IDTADC1010S125HN-C1 - 10-bit 125 MSPS ADC, LVDS/CMOS | Renesas
Teilenummer: IDTADC1010S125HN-C1 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.75 | $9.750,00 |
IDTADC1010S125HN-C1 Übersicht
An ADC (Analog-to-Digital Converter) is a data acquisition component which samples continuous analog signals and converts them to discrete digital codes. Within the broader IC hierarchy, this device is a pipelined ADC, a sub-family of Nyquist-rate data converters (ADC -> data converter -> signal chain IC -> semiconductor). Pipelined ADCs use a multi-stage architecture that delivers high sampling rates at low power, making them the workhorse choice for communications, imaging, and instrumentation front ends where SAR converters are too slow and flash converters are too power-hungry.
Key differentiating features of the IDTADC1010S125HN-C1 include 125 MSPS maximum sample rate, 10-bit resolution, single analog input channel, selectable CMOS / LVDS DDR output interface, and an integrated analog bandwidth suitable for IF undersampling. The part supports standby and power-down modes via the SPI control port, simplifying multi-ADC synchronization in larger systems. Its compact 40-HVQFN package keeps the PCB footprint small while the exposed pad provides a low thermal resistance path for high-temperature-grade applications.
The IDTADC1010S125HN-C1 uses a multi-bit-per-stage pipelined architecture with on-chip track-and-hold and reference, which delivers low latency and consistent dynamic performance across input frequencies. The LVDS DDR output mode halves the output bus width and reduces pin count requirements on the FPGA or ASIC receiver, which is particularly valuable in dense multi-channel receiver designs.
Typical applications for the IDTADC1010S125HN-C1 include IF signal digitization in software-defined radio, baseband sampling in wireless infrastructure, medical imaging front ends, and industrial process-control data acquisition cards. The wide analog supply range and CMOS/LVDS output flexibility let one hardware design serve both legacy 3.3 V DSP and modern 1.8 V FPGA platforms without level translators.
When designing with this device, ensure the analog input network is bandwidth-matched to the target IF or baseband frequency and that the exposed pad is soldered to a sufficiently large copper pour to meet the package thermal resistance specification. Decouple VDDA and VDDO with 100 nF ceramic capacitors placed as close as possible to the supply pins, and route LVDS pairs with controlled 100 ohm differential impedance for reliable DDR clocking.
This page synthesizes distributor pricing, drop-in alternatives from the same ADC1010S family, and practical layout notes that are not gathered together in the standalone manufacturer datasheet.
Drop-in-Alternativen für IDTADC1010S125HN-C1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit IDTADC1010S125HN-C1 (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Sampling Rate, Analog Supply Voltage (VDDA), Input Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
IDTADC1010S125HN-C1
✅ Drop-In✓ Auf Lager
$9.75 / Stück
Datenblatt ansehen →IDTADC1010S105HN-C1
✅ Drop-In✓ Auf Lager
$12.85 / Stück
Datenblatt ansehen →IDTADC1010S080HN-C1
✅ Drop-In✓ Auf Lager
$9.75 / Stück
Datenblatt ansehen →ADC1015S125HN/C1
✅ Drop-In✓ Auf Lager
$10.4 / Stück
Datenblatt ansehen →ADC1002S020HL/C1:1
✅ Drop-In✓ Auf Lager
$4.27 / Stück
Datenblatt ansehen →IDTADC1010S125HN-C1 Grenzwerte & elektrische Eigenschaften
| Auflösung | 10 bits |
| Number of Channels | 1 |
| Abtastrate | 125 MSPS |
| Architecture | Pipelined |
| Analog Supply Voltage (VDDA) | 2.85 V to 3.4 V |
| Digital Supply Voltage (VDDO) | 1.65 V to 3.6 V |
| Output Interface | CMOS or LVDS DDR (selectable) |
| Input Type | Single-ended analog (per datasheet) |
| Gehäuse | 40-pin HVQFN (6x6 mm) with exposed thermal pad |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 C to +85 C |
| Storage Temperature | -55 C to +125 C |
| Junction Temperature (max) | 125 C |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
IDTADC1010S125HN-C1 Pin-Konfiguration
| Pin 1 | AIN — Analog input (single-ended, per datasheet) |
| Pin 2 | VCM — Common-mode voltage bypass |
| Pin 3 | VDDA — Analog supply, 2.85 V to 3.4 V |
| Pin 4 | GND — Analog ground |
| Pin 5 | REFT — Top reference decoupling |
| Pin 6 | REFB — Bottom reference decoupling |
| Pin 7 | VDDA — Analog supply |
| Pin 8 | GND — Ground |
| Pin 9 | CLK — Sampling clock input |
| Pin 10 | CLK_N — Complementary clock (LVDS mode) |
| Pin 11 | VDDO — Digital supply, 1.65 V to 3.6 V |
| Pin 12 | D9 — CMOS data output D9 (MSB) / LVDS D8_D9_P |
| Pin 13 | D8 — CMOS data output D8 / LVDS D8_D9_M |
| Pin 14 | D7 — CMOS data output D7 / LVDS D6_D7_P |
| Pin 15 | D6 — CMOS data output D6 / LVDS D6_D7_M |
| Pin 16 | D5 — CMOS data output D5 / LVDS D4_D5_P |
| Pin 17 | D4 — CMOS data output D4 / LVDS D4_D5_M |
| Pin 18 | D3 — CMOS data output D3 / LVDS D2_D3_P |
| Pin 19 | D2 — CMOS data output D2 / LVDS D2_D3_M |
| Pin 20 | D1 — CMOS data output D1 / LVDS D0_D1_P |
| Pin 21 | D0 — CMOS data output D0 (LSB) / LVDS D0_D1_M |
| Pin 22 | VDDO — Digital supply |
| Pin 23 | GND — Digital ground |
| Pin 24 | DRDY — Data ready / output clock (LVDS CLKOUT_P/M) |
| Pin 25 | DRDY_N — Complementary data ready (LVDS) |
| Pin 26 | CS_N — SPI chip select (active low) |
| Pin 27 | SCLK — SPI serial clock |
| Pin 28 | SDIO — SPI serial data I/O |
| Pin 29 | SDO — SPI serial data out |
| Pin 30 | PD_N — Power-down (active low) |
| Pin 31 | STBY_N — Standby (active low) |
| Pin 32 | MODE — Output mode select (CMOS or LVDS DDR) |
| Pin 33 | RESET_N — Reset (active low) |
| Pin 34 | VDDO — Digital supply |
| Pin 35 | GND — Ground |
| Pin 36 | TEST1 — Factory test pin (tie to GND) |
| Pin 37 | TEST2 — Factory test pin (tie to GND) |
| Pin 38 | TEST3 — Factory test pin (tie to GND) |
| Pin 39 | TEST4 — Factory test pin (tie to GND) |
| Pin 40 | NC — Not connected (per datasheet) |
Typische Anwendungen
IDTADC1010S125HN-C1 ist geeignet für 6 Anwendungs: Software-Defined Radio (SDR) IF Digitization, Wireless Infrastructure Baseband Sampling, Medical Imaging Front End, Industrial Process-Control Data Acquisition, High-Speed Test & Measurement Instrumentation, Radar & Lidar Signal Acquisition.
Software-Defined Radio (SDR) IF Digitization
The IDTADC1010S125HN-C1 digitizes intermediate-frequency (IF) signals in software-defined radio receivers, where the 125 MSPS sample rate comfortably captures IF bandwidths up to ~50 MHz while the 10-bit resolution is sufficient for demodulation after digital filtering. The selectable LVDS DDR output mode lets the converter feed a modern 1.8 V FPGA directly over a 100 ohm differential bus without level shifters, minimizing board area. Placed between the IF mixer and the FPGA DSP fabric, it replaces legacy discrete demodulator ASICs and enables firmware-only protocol updates across cellular, public-safety, and amateur-radio platforms.
Empfohlen
Wireless Infrastructure Baseband Sampling
In small-cell and pico-cell base-station designs the IDTADC1010S125HN-C1 samples baseband I/Q after the analog front-end, providing the digital stream to the baseband processor. Its 1.65-3.6 V digital supply directly interfaces with 1.8 V DSP and FPGA logic, while the 3.0 V analog rail preserves full-scale SNR at the antenna interface. The exposed-pad 40-HVQFN package allows dense placement next to RF transceivers, and the CMOS/LVDS output option lets the same board design target either ASIC or FPGA back ends. Compared with a switching-supply-driven sampling chain, it adds no switching noise to the RF signal path.
Empfohlen
Medical Imaging Front End
The IDTADC1010S125HN-C1 is used in ultrasound and other medical imaging front ends where moderate resolution at high speed is needed. Its 125 MSPS sample rate combined with 10-bit resolution matches the dynamic range of pre-beamformed RF echo data, while the small 40-HVQFN footprint lets designers place many channels close to the transducer array. The LVDS DDR output reduces the pin count to the FPGA image processor and minimizes crosstalk in dense multi-channel probe heads. Industrial -40 to +85 C ambient rating supports portable diagnostic equipment used outside clinical environments.
Empfohlen
Industrial Process-Control Data Acquisition
For industrial process-control cards the IDTADC1010S125HN-C1 offers 125 MSPS sampling with 10-bit accuracy, allowing high-bandwidth vibration, acoustic-emission, and transient-event capture. The split analog/digital supply rails (2.85-3.4 V / 1.65-3.6 V) provide noise isolation from noisy 24 V backplanes that power industrial PLCs. The exposed-pad HVQFN package survives -40 to +85 C factory-floor ambient temperatures while occupying a small board footprint, and the LVDS output option drives long backplane traces to a centralized FPGA without signal degradation. It replaces slower SAR ADCs when oversampling-based gain is needed.
Empfohlen
High-Speed Test & Measurement Instrumentation
Bench-top oscilloscopes, spectrum analyzers, and digitizers use the IDTADC1010S125HN-C1 to capture repetitive and single-shot transients up to the 50 MHz Nyquist band. The pipelined architecture provides low sample-to-sample latency, important for triggering and time-domain analysis, while the LVDS DDR outputs stream data to an FPGA-based time-interleaved DSP pipeline. The 40-HVQFN package keeps the analog front-end PCB compact, and the selectable CMOS mode offers a low-cost interface to legacy 3.3 V ASICs. Industrial-grade temperature rating suits laboratory and field-deployed instruments.
Empfohlen
Radar & Lidar Signal Acquisition
Automotive and industrial radar/lidar receivers use the IDTADC1010S125HN-C1 to digitize baseband or low-IF outputs from the RF front-end at 125 MSPS. Its pipelined core provides deterministic latency for time-of-flight calculations, while the LVDS DDR outputs feed FPGAs that perform FFT and target detection. The compact 6x6 mm HVQFN package allows dense placement behind multi-element antenna arrays, and the -40 to +85 C rating supports outdoor automotive and roadside deployments. CMOS-mode operation also enables low-cost entry-level designs targeting fixed installations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für IDTADC1010S125HN-C1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | IDTADC1010S105HN-C1 | IDTADC1010S080HN-C1 | ADC1015S125HN/C1 | ADC1002S020HL/C1:1 |
|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 40-HVQFN (6x6) | 40-HVQFN (6x6) - same | 40-HVQFN (6x6) - same | 40-HVQFN (6x6) - same family | 40-HVQFN - same family |
| Resolution | 10 bits | 10 bits - same | 10 bits - same | 15 bits (+5 bits) | 10 bits - same |
| Sampling Rate | 125 MSPS | 105 MSPS (-16%) | 80 MSPS (-36%) | 125 MSPS - same | 20 MSPS (-84%, not drop-in) |
| Output Interface | CMOS or LVDS DDR | CMOS or LVDS DDR - same | CMOS or LVDS DDR - same | CMOS or LVDS DDR - same family | CMOS - similar |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C - same | -40 C to +85 C - same | -40 C to +85 C - same family | -40 C to +85 C - same family |
Wichtigste Unterscheidungsmerkmale
- Higher sample rate within the 10-bit ADC1010S family (vs. IDTADC1010S105HN-C1)
- Selectable CMOS or LVDS DDR output in one part (vs. ADC1002S020HL/C1:1)
- Industrial temperature grade in the smallest package (vs. ADC1613S125HN-C1)
Designhinweise
Estimated: route the analog input trace as a 50 ohm controlled-impedance microstrip and place the input anti-alias RC network within 5 mm of the AIN pin. Keep digital CMOS/LVDS output traces away from the analog input trace by at least 3 line widths to maintain SNR. The exposed thermal pad of the 40-HVQFN must be soldered to a continuous ground copper pour (at least 100 mm^2) to achieve the datasheet thermal resistance.
Estimated: place 100 nF ceramic decoupling capacitors as close as possible to each VDDA and VDDO pin, with an additional 10 uF bulk tantalum or ceramic capacitor on each supply rail within 10 mm of the IC. Use a ferrite bead or pi-filter to isolate VDDA from the digital supply VDDO, since switching noise on VDDO can couple through the substrate and degrade ADC SNR. Follow the datasheet power-up sequencing: drive VDDA first, then VDDO, then apply the sampling clock.
Estimated: drive the CLK input with a low-jitter, fast-edge clock source such as the AD9516-0 or a dedicated LVDS clock buffer; clock jitter of 1 ps rms directly limits SNR according to SNR = 6.02*N + 1.76 + 10*log10(Fs/2*pi*Fjitter). Route LVDS DDR output pairs as 100 ohm differential microstrip with matched length (skew less than 25 ps within a pair, less than 50 ps between pairs) to preserve setup/hold margin at the receiver FPGA.
Common pitfalls include: (1) forgetting to solder the exposed thermal pad, which causes the junction to exceed 125 C and triggers thermal shutdown; (2) leaving TEST1-TEST4 pins floating - tie them to GND per the datasheet; (3) applying the sampling clock before VDDA is stable, which can cause startup transients that bias the internal reference; (4) using the CMOS output mode with VDDO = 1.8 V without verifying the receiver FPGA supports 1.8 V LVCMOS levels - many FPGAs require 2.5 V minimum on certain banks.
Compliance-Informationen
RoHS and lead-free status per Renesas product page; AEC-Q100 automotive qualification not stated in the provided data; halogen-free status not specified in the provided data.
