 C (Industrial) | -40 to +100 C (Industrial) | 0 to +85 C (Commercial) |
| RoHS / Lead-Free | Lead-free (Green package) | Lead-free | Lead-free | Lead-free | Leaded (non-Green) | Lead-free (Dual Green) | Lead-free |
| Unit Price (qty 1) | $46.03 (as of 2026-09-12) | Slightly lower (commercial grade) | Slightly lower (commercial grade) | Comparable | Comparable | Comparable | Lower (slower speed grade) |
Wichtigste Unterscheidungsmerkmale
- Instant-on, non-volatile flash configuration (vs. SRAM-based small FPGAs (e.g., Cyclone IV))
- 160 user I/Os on a 256-ball FBGA, 17 x 17 mm (vs. Lower-I/O MAX II variants like EPM570F100I5N)
- Industrial -40 to +100 C operating range with green lead-free package (vs. Commercial EPM570GF256C5N variant)
- 8 Kbit User Flash Memory integrated (vs. Discretes (external EEPROM + microcontroller))
Designhinweise
The 256-ball FBGA package has 1.0 mm ball pitch - use a 4-layer PCB with 0.5 oz copper and microvia-in-pad or dog-bone fan-out routing. Place 0.1 µF decoupling capacitors on every VCCIO and VCCINT ball within 100 mils of the via. Use a continuous ground plane on layer 2 to provide a low-impedance return path for high-speed signals and to suppress simultaneous-switching noise (SSN) on the 160 I/O banks.
Estimated: with 160 user I/Os and fast 5.4 ns edge rates, simultaneous-output switching (SSO) can inject up to ~1.5 V of ground-bounce noise on the internal core. Stick to LVCMOS 3.3 V outputs where possible, limit drive strength to the minimum needed for the trace, and avoid driving more than 32 outputs simultaneously on a single I/O bank. Use IBIS models from the Intel/Altera MAX II literature for board-level SI simulation.
Do not confuse the EPM570GF256I5 (Green lead-free, industrial temp) with the EPM570F256I5 (non-Green leaded) - both share the same die and footprint, but the latter requires SnPb reflow profiles. Also note that JTAG chain ordering must place the MAX II device in the correct TDO-to-TDI position; an out-of-order chain will cause the Quartus programmer to fail at 100% with a 'chain does not match expected device ID' error.
Keep JTAG TCK, TMS, TDI, and TDO traces short (< 2 inches) and isolated from switching outputs to avoid programming failures. Route them on the bottom layer with a continuous ground plane above. The TRST# pin should be tied to VCCIO through a 10 kΩ pull-up for normal operation, or driven by the JTAG controller for advanced boundary-scan modes.
Estimated: at 50 MHz toggle rate and 50% I/O utilization, the EPM570GF256I5 draws approximately 30-40 mA from VCCINT (1.8 V) and 40-60 mA from VCCIO (3.3 V). At higher toggle rates or with all 160 I/Os switching, VCCIO current can reach 200 mA. Provide at least 100 mA of headroom beyond the steady-state estimate when sizing the 1.8 V and 3.3 V rails to handle peak switching transients.
Compliance-Informationen
Green/lead-free 256-ball FBGA package per FindIC datasheet listing. AEC-Q100 automotive qualification not stated in available data - confirm with Intel for AEC-Q100-required designs. Halogen-free status not stated in available data.
