EPM570GF256I5 - MAX II CPLD 570 LE 160 I/O FBGA-256 | Intel
MPN: EPM570GF256I5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $46.03 | $46.03 |
| 10 | $41.43 | $414.30 |
| 100 | $36.82 | $3,682.00 |
| 500 | $32.22 | $16,110.00 |
| 1,000 | $27.62 | $27,620.00 |
Drop-in alternatives for EPM570GF256I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570GF256C5N
✅ Drop-In✓ In Stock
$17.95 / Unit
View Datasheet →EPM570GF256C5
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EPM570GF256-5N
✅ Drop-In✓ In Stock
$31.2 / Unit
View Datasheet →EPM570F256I5N
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EPM570FGF256I5N
✅ Drop-In✓ In Stock
$19.8 / Unit
View Datasheet →EPM570GF256C4N
✅ Drop-In✓ In Stock
$9.45 / Unit
View Datasheet →EPM570GF256I5 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Type | CPLD - Complex Programmable Logic Device |
| Logic Elements | 570 |
| Equivalent Macrocells | 440 |
| Number of I/O | 160 |
| Propagation Delay tPD (max) | 5.4 ns |
| User Flash Memory (UFM) | 8 Kbits |
| Programmable Type | In System Programmable |
| Non-Volatile Memory | Yes (Flash-based) |
| Internal Supply Voltage | 1.71 V to 1.89 V |
| I/O Standards Supported | LVTTL, LVCMOS 1.5/1.8/2.5/3.3 V |
| Operating Temperature Range | -40 °C to 100 °C (Industrial) |
| Package | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Process Technology | 0.18 µm 6-layer-metal flash CMOS |
| RoHS Status | Lead-free (per FindIC listing) |
EPM570GF256I5 256-ball fbga (fineline bga), 17 x 17 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EPM570GF256I5 (256-ball fbga (fineline bga), 17 x 17 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570GF256I5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GF256I5 is suitable for 6 applications: Bus Interface Bridging, Power-Up and Power-Down Sequencing, I/O Expansion and Protocol Translation, Industrial Control Logic, LED Display Driver / Multiplexer, Test and Measurement Front-End.
Bus Interface Bridging
The EPM570GF256I5 excels at bridging asynchronous bus interfaces - for example, an 8-bit parallel microcontroller bus to a 16-bit SDRAM, or a legacy 5 V peripheral bus to a modern 1.8 V processor. Its 160 user I/Os in a 256-ball FBGA package provide ample connections for both buses plus control and handshake signals, while the 5.4 ns tPD ensures no added wait-states. The non-volatile, instant-on flash architecture means no boot configuration time, so bridging logic is ready at power-up - critical for systems where the host CPU expects the bridge to be live before main code execution. MultiVolt I/O supports direct 1.5 V to 3.3 V interfacing without external level shifters, reducing BOM cost and board area.
Recommended
Power-Up and Power-Down Sequencing
Power-sequencing controllers built from discrete RC timers and logic gates are bulky, slow, and inflexible. The EPM570GF256I5 replaces this with a single non-volatile CPLD that monitors multiple voltage rails via comparators or simple ADC front-ends, asserting enable signals in a programmable order with millisecond-precision delays. The 8 Kbit User Flash Memory stores sequencing profiles (timing, thresholds, fault actions) across power cycles without external EEPROM. Industrial -40 to +100 C operation supports deployment in automotive under-hood, telecom base-station, and factory-floor DC/DC systems where cold-crank and thermal stress would corrupt a discrete analog sequencer.
Recommended
I/O Expansion and Protocol Translation
Microcontrollers and SoCs are often I/O-constrained; the EPM570GF256I5 expands a 32-pin MCU into 160 user I/Os while translating between protocols (SPI-to-parallel, I2C-to-GPIO, UART-to-LVDS). Its 5.4 ns tPD preserves deterministic timing required for high-speed SPI peripherals, and MultiVolt I/O banks allow direct connection to both 1.8 V MCUs and 3.3 V peripherals in the same design. The 570 logic elements support complex state machines for protocols like I2S, S/PDIF, or SMBus without external logic. JTAG boundary-scan testability simplifies production-board testing of complex I/O nets.
Recommended
Industrial Control Logic
Factory-automation controllers, PLCs, and motor-drive front-ends demand industrial-temperature, deterministic logic glue. The EPM570GF256I5's -40 to +100 C industrial rating and 5.4 ns tPD make it ideal for encoder decoding, limit-switch debouncing, PWM generation, and safety-interlock logic in industrial control cabinets. Its 160 user I/Os can absorb all front-panel buttons, LEDs, and field-bus signals in a mid-sized PLC, eliminating the multi-CPLD cascade common in legacy designs. The flash-based non-volatile configuration survives brown-outs and ESD events that would corrupt SRAM-based FPGAs.
Recommended
LED Display Driver / Multiplexer
Large LED matrix displays (scoreboards, transit signs, video walls) require fast row-multiplexing and constant-current PWM control. The EPM570GF256I5 drives 160 outputs simultaneously, scanning 16+ rows of LEDs with refresh rates exceeding 1 kHz to eliminate visible flicker. Its 570 LE accommodate gray-scale PWM generators, gamma-correction tables stored in UFM, and fault-detection state machines that watch for shorted or open LED columns. The instant-on characteristic means display startup is immediate, unlike FPGAs which wait for configuration download.
Recommended
Test and Measurement Front-End
Bench-top instruments - oscilloscopes, logic analyzers, programmable power supplies - need flexible front-end switching, attenuation, and signal conditioning. The EPM570GF256I5 provides 160 reconfigurable I/Os to multiplex relays, attenuators, and reference voltages under host control. The 8 Kbit UFM stores calibration tables, attenuator compensation coefficients, and instrument-state presets. Industrial temperature range supports use in outdoor field-test equipment. JTAG boundary-scan allows ATE integration for production test.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GF256I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GF256C5N | EPM570GF256C5 | EPM570GF256-5N | EPM570F256I5N | EPM570FGF256I5N | EPM570GF256C4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FBGA (17 x 17 mm, 1.0 mm pitch) | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Equivalent Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/Os | 160 | 160 | 160 | 160 | 160 | 160 | 160 |
| tPD (max) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 7.0 ns (speed grade -4) |
| Operating Temperature | -40 to +100 C (Industrial) | 0 to +85 C (Commercial) | 0 to +85 C (Commercial) | Generic (verify) | -40 to +100 C (Industrial) | -40 to +100 C (Industrial) | 0 to +85 C (Commercial) |
| RoHS / Lead-Free | Lead-free (Green package) | Lead-free | Lead-free | Lead-free | Leaded (non-Green) | Lead-free (Dual Green) | Lead-free |
| Unit Price (qty 1) | $46.03 (as of 2026-09-12) | Slightly lower (commercial grade) | Slightly lower (commercial grade) | Comparable | Comparable | Comparable | Lower (slower speed grade) |
Key Differentiators
- Instant-on, non-volatile flash configuration (vs SRAM-based small FPGAs (e.g., Cyclone IV))
- 160 user I/Os on a 256-ball FBGA, 17 x 17 mm (vs Lower-I/O MAX II variants like EPM570F100I5N)
- Industrial -40 to +100 C operating range with green lead-free package (vs Commercial EPM570GF256C5N variant)
- 8 Kbit User Flash Memory integrated (vs Discretes (external EEPROM + microcontroller))
Design Notes
The 256-ball FBGA package has 1.0 mm ball pitch - use a 4-layer PCB with 0.5 oz copper and microvia-in-pad or dog-bone fan-out routing. Place 0.1 µF decoupling capacitors on every VCCIO and VCCINT ball within 100 mils of the via. Use a continuous ground plane on layer 2 to provide a low-impedance return path for high-speed signals and to suppress simultaneous-switching noise (SSN) on the 160 I/O banks.
Estimated: with 160 user I/Os and fast 5.4 ns edge rates, simultaneous-output switching (SSO) can inject up to ~1.5 V of ground-bounce noise on the internal core. Stick to LVCMOS 3.3 V outputs where possible, limit drive strength to the minimum needed for the trace, and avoid driving more than 32 outputs simultaneously on a single I/O bank. Use IBIS models from the Intel/Altera MAX II literature for board-level SI simulation.
Do not confuse the EPM570GF256I5 (Green lead-free, industrial temp) with the EPM570F256I5 (non-Green leaded) - both share the same die and footprint, but the latter requires SnPb reflow profiles. Also note that JTAG chain ordering must place the MAX II device in the correct TDO-to-TDI position; an out-of-order chain will cause the Quartus programmer to fail at 100% with a 'chain does not match expected device ID' error.
Keep JTAG TCK, TMS, TDI, and TDO traces short (< 2 inches) and isolated from switching outputs to avoid programming failures. Route them on the bottom layer with a continuous ground plane above. The TRST# pin should be tied to VCCIO through a 10 kΩ pull-up for normal operation, or driven by the JTAG controller for advanced boundary-scan modes.
Estimated: at 50 MHz toggle rate and 50% I/O utilization, the EPM570GF256I5 draws approximately 30-40 mA from VCCINT (1.8 V) and 40-60 mA from VCCIO (3.3 V). At higher toggle rates or with all 160 I/Os switching, VCCIO current can reach 200 mA. Provide at least 100 mA of headroom beyond the steady-state estimate when sizing the 1.8 V and 3.3 V rails to handle peak switching transients.
Compliance Information
Green/lead-free 256-ball FBGA package per FindIC datasheet listing. AEC-Q100 automotive qualification not stated in available data - confirm with Intel for AEC-Q100-required designs. Halogen-free status not stated in available data.
